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| ST10F269 16-BIT MCU WITH MAC UNIT, 256K BYTE FLASH MEMORY AND 12K BYTE RAM PRELIMINARY DATA s s s s s s s s s HIGH PERFORMANCE 40MHz CPU WITH DSP FUNCTION - 16-BIT CPU WITH 4-STAGE PIPELINE - 50ns INSTRUCTION CYCLE TIME AT 40MHz MAX CPU CLOCK - MULTIPLY/ACCUMULATE UNIT (MAC) 16 x 16-BIT MULTIPLICATION, 40-BIT ACCUMULATOR - REPEAT UNIT - ENHANCED BOOLEAN BIT MANIPULATION FACILITIES - ADDITIONAL INSTRUCTIONS TO SUPPORT HLL AND OPERATING SYSTEMS - SINGLE-CYCLE CONTEXT SWITCHING SUPPORT MEMORY ORGANIZATION - 256K BYTE ON-CHIP FLASH MEMORY SINGLE VOLTAGE WITH ERASE/PROGRAM CONTROLLER. - 100K ERASING/PROGRAMMING CYCLES. - UP TO 16M BYTE LINEAR ADDRESS SPACE FOR CODE AND DATA (5M BYTES WITH CAN) - 2K BYTE ON-CHIP INTERNAL RAM (IRAM) - 10K BYTE ON-CHIP EXTENSION RAM (XRAM) FAST AND FLEXIBLE BUS - PROGRAMMABLE EXTERNAL BUS CHARACTERISTICS FOR DIFFERENT ADDRESS RANGES - 8-BIT OR 16-BIT EXTERNAL DATA BUS - MULTIPLEXED OR DEMULTIPLEXED EXTERNAL ADDRESS/DATA BUSES - FIVE PROGRAMMABLE CHIP-SELECT SIGNALS - HOLD-ACKNOWLEDGE BUS ARBITRATION SUPPORT INTERRUPT - 8-CHANNEL PERIPHERAL EVENT CONTROLLER FOR SINGLE CYCLE INTERRUPT DRIVEN DATA TRANSFER - 16-PRIORITY-LEVEL INTERRUPT SYSTEM WITH 56 SOURCES, SAMPLING RATE DOWN TO 25ns TIMERS - TWO MULTI-FUNCTIONAL GENERAL PURPOSE TIMER UNITS WITH 5 TIMERS TWO 16-CHANNEL CAPTURE / COMPARE UNITS A/D CONVERTER - 16-CHANNEL 10-BIT - 4.85s CONVERSION TIME AT 40MHz CPU CLOCK 4-CHANNEL PWM UNIT SERIAL CHANNELS - SYNCHRONOUS / ASYNCHRONOUS SERIAL CHANNEL - HIGH-SPEED SYNCHRONOUS CHANNEL PQFP144 (28 x 28 mm) (Plastic Quad Flat Pack) ORDER CODE: ST10F269-Q3 s s s s s s s s s s TWO CAN 2.0B INTERFACES OPERATING ON ONE OR TWO CAN BUSSES (30 OR 2x15 MESSAGE OBJECTS) FAIL-SAFE PROTECTION - PROGRAMMABLE WATCHDOG TIMER - OSCILLATOR WATCHDOG ON-CHIP BOOTSTRAP LOADER CLOCK GENERATION - ON-CHIP PLL - DIRECT OR PRESCALED CLOCK INPUT REAL TIME CLOCK UP TO 111 GENERAL PURPOSE I/O LINES - INDIVIDUALLY PROGRAMMABLE AS INPUT, OUTPUT OR SPECIAL FUNCTION - PROGRAMMABLE THRESHOLD (HYSTERESIS) IDLE AND POWER DOWN MODES SINGLE VOLTAGE SUPPLY: 5V 10% (EMBEDDED REGULATOR FOR 3.3 V CORE SUPPLY). TEMPERATURE RANGE: -40 +125C 144-PIN PQFP PACKAGE 32 256K Byte Flash Memory CPU-Core and MAC Unit 16 16 2K Byte Internal RAM 16 10K Byte XRAM PEC W atchdog Oscillator and PLL CAN1_RXD CAN1_TXD CAN2_RXD CAN2_TXD CAN1 Interrupt Controller CAN2 16 XT AL1 3.3V XT AL2 Voltage Regulator Port 4 Port 1 Port 0 GPT1 ASC usart CAPCOM2 10-Bit ADC PWM 16 External Bus Controller CAPCOM1 SSC GPT2 16 Port 2 8 16 BRG Port 3 15 BRG Port 7 8 Port 8 8 Port 6 8 Port 5 16 June 2002 This is advance information on a new product now in development or undergoing evaluation. Details are subject to change without notice. 1/160 ST10F269 TABLE OF CONTENTS 123455.1 5.2 5.3 5.3.1 5.3.2 5.3.3 5.3.4 5.3.5 5.3.6 5.3.7 5.4 5.5 5.5.1 5.5.2 5.5.3 5.6 5.6.1 5.6.2 5.6.3 5.6.4 5.6.5 66.1 6.1.1 6.1.1.1 6.1.1.2 6.1.1.3 6.2 6.3 77.1 7.2 INTRODUCTION ........................................................................................................ PIN DATA ................................................................................................................... FUNCTIONAL DESCRIPTION ................................................................................... MEMORY ORGANIZATION ....................................................................................... INTERNAL FLASH MEMORY ................................................................................... OVERVIEW ................................................................................................................ OPERATIONAL OVERVIEW ...................................................................................... ARCHITECTURAL DESCRIPTION ............................................................................ Read Mode ................................................................................................................. Command Mode ......................................................................................................... Ready/Busy Signal ..................................................................................................... Flash Status Register ................................................................................................. Flash Protection Register ........................................................................................... Instructions Description .............................................................................................. Reset Processing and Initial State .............................................................................. FLASH MEMORY CONFIGURATION ........................................................................ APPLICATION EXAMPLES ....................................................................................... Handling of Flash Addresses ...................................................................................... Basic Flash Access Control ........................................................................................ Programming Examples ............................................................................................. BOOTSTRAP LOADER ............................................................................................ Entering the Bootstrap Loader .................................................................................... Memory Configuration After Reset ............................................................................. Loading the Startup Code ........................................................................................... Exiting Bootstrap Loader Mode .................................................................................. Choosing the Baud Rate for the BSL ......................................................................... CENTRAL PROCESSING UNIT (CPU) ..................................................................... MULTIPLIER-ACCUMULATOR UNIT (MAC) ............................................................. Features ..................................................................................................................... Enhanced Addressing Capabilities .............................................................................. Multiply-Accumulate Unit ............................................................................................. Program Control .......................................................................................................... INSTRUCTION SET SUMMARY ................................................................................ MAC COPROCESSOR SPECIFIC INSTRUCTIONS ................................................. EXTERNAL BUS CONTROLLER .............................................................................. PROGRAMMABLE CHIP SELECT TIMING CONTROL ............................................ READY PROGRAMMABLE POLARITY ..................................................................... PAGE 6 7 13 14 17 17 17 19 19 19 19 19 21 21 25 25 25 25 26 27 30 30 31 32 32 33 34 35 36 36 36 36 37 38 42 42 42 2/160 ST10F269 TABLE OF CONTENTS 88.1 8.2 8.3 8.4 910 10.1 10.2 11 12 12.1 12.2 12.2.1 12.2.2 12.2.3 12.2.4 12.3 12.3.1 12.4 12.4.1 12.5 12.5.1 12.6 12.6.1 12.7 12.7.1 12.8 12.8.1 12.8.2 12.9 12.9.1 12.10 12.10.1 12.11 12.11.1 INTERRUPT SYSTEM ............................................................................................... EXTERNAL INTERRUPTS ......................................................................................... INTERRUPT REGISTERS AND VECTORS LOCATION LIST .................................. INTERRUPT CONTROL REGISTERS ....................................................................... EXCEPTION AND ERROR TRAPS LIST ................................................................... CAPTURE/COMPARE (CAPCOM) UNITS ................................................................ GENERAL PURPOSE TIMER UNIT .......................................................................... GPT1 .................................................................................................................... ...... GPT2 .......................................................................................................................... PWM MODULE .......................................................................................................... PARALLEL PORTS ................................................................................................... INTRODUCTION ........................................................................................................ I/O'S SPECIAL FEATURES ....................................................................................... Open Drain Mode ....................................................................................................... Input Threshold Control ............................................................................................ Output Driver Control ................................................................................................ Alternate Port Functions ............................................................................................. PORT0 ........................................................................................................................ Alternate Functions of PORT0 .................................................................................... PORT1 ........................................................................................................................ Alternate Functions of PORT1 .................................................................................... PORT 2 ....................................................................................................................... Alternate Functions of Port 2 ...................................................................................... PORT 3 ....................................................................................................................... Alternate Functions of Port 3 ...................................................................................... PORT 4 ....................................................................................................................... Alternate Functions of Port 4 ...................................................................................... PORT 5 ....................................................................................................................... Alternate Functions of Port 5 ...................................................................................... Port 5 Schmitt Trigger Analog Inputs .......................................................................... PORT 6 ....................................................................................................................... Alternate Functions of Port 6 ...................................................................................... PORT 7 ....................................................................................................................... Alternate Functions of Port 7 ...................................................................................... PORT 8 ....................................................................................................................... Alternate Functions of Port 8 ...................................................................................... PAGE 44 44 45 46 47 48 51 51 52 54 55 55 57 57 57 58 60 61 62 64 64 66 66 69 70 73 74 77 78 79 79 80 83 84 87 88 3/160 ST10F269 TABLE OF CONTENTS 13 14 14.1 14.1.1 14.1.2 14.2 15 15.1 15.1.1 15.1.2 15.2 16 16.1 16.1.1 16.1.2 16.1.3 16.1.4 16.1.5 16.2 17 18 18.1 18.1.1 18.1.2 18.1.3 18.2 18.3 18.4 18.5 18.5.1 18.5.2 18.5.3 18.6 19 19.1 19.2 19.2.1 19.2.2 4/160 PAGE 90 91 91 91 93 95 97 97 97 97 97 99 100 100 101 101 102 103 103 105 107 107 10 7 108 109 109 110 110 111 111 111 111 111 114 114 114 114 114 A/D CONVERTER ...................................................................................................... SERIAL CHANNELS ................................................................................................. ASYNCHRONOUS / SYNCHRONOUS SERIAL INTERFACE (ASCO) .................... ASCO in Asynchronous Mode .................................................................................... ASCO in Synchronous Mode ...................................................................................... HIGH SPEED SYNCHRONOUS SERIAL CHANNEL (SSC) ..................................... CAN MODULES ......................................................................................................... CAN MODULES MEMORY MAPPING ...................................................................... CAN1 .................................................................................................................. ........ CAN2 .................................................................................................................. ........ CAN BUS CONFIGURATIONS .................................................................................. REAL TIME CLOCK .................................................................................................. RTC REGISTERS ...................................................................................................... RTCCON: RTC Control Register ................................................................................ RTCPH & RTCPL: RTC PRESCALER Registers ....................................................... RTCDH & RTCDL: RTC DIVIDER Counters .............................................................. RTCH & RTCL: RTC Programmable COUNTER Registers ....................................... RTCAH & RTCAL: RTC ALARM Registers ................................................................ PROGRAMMING THE RTC ....................................................................................... WATCHDOG TIMER .................................................................................................. SYSTEM RESET ........................................................................................................ LONG HARDWARE RESET ...................................................................................... Asynchronous Reset .................................................................................................. Synchronous Reset (RSTIN pulse > 1040TCL and RPD pin at high level) ................ Exit of Long Hardware Reset ...................................................................................... SHORT HARDWARE RESET .................................................................................... SOFTWARE RESET .................................................................................................. WATCHDOG TIMER RESET ..................................................................................... RSTOUT, RSTIN, BIDIRECTIONAL RESET ............................................................ RSTOUT Pin ............................................................................................................... Bidirectional Reset ...................................................................................................... RSTIN pin ................................................................................................................... RESET CIRCUITRY ................................................................................................... POWER REDUCTION MODES ................................................................................. IDLE MODE ................................................................................................................ POWER DOWN MODE .............................................................................................. Protected Power Down Mode ..................................................................................... Interruptable Power Down Mode ................................................................................ ST10F269 TABLE OF CONTENTS 20 20.1 20.2 21 21.1 21.2 21.3 21.3.1 21.3.2 21.4 21.4.1 21.4.2 21.4.3 21.4.4 21.4.5 21.4.6 21.4.7 21.4.8 21.4.9 21.4.10 21.4.11 21.4.12 21.4.13 21.4.14 21.4.14.1 21.4.14.2 22 23 SPECIAL FUNCTION REGISTER OVERVIEW ......................................................... IDENTIFICATION REGISTERS ................................................................................. SYSTEM CONFIGURATION REGISTERS ................................................................ ELECTRICAL CHARACTERISTICS ......................................................................... ABSOLUTE MAXIMUM RATINGS ............................................................................. PARAMETER INTERPRETATION ............................................................................. DC CHARACTERISTICS ........................................................................................... A/D Converter Characteristics .................................................................................... Conversion Timing Control ....................................................................................... AC CHARACTERISTICS ............................................................................................ Test Waveforms ....................................................................................................... Definition of Internal Timing ........................................................................................ Clock Generation Modes ............................................................................................ Prescaler Operation .................................................................................................... Direct Drive ................................................................................................................. Oscillator Watchdog (OWD) ....................................................................................... Phase Locked Loop .................................................................................................... External Clock Drive XTAL1 ....................................................................................... Memory Cycle Variables ............................................................................................. Multiplexed Bus .......................................................................................................... Demultiplexed Bus ...................................................................................................... CLKOUT and READY ................................................................................................. External Bus Arbitration .............................................................................................. High-Speed Synchronous Serial Interface (SSC) Timing ........................................... Master Mode................................................................................................................ Slave mode.................................................................................................................. PACKAGE MECHANICAL DATA ........................................................................... PAGE 117 123 124 131 131 131 131 134 135 136 136 136 137 138 138 138 138 139 140 141 147 153 155 157 157 158 159 159 ORDERING INFORMATION ...................................................................................... 5/160 ST10F269 1 - INTRODUCTION The ST10F269 is a derivative of the STMicroelectronics ST10 family of 16-bit single-chip CMOS microcontrollers. It combines high CPU performance (up to 20 million instructions per second) with high peripheral functionality and enhanced I/O-capabilities. It also provides on-chip high-speed single voltage Flash memory, on-chip high-speed RAM, and clock generation via PLL. ST10F269 is processed in 0.35m CMOS technology. The MCU core and the logic is supplied with a 5V to 3.3V on chip voltage regulator. The part is supplied with a single 5V supply and I/Os work at 5V. The device is upward compatible with the ST10F168 device, with the following set of differences: - The Multiply/Accumulate unit is available as standard. This MAC unit adds powerful DSP functions to the ST10 architecture, but maintains full compatibility for existing code. - Flash control interface is now based on STMicroelectronics third generation of stand-alone Flash memories, with an embedded Erase/Program Controller. This completely Figure 1 : Logic Symbol VDD DC1 DC2 VSS - - - - - - - frees up the CPU during programming or erasing the Flash. Two dedicated pins (DC1 and DC2) on the PQFP-144 package are used for decoupling the internally generated 3.3V core logic supply. Do not connect these two pins to 5.0V external supply. Instead, these pins should be connected to a decoupling capacitor (ceramic type, value 330 nF). The A/D Converter characteristics are different from previous ST10 derivatives ones. Refer to Section 21.3.1 - A/D Converter Characteristics. The AC and DC parameters are adapted to the 40MHz maximum CPU frequency. The characterization is performed with CL = 50pF max on output pins. Refer to Section 21.3 DC Characteristics. In order to reduce EMC, the rise/fall time and the sink/source capability of the drivers of the I/O pads are programmable. Refer to Section 12.2 I/ O's Special Features. The Real Time Clock functionnality is added. The external interrupt sources can be selected with the EXISEL register. The reset source is identified by a dedicated status bit in the WDTCON register. XTAL1 XTAL2 RSTIN RSTOUT RPD VAREF VAGND NMI EA READY ALE RD WR/WRL Port 5 16-bit ST10F269 Port 0 16-bit Port 1 16-bit Port 2 16-bit Port 3 15-bit Port 4 8-bit Port 6 8-bit Port 7 8-bit Port 8 8-bit 6/160 2 - PIN DATA Figure 2 : Pin Configuration (top view) VAREF VAGND P5.10/AN10/T6EUD P5.11/AN11/T5EUD P5.12/AN12/T6IN P5.13/AN13/T5IN P5.14/AN14/T4EUD P5.15/AN15/T2EUD VSS VDD P2.0/CC0IO P2.1/CC1IO P2.2/CC2IO P2.3/CC3IO P2.4/CC4IO P2.5/CC5IO P2.6/CC6IO P2.7/CC7IO VSS DC1 P2.8/CC8IO/EX0IN P2.9/CC9IO/EX1IN P2.10/CC10IOEX2IN P2.11/CC11IOEX3IN P2.12/CC12IO/EX4IN P2.13/CC13IO/EX5IN P2.14/CC14IO/EX6IN P2.15/CC15IO/EX7IN/T7IN P3.0/T0IN P3.1/T6OUT P3.2/CAPIN P3.3/T3OUT P3.4/T3EUD P3.5/T4IN VSS VDD 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 P6.0/CS0 P6.1/CS1 P6.2/CS2 P6.3/CS3 P6.4/CS4 P6.5/HOLD P6.6/HLDA P6.7/BREQ P8.0/CC16IO P8.1/CC17IO P8.2/CC18IO P8.3/CC19IO P8.4/CC20IO P8.5/CC21IO P8.6/CC22IO P8.7/CC23IO DC2 VSS P7.0/POUT0 P7.1/POUT1 P7.2/POUT2 P7.3/POUT3 P7.4/CC28I0 P7.5/CC29I0 P7.6/CC30I0 P7.7/CC31I0 P5.0/AN0 P5.1/AN1 P5.2/AN2 P5.3/AN3 P5.4/AN4 P5.5/AN5 P5.6/AN6 P5.7/AN7 P5.8/AN8 P5.9/AN9 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 ST10F269-Q3 144 143 142 141 140 139 138 137 136 135 134 133 132 131 130 129 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 VDD VSS NMI RSTOUT RSTIN VSS XTAL1 XTAL2 VDD P1H.7/A15/CC27IO P1H.6/A14/CC26IO P1H.5/A13/CC25IO P1H.4/A12/CC24IO P1H.3/A11 P1H.2/A10 P1H.1/A9 P1H.0/A8 VSS VDD P1L.7/A7 P1L.6/A6 P1L.5/A5 P1L.4/A4 P1L.3/A3 P1L.2/A2 P1L.1/A1 P1L.0/A0 P0H.7/AD15 P0H.6/AD14 P0H.5/AD13 P0H.4/AD12 P0H.3/AD11 P0H.2/AD10 P0H.1/AD9 VSS VDD 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 P0H.0/AD8 P0L.7/AD7 P0L.6/AD6 P0L.5/AD5 P0L.4/AD4 P0L.3/AD3 P0L.2AD2 P0L.A/AD1 P0L.0/AD0 EA ALE READY WR/WRL RD V SS V DD P4.7A23/CAN2_TxD P4.6A22/CAN1_TxD P4.5A21/CAN1_RxD P4.4A20/CAN2_RxD P4.3/A19 P4.2/A18 P4.1/A17 P4.0/A16 RPD V SS V DD P3.15/CLKOUT P3.13/SCLK P3.12/BHE/WRH P3.11/RXD0 P3.10/TXD0 P3.9/MTSR P3.8/MRST P3.7/T2IN P3.6/T3IN ST10F269 7/160 ST10F269 Table 1 : Pin Description Symbol P6.0 - P6.7 Pin 1-8 Type I/O Function 8-bit bidirectional I/O port, bit-wise programmable for input or output via direction bit. Programming an I/O pin as input forces the corresponding output driver to high impedance state. Port 6 outputs can be configured as push-pull or open drain drivers. The following Port 6 pins have alternate functions: P6.0 ... P6.4 P6.5 P6.6 P6.7 CS0 ... CS4 HOLD HLDA BREQ Chip Select 0 Output ... Chip Select 4 Output External Master Hold Request Input Hold Acknowledge Output Bus Request Output 1 ... 5 6 7 8 P8.0 - P8.7 9-16 O ... O I O O I/O 8-bit bidirectional I/O port, bit-wise programmable for input or output via direction bit. Programming an I/O pin as input forces the corresponding output driver to high impedance state. Port 8 outputs can be configured as push-pull or open drain drivers. The input threshold of Port 8 is selectable (TTL or special). The following Port 8 pins have alternate functions: P8.0 ... P8.7 CC16IO ... CC23IO CAPCOM2: CC16 Capture Input / Compare Output ... CAPCOM2: CC23 Capture Input / Compare Output 9 ... 16 P7.0 - P7.7 19-26 I/O ... I/O I/O 8-bit bidirectional I/O port, bit-wise programmable for input or output via direction bit. Programming an I/O pin as input forces the corresponding output driver to high impedance state. Port 7 outputs can be configured as push-pull or open drain drivers. The input threshold of Port 7 is selectable (TTL or special). The following Port 7 pins have alternate functions: P7.0 ... P7.3 P7.4 ... P7.7 POUT0 ... POUT3 CC28IO ... CC31IO PWM Channel 0 Output ... PWM Channel 3 Output CAPCOM2: CC28 Capture Input / Compare Output ... CAPCOM2: CC31 Capture Input / Compare Output 19 ... 22 23 ... 26 P5.0 - P5.9 P5.10 - P5.15 27-36 39-44 39 40 41 42 43 44 O ... O I/O ... I/O I I I I I I I I 16-bit input-only port with Schmitt-Trigger characteristics. The pins of Port 5 can be the analog input channels (up to 16) for the A/D converter, where P5.x equals ANx (Analog input channel x), or they are timer inputs: P5.10 P5.11 P5.12 P5.13 P5.14 P5.15 T6EUD T5EUD T6IN T5IN T4EUD T2EUD GPT2 Timer T6 External Up / Down Control Input GPT2 Timer T5 External Up / Down Control Input GPT2 Timer T6 Count Input GPT2 Timer T5 Count Input GPT1 Timer T4 External Up / Down Control Input GPT1 Timer T2 External Up / Down Control Input 8/160 ST10F269 Symbol P2.0 - P2.7 P2.8 - P2.15 Pin 47-54 57-64 Type I/O Function 16-bit bidirectional I/O port, bit-wise programmable for input or output via direction bit. Programming an I/O pin as input forces the corresponding output driver to high impedance state. Port 2 outputs can be configured as push-pull or open drain drivers. The input threshold of Port 2 is selectable (TTL or special). The following Port 2 pins have alternate functions: P2.0 ... P2.7 P2.8 CC0IO ... CC7IO CC8IO EX0IN ... P2.15 ... CC15IO EX7IN T7IN CAPCOM: CC0 Capture Input / Compare Output ... CAPCOM: CC7 Capture Input / Compare Output CAPCOM: CC8 Capture Input / Compare Output Fast External Interrupt 0 Input ... CAPCOM: CC15 Capture Input / Compare Output Fast External Interrupt 7 Input CAPCOM2 Timer T7 Count Input 47 ... 54 57 I/O ... I/O I/O I ... 64 ... I/O I I P3.0 - P3.5 P3.6 - P3.13, P3.15 65-70, 73-80, 81 I/O I/O I/O 15-bit (P3.14 is missing) bidirectional I/O port, bit-wise programmable for input or output via direction bit. Programming an I/O pin as input forces the corresponding output driver to high impedance state. Port 3 outputs can be configured as push-pull or open drain drivers. The input threshold of Port 3 is selectable (TTL or special). The following Port 3 pins have alternate functions: P3.0 P3.1 P3.2 P3.3 P3.4 P3.5 P3.6 P3.7 P3.8 P3.9 P3.10 P3.11 P3.12 T0IN T6OUT CAPIN T3OUT T3EUD T4IN T3IN T2IN MRST MTSR TxD0 RxD0 BHE WRH CAPCOM Timer T0 Count Input GPT2 Timer T6 Toggle Latch Output GPT2 Register CAPREL Capture Input GPT1 Timer T3 Toggle Latch Output GPT1 Timer T3 External Up / Down Control Input GPT1 Timer T4 Input for Count / Gate / Reload / Capture GPT1 Timer T3 Count / Gate Input GPT1 Timer T2 Input for Count / Gate / Reload / Capture SSC Master-Receiver / Slave-Transmitter I/O SSC Master-Transmitter / Slave-Receiver O/I ASC0 Clock / Data Output (Asynchronous / Synchronous) ASC0 Data Input (Asynchronous) or I/O (Synchronous) External Memory High Byte Enable Signal External Memory High Byte Write Strobe SSC Master Clock Output / Slave Clock Input System Clock Output (=CPU Clock) 65 66 67 68 69 70 73 74 75 76 77 78 79 I O I O I I I I I/O I/O O I/O O 80 81 I/O O P3.13 P3.15 SCLK CLKOUT 9/160 ST10F269 Symbol P4.0 -P4.7 Pin 85-92 Type I/O Function Port 4 is an 8-bit bidirectional I/O port. It is bit-wise programmable for input or output via direction bit. Programming an I/O pin as input forces the corresponding output driver to high impedance state. The input threshold is selectable (TTL or special). Port 4.6 & 4.7 outputs can be configured as push-pull or open drain drivers. In case of an external bus configuration, Port 4 can be used to output the segment address lines: P4.0 P4.1 P4.2 P4.3 P4.4 A16 A17 A18 A19 A20 CAN2_RxD P4.5 A21 CAN1_RxD P4.6 A22 CAN1_TxD P4.7 A23 CAN2_TxD Segment Address Line Segment Address Line Segment Address Line Segment Address Line Segment Address Line CAN2 Receive Data Input Segment Address Line CAN1 Receive Data Input Segment Address Line CAN1 Transmit Data Output Most Significant Segment Address Line CAN2 Transmit Data Output 85 86 87 88 89 O O O O O I 90 O I 91 O O 92 O O RD WR/WRL 95 96 O O External Memory Read Strobe. RD is activated for every external instruction or data read access. External Memory Write Strobe. In WR-mode this pin is activated for every external data write access. In WRL mode this pin is activated for low Byte data write accesses on a 16-bit bus, and for every data write access on an 8-bit bus. See WRCFG in the SYSCON register for mode selection. Ready Input. The active level is programmable. When the Ready function is enabled, the selected inactive level at this pin, during an external memory access, will force the insertion of waitstate cycles until the pin returns to the selected active level. Address Latch Enable Output. In case of use of external addressing or of multiplexed mode, this signal is the latch command of the address lines. External Access Enable pin. A low level applied to this pin during and after Reset forces the ST10F269 to start the program from the external memory space. A high level forces the MCU to start in the internal memory space. READY/ READY 97 I ALE EA 98 99 O I 10/160 ST10F269 Symbol Pin Type I/O Function Two 8-bit bidirectional I/O ports P0L and P0H, bit-wise programmable for input or output via direction bit. Programming an I/O pin as input forces the corresponding output driver to high impedance state. In case of an external bus configuration, PORT0 serves as the address (A) and as the address / data (AD) bus in multiplexed bus modes and as the data (D) bus in demultiplexed bus modes. P0L.0 - P0L.7, 100-107, P0H.0 108, P0H.1 - P0H.7 111-117 Demultiplexed bus modes Data Path Width: P0L.0 - P0L.7: P0H.0 - P0H.7 8-bit D0 - D7 I/O 16-bit D0 - D7 D8 - D15 Multiplexed bus modes Data Path Width: P0L.0 - P0L.7: P0H.0 - P0H.7 P1L.0 - P1L.7 P1H.0 - P1H.7 118-125 128-135 I/O 8-bit 16-bit AD0 - AD7 AD0 - AD7 A8 - A15 AD8 - AD15 Two 8-bit bidirectional I/O ports P1L and P1H, bit-wise programmable for input or output via direction bit. Programming an I/O pin as input forces the corresponding output driver to high impedance state. PORT1 is used as the 16-bit address bus (A) in demultiplexed bus modes and also after switching from a demultiplexed bus mode to a multiplexed bus mode. The following PORT1 pins have alternate functions: P1H.4 P1H.5 P1H.6 P1H.7 XTAL1 XTAL2 CC24IO CC25IO CC26IO CC27IO CAPCOM2: CC24 Capture Input CAPCOM2: CC25 Capture Input CAPCOM2: CC26 Capture Input CAPCOM2: CC27 Capture Input 132 133 134 135 XTAL1 XTAL2 138 137 I I I I I O Oscillator amplifier and/or external clock input. Oscillator amplifier circuit output. To clock the device from an external source, drive XTAL1 while leaving XTAL2 unconnected. Minimum and maximum high / low and rise / fall times specified in the AC Characteristics must be observed. RSTIN 140 I Reset Input with Schmitt-Trigger characteristics. A low level at this pin for a specified duration while the oscillator is running resets the ST10F269. An internal pull-up resistor permits power-on reset using only a capacitor connected to VSS. In bidirectional reset mode (enabled by setting bit BDRSTEN in SYSCON register), the RSTIN line is pulled low for the duration of the internal reset sequence. Internal Reset Indication Output. This pin is driven to a low level during hardware, software or watchdog timer reset. RSTOUT remains low until the EINIT (end of initialization) instruction is executed. Non-Maskable Interrupt Input. A high to low transition at this pin causes the CPU to vector to the NMI trap routine. If bit PWDCFG = `0' in SYSCON register, when the PWRDN (power down) instruction is executed, the NMI pin must be low in order to force the ST10F269 to go into power down mode. If NMI is high and PWDCFG ='0', when PWRDN is executed, the part will continue to run in normal mode. If not used, pin NMI should be pulled high externally. A/D converter reference voltage. A/D converter reference ground. Timing pin for the return from interruptible powerdown mode and synchronous / asynchronous reset selection. RSTOUT 141 O NMI 142 I VAREF VAGND RPD 37 38 84 - 11/160 ST10F269 Symbol VDD Pin 46, 72, 82,93, 109, 126, 136, 144 18,45, 55,71, 83,94, 110, 127, 139, 143 56 17 Type - Function Digital Supply Voltage: = + 5V during normal operation and idle mode. VSS - Digital Ground. DC1 DC2 - 3.3V Decoupling pin: a decoupling capacitor of 330 nF must be connected between this pin and nearest V SS pin. 12/160 ST10F269 3 - FUNCTIONAL DESCRIPTION The architecture of the ST10F269 combines advantages of both RISC and CISC processors and an advanced peripheral subsystem. The Figure 3 : Block Diagram 32 256K Byte Flash Memory CPU-Core and MAC Unit 16 16 2K Byte Internal RAM block diagram gives an overview of the different on-chip components and the high bandwidth internal bus structure of the ST10F269. 16 10K Byte XRAM PEC Watchdog Oscillator and PLL P4.5 CAN1_RXD P4.6 CAN1_TXD P4.4 CAN2_RXD P4.7 CAN2_TXD CAN1 Interrupt Controller CAN2 16 XTAL1 3.3V XTAL2 Voltage Regulator Port 4 Port 1 Port 0 GPT1 ASC usart CAPCOM2 10-Bit ADC 16 16 External Bus Controller CAPCOM1 PWM SSC GPT2 Port 2 8 16 8 BRG Port 3 15 BRG Port 7 8 Port 8 Port 6 8 Port 5 16 13/160 ST10F269 4 - MEMORY ORGANIZATION The memory space of the ST10F269 is configured in a unified memory architecture. Code memory, data memory, registers and I/O ports are organized within the same linear address space of 16M Bytes. The entire memory space can be accessed Byte wise or Word wise. Particular portions of the on-chip memory have additionally been made directly bit addressable. Flash: 256K Bytes of on-chip Flash memory. IRAM: 2K Bytes of on-chip internal RAM (dual-port) is provided as a storage for data, system stack, general purpose register banks and code. A register bank is 16 Wordwide (R0 to R15) and / or Bytewide (RL0, RH0, ..., RL7, RH7) general purpose registers. XRAM: 10K Bytes of on-chip extension RAM (single port XRAM) is provided as a storage for data, user stack and code. The XRAM is divided into 2 areas, the first 2K Bytes named XRAM1 and the second 8K Bytes named XRAM2, connected to the internal XBUS and are accessed like an external memory in 16-bit demultiplexed bus-mode without wait state or read/write delay (50ns access at 40MHz CPU clock). Byte and Word accesses are allowed. The XRAM1 address range is 00'E000h - 00'E7FFh if XPEN (bit 2 of SYSCON register), and XRAM1EN (bit 2 of XPERCON register) are set. If XRAM1EN or XPEN is cleared, then any access in the address range 00'E000h - 00'E7FFh will be directed to external memory interface, using the BUSCONx register corresponding to address matching ADDRSELx register The XRAM2 address range is 00'C000h - 00'DFFFh if XPEN (bit 2 of SYSCON register), and XRAM2 (bit 3 of XPERCON register are set). If bit XRAM2EN or XPEN is cleared, then any access in the address range 00'C000h - 00'DFFFh will be directed to external memory interface, using the BUSCONx register corresponding to address matching ADDRSELx register. As the XRAM appears like external memory, it cannot be used as system stack or as register banks. The XRAM is not provided for single bit storage and therefore is not bit addressable. SFR/ESFR: 1024 Bytes (2 x 512 Bytes) of address space is reserved for the special function register areas. SFRs are Wordwide registers which are used to control and to monitor the function of the different on-chip units. CAN1: Address range 00'EF00h - 00'EFFFh is reserved for the CAN1 Module access. The CAN1 is enabled by setting XPEN bit 2 of the SYSCON register and by setting CAN1EN bit 0 of the new XPERCON register. Accesses to the CAN Module use demultiplexed addresses and a 16-bit data bus (Byte accesses are possible). Two wait states give an access time of 100ns at 40MHz CPU clock. No tri-state wait states are used. CAN2: Address range 00'EE00h - 00'EEFFh is reserved for the CAN2 Module access. The CAN2 is enabled by setting XPEN bit 2 of the SYSCON register and by setting CAN2EN bit 1 of the new XPERCON register. Accesses to the CAN Module use demultiplexed addresses and a 16-bit data bus (Byte accesses are possible). Two wait states give an access time of 100ns at 40MHz CPU clock. No tri-state wait states are used. In order to meet the needs of designs where more memory is required than is provided on chip, up to 16M Bytes of external RAM and/or ROM can be connected to the microcontroller. Note If one or the two CAN modules are used, Port 4 cannot be programmed to output all 8 segment address lines. Thus, only 4 segment address lines can be used, reducing the external memory space to 5M Bytes (1M Byte per CS line). Visibility of XBUS Peripherals In order to keep the ST10F269 compatible with the ST10C167 and with the ST10F167, the XBUS peripherals can be selected to be visible and / or accessible on the external address / data bus. CAN1EN and CAN2EN bits of XPERCON register must be set. If these bits are cleared before the global enabling with XPEN-bit in SYSCON register, the corresponding address space, port pins and interrupts are not occupied by the peripheral, thus the peripheral is not visible and not available. Refer to Chapter 20 - Special Function Register Overview. 14/160 ST10F269 Figure 4 : ST10F269 On-chip Memory Mapping 14 Segment 2 Segment 3 Segment 4 05'0000 Block6 = 64K Bytes RAM, SFR and X-pheripherals are mapped into the address space. 00'FFFF SFR : 512 Bytes 00'FE00 10 04'0000 00'FDFF Block5 = 64K Bytes 0C 03'0000 00'F600 IRAM : 2K Bytes Block4 = 64K Bytes 08 07 02'0000 00'F1FF ESFR : 512 Bytes Block3 = 32K Bytes Bank 1H 00'F000 Segment 1 06 05 04 01'8000 Block2* Block1* Block0* 00'EFFF CAN1 : 256 Bytes Bank 1L 00'EF00 01'0000 00'EEFF CAN2 : 256 Bytes 03 00'C000 00'EE00 Segment 0 02 00'EC14 Real Time Clock 00'EC00 Block2 = 8K Bytes Block1 = 8K Bytes Bank OL Block0 = 16K Bytes 00'0000 01 00'6000 00'4000 00'E7FF XRAM1 : 2K Bytes 00 00'E000 00'DFFF Internal Flash Memory XRAM2 : 8K Bytes 00'C000 Data Page Number Absolute Memory Address * Bank 0L may be remapped from segment 0 to segment 1 (Bank 1L) by setting SYSCON-ROMS1 (before EINIT) Data Page Number and Absolute Memory Address are hexadecimal values. 15/160 ST10F269 XPERCON (F024h / 12h) 15 - ESFR 10 - Reset Value: - - 05h 4 RTCEN 14 - 13 - 12 - 11 - 9 - 8 - 7 - 6 - 5 - 3 XRAM2EN 2 XRAM1EN 1 CAN2EN 0 CAN1EN RW CAN1EN CAN1 Enable Bit RW RW RW RW `0': Accesses to the on-chip CAN1 XPeripheral and its functions are disabled. P4.5 and P4.6 pins can be used as general purpose I/Os. Address range 00'EF00h-00'EFFFh is only directed to external memory if CAN2EN is also `0'. `1': The on-chip CAN1 XPeripheral is enabled and can be accessed. CAN2EN CAN2 Enable Bit `0': Accesses to the on-chip CAN2 XPeripheral and its functions are disabled. P4.4 and P4.7 pins can be used as general purpose I/Os. Address range 00'EE00h-00'EEFFh is only directed to external memory if CAN1EN is also `0'. `1': The on-chip CAN2 XPeripheral is enabled and can be accessed. XRAM1EN XRAM1 Enable Bit `0': Accesses to external memory within space 00'E000h to 00'E7FFh. The 2K Bytes of internal XRAM1 are disabled. '1': Accesses to the internal 2K Bytes of XRAM1. XRAM2EN XRAM2 Enable Bit `0': Accesses to the external memory within space 00'C000h to 00'DFFFh. The 8K Bytes of internal XRAM2 are disabled. '1': Accesses to the internal 8K Bytes of XRAM2. RTCEN RTC Enable Bit '0': Accesses to the on-chip Real Time Clock are disabled, external access is performed. Address range 00'EC00h-00'ECFFh is only directed to external memory if CAN1EN and CAN2EN are '0' also '1': The on-chip Real Time Clock is enabled and can be accessed. Note: - When both CAN are disabled via XPERCON setting, then any access in the address range 00'EE00h - 00'EFFFh will be directed to external memory interface, using the BUSCONx register corresponding to address matching ADDRSELx register. P4.4 and P4.7 can be used as General Purpose I/O when CAN2 is disabled, and P4.5 and P4.6 can be used as General Purpose I/O when CAN1 is disabled. - The default XPER selection after Reset is identical to XBUS configuration of ST10C167: XCAN1 is enabled, XCAN2 is disabled, XRAM1 (2K Byte compatible XRAM) is enabled, XRAM2 (new 8K Byte XRAM) is disabled. - Register XPERCON cannot be changed after the global enabling of XPeripherals, i.e. after the setting of bit XPEN in the SYSCON register. - In EMUlation mode, all the XPERipherals are enabled (XPERCON bit are all set). The access to external memory and/or XBus is controlled by the bondout chip. - When the Real Time Clock is disabled (RTCEN = 0), the clock oscillator is switch-off if the ST10 enters in power-down mode. Otherwise, when the Real Time Clock is enabled, the bit RTCOFF of the RTCCON register allows to choose the power-down mode of the clock oscillator (See Chapter 16 - Real Time Clock). 16/160 ST10F269 5 - INTERNAL FLASH MEMORY 5.1 - Overview - 256K Byte on-chip Flash memory - Two possibilities of Flash mapping into the CPU address space - Flash memory can be used for code and data storage - 32-bit, zero waitstate read access (50ns cycle time at fCPU = 40MHz) - Erase-Program Controller (EPC) similar to M29F400B STM's stand-alone Flash memory * Word-by-Word Programmable (16s typical) * Data polling and Toggle Protocol for EPC Status * Ready/Busy signal connected on XP2INT interrupt line * Internal Power-On detection circuit - Memory Erase in blocks * One 16K Byte, two 8K Byte, one 32K Byte, three 64K Byte blocks * Each block can (1.5 second typical) be erased separately 5.2 - Operational Overview Read Mode In standard mode (the normal operating mode) the Flash appears like an on-chip ROM with the same timing and functionality. The Flash module offers a fast access time, allowing zero waitstate access with CPU frequency up to 40MHz. Instruction fetches and data operand reads are performed with all addressing modes of the ST10F269 instruction set. In order to optimize the programming time of the internal Flash, blocks of 8K Bytes, 16K Bytes, 32K Bytes, 64K Bytes can be used. But the size of the blocks does not apply to the whole memory space, see details in Table 2. Access to data of internal Flash can only be performed with an inner protected program - Erase Suspend and Resume Modes * Read and Program another Block during erase suspend - Single Voltage operation , no need of dedicated supply pin - Low Power Consumption: * 45mA max. Read current * 60mA max. Program or Erase current * Automatic Stand-by-mode (50A maximum) - 100,000 Erase-Program Cycles per block, 20 years of data retention time - Operating temperature: -40 to +125oC * Chip erase (8.5 second typical) * Each block can be separately protected against programming and erasing * Each protected block can be temporary unprotected * When enabled, the read protection prevents access to data in Flash memory using a program running out of the Flash memory space. Table 2 : 256K Byte Flash Memory Block Organisation Block 0 1 2 3 4 5 6 Addresses (Segment 0) 00'0000h to 00'3FFFh 00'4000h to 00'5FFFh 00'6000h to 00'7FFFh 01'8000h to 01'FFFFh 02'0000h to 02'FFFFh 03'0000h to 03'FFFFh 04'0000h to 04'FFFFh Addresses (Segment 1) 01'0000h to 01'3FFFh 01'4000h to 01'5FFFh 01'6000h to 01'7FFFh 01'8000h to 01'FFFFh 02'0000h to 02'FFFFh 03'0000h to 03'FFFFh 04'0000h to 04'FFFFh Size (byte) 16K 8K 8K 32K 64K 64K 64K 17/160 ST10F269 Instructions and Commands All operations besides normal read operations are initiated and controlled by command sequences written to the Flash Command Interface (CI). The Command Interface (CI) interprets words written to the Flash memory and enables one of the following operations: - Read memory array - Program Word - Block Erase - Chip Erase - Erase Suspend - Erase Resume - Block Protection - Block Temporary Unprotection - Code Protection Commands are composed of several write cycles at specific addresses of the Flash memory. The different write cycles of such command sequences offer a fail-safe feature to protect against an inadvertent write. A command only starts when the Command Interface has decoded the last write cycle of an operation. Until that last write is performed, Flash memory remains in Read Mode Notes: 1. As it is not possible to perform write operations in the Flash while fetching code from Flash, the Flash commands must be written by instructions executed from internal RAM or external memory. 2. Command write cycles do not need to be consecutively received, pauses are allowed, save for Block Erase command. During this operation all Erase Confirm commands must be sent to complete any block erase operation before time-out period expires (typically 96s). Command sequencing must be followed exactly. Any invalid combination of commands will reset the Command Interface to Read Mode. Status Register This register is used to flag the status of the memory and the result of an operation. This register can be accessed by read cycles during the Erase-Program Controller (EPC) operation. Erase Operation This Flash memory features a block erase architecture with a chip erase capability too. Erase is accomplished by executing the six cycle erase command sequence. Additional command write cycles can then be performed to erase more than 18/160 one block in parallel. When a time-out period elaps (96s) after the last cycle, the Erase-Program Controller (EPC) automatically starts and times the erase pulse and executes the erase operation. There is no need to program the block to be erased with `0000h' before an erase operation. Termination of operation is indicated in the Flash status register. After erase operation, the Flash memory locations are read as 'FFFFh' value. Erase Suspend A block erase operation is typically executed within 1.5 second for a 64K Byte block. Erasure of a memory block may be suspended, in order to read data from another block or to program data in another block, and then resumed. In-System Programming In-system programming is fully supported. No special programming voltage is required. Because of the automatic execution of erase and programming algorithms, write operations are reduced to transferring commands and data to the Flash and reading the status. Any code that programs or erases Flash memory locations (that writes data to the Flash) must be executed from memory outside the on-chip Flash memory itself (on-chip RAM or external memory). A boot mechanism is provided to support in-system programming. It works using serial link via USART interface and a PC compatible or other programming host. Read/Write Protection The Flash module supports read and write protection in a very comfortable and advanced protection functionality. If Read Protection is installed, the whole Flash memory is protected against any "external" read access; read accesses are only possible with instructions fetched directly from program Flash memory. For update of the Flash memory a temporary disable of Flash Read Protection is supported. The device also features a block write protection. Software locking of selectable memory blocks is provided to protect code and data. This feature will disable both program and erase operations in the selected block(s) of the memory. Block Protection is accomplished by block specific lock-bit which are programmed by executing a four cycle command sequence. The locked state of blocks is indicated by specific flags in the according block status registers. A block may only be temporarily unlocked for update (write) operations. ST10F269 With the two possibilities for write protection whole memory or block specific - a flexible installation of write protection is supported to protect the Flash memory or parts of it from unauthorized programming or erase accesses and to provide virus-proof protection for all system code blocks. All write protection also is enabled during boot operation. Power Supply, Reset The Flash module uses a single power supply for both read and write functions. Internally generated and regulated voltages are provided for the program and erase operations from 5V supply. Once a program or erase cycle has been completed, the device resets to the standard read mode. At power-on, the Flash memory has a setup phase of some microseconds (dependent on the power supply ramp-up). During this phase, Flash can not be read. Thus, if EA pin is high (execution will start from Flash memory), the CPU will remains in reset state until the Flash can be accessed. 5.3 - Architectural Description The Flash module distinguishes two basic operating modes, the standard read mode and the command mode. The initial state after power-on and after reset is the standard read mode. 5.3.1 - Read Mode The Flash module enters the standard operating mode, the read mode: - After Reset command - After every completed erase operation - After every completed programming operation - After every other completed command execution - Few microseconds after a CPU-reset has started - After incorrect address and data values of command sequences or writing them in an improper sequence - After incorrect write access to a read protected Flash memory The read mode remains active until the last command of a command sequence is decoded which starts directly a Flash array operation, such as: - erase one or several blocks - program a word into Flash array - protect / temporary unprotect a block. In the standard read mode read accesses are directly controlled by the Flash memory array, delivering a 32-bit double Word from the addressed position. Read accesses are always aligned to double Word boundaries. Thus, both low order address bit A1 and A0 are not used in the Flash array for read accesses. The high order address bit A17/A16 define the physical 64K Byte segment being accessed within the Flash array. 5.3.2 - Command Mode Every operation besides standard read operations is initiated by commands written to the Flash command register. The addresses used for command cycles define in conjunction with the actual state the specific step within command sequences. With the last command of a command sequence, the Erase-Program Controller (EPC) starts the execution of the command. The EPC status is indicated during command execution by: - The Status Register, - The Ready/Busy signal. 5.3.3 - Ready/Busy Signal The Ready/Busy (R/B) signal is connected to the XPER2 interrupt node (XP2IC). When R/B is high, the Flash is busy with a Program or Erase operation and will not accept any additional program or erase instruction. When R/B is Low, the Flash is ready for any Read/Write or Erase operation. The R/B will also be low when the memory is put in Erase Suspend mode. This signal can be polled by reading XP2IC register, or can be used to trigger an interrupt when the Flash goes from Busy to Ready. 5.3.4 - Flash Status Register The Flash Status register is used to flag the status of the Flash memory and the result of an operation. This register can be accessed by Read cycles during the program-Erase Controller operations. The program or erase operation can be controlled by data polling on bit FSB.7 of Status Register, detection of Toggle on FSB.6 and FSB.2, or Error on FSB.5 and Erase Timeout on FSB.3 bit. Any read attempt in Flash during EPC operation will automatically output these five bits. The EPC sets bit FSB.2, FSB.3, FSB.5, FSB.6 and FSB.7. Other bits are reserved for future use and should be masked. 19/160 ST10F269 Flash Status (see note for address) 15 14 13 12 11 10 9 8 7 6 5 4 3 FSB.3 R 2 FSB.2 R 1 0 - FSB.7 FSB.6 FSB.5 R R R FSB.7 Flash Status bit 7: Data Polling Bit Programming Operation: this bit outputs the complement of the bit 7 of the word being programmed, and after completion, will output the bit 7 of the word programmed. Erasing Operation: outputs a `0' during erasing, and `1' after erasing completion. If the block selected for erasure is (are) protected, FSB.7 will be set to `0' for about 100 s, and then return to the previous addressed memory data value. FSB.7 will also flag the Erase Suspend Mode by switching from `0' to `1' at the start of the Erase Suspend. During Program operation in Erase Suspend Mode, FSB.7 will have the same behaviour as in normal Program execution outside the Suspend mode. Flash Status bit 6: Toggle Bit Programming or Erasing Operations: successive read operations of Flash Status register will deliver complementary values. FSB.6 will toggle each time the Flash Status register is read. The Program operation is completed when two successive reads yield the same value. The next read will output the bit last programmed, or a `1' after Erase operation FSB.6 will be set to`1' if a read operation is attempted on an Erase Suspended block. In addition, an Erase Suspend/Resume command will cause FSB.6 to toggle. Flash Status bit 5: Error Bit This bit is set to `1' when there is a failure of Program, block or chip erase operations.This bit will also be set if a user tries to program a bit to `1' to a Flash location that is currently programmed with `0'. The error bit resets after Read/Reset instruction. In case of success, the Error bit will be set to `0' during Program or Erase and then will output the bit last programmed or a `1' after erasing Flash Status bit 3: Erase Time-out Bit This bit is cleared by the EPC when the last Block Erase command has been entered to the Command Interface and it is awaiting the Erase start. When the time-out period is finished, after 96 s, FSB.3 returns back to `1'. Flash Status bit 2: Toggle Bit This toggle bit, together with FSB.6, can be used to determine the chip status during the Erase Mode or Erase Suspend Mode. It can be used also to identify the block being Erased Suspended. A Read operation will cause FSB.2 to Toggle during the Erase Mode. If the Flash is in Erase Suspend Mode, a Read operation from the Erase suspended block or a Program operation into the Erase suspended block will cause FSB.2 to toggle. When the Flash is in Program Mode during Erase Suspend, FSB.2 will be read as `1' if address used is the address of the word being programmed. After Erase completion with an Error status, FSB.2 will toggle when reading the faulty sector. FSB.6 FSB.5 FSB.3 FSB.2 Note: The Address of Flash Status Register is the address of the word being programmed when Programming operation is in progress, or an address within block being erased when Erasing operation is in progress. 20/160 ST10F269 5.3.5 - Flash Protection Register The Flash Protection register is a non-volatile register that contains the protection status. This register can be read by using the Read Protection Status (RP) command, and programmed by using the dedicated Set Protection command. Flash Protection Register (PR) 15 CP 14 13 12 11 10 9 8 7 6 BP6 5 BP5 4 BP4 3 BP3 2 BP2 1 BP1 0 BP0 BPx Block x Protection Bit (x = 0...6) `0': the Block Protection is enabled for block x. Programming or erasing the block is not possible, unless a Block Temporary Unprotection command is issued. 1': the Block Protection is disabled for block x. Bit is `1' by default, and can be programmed permanently to `0' using the Set Protection command but then cannot be set to `1' again. It is therefore possible to temporally disable the Block Protection using the Block Temporary Unprotection instruction. CP Code Protection Bit `0': the Flash Code Protection is enabled. Read accesses to the Flash for execution not performed in the Flash itself are not allowed, the returned value will be 009Bh, whatever the content of the Flash is. 1': the Flash Code Protection is disabled: read accesses to the Flash from external or internal RAM are allowed Bit is `1' by default, and can be programmed permanently to `0' using the Set Protection command but then cannot be set to `1' again. It is therefore possible to temporally disable the Code Protection using the Code Temporary Unprotection instruction. 5.3.6 - Instructions Description Twelve instructions dedicated to Flash memory accesses are defined as follow: Read/Reset (RD). The Read/Reset instruction consist of one write cycle with data XXF0h . it can be optionally preceded by two CI enable coded cycles (data xxA8h at address 1554h + data xx54h at address 2AA8h). Any successive read cycle following a Read/Reset instruction will read the memory array. A Wait cycle of 10s is necessary after a Read/Reset command if the memory was in program or Erase mode. Program Word (PW). This instruction uses four write cycles. After the two Cl enable coded cycles, the Program Word command xxA0h is written at address 1554h. The following write cycle will latch the address and data of the word to be programmed. Memory programming can be done only by writing 0's instead of 1's, otherwise an error occurs. During programming, the Flash Status is checked by reading the Flash Status bit FSB.2, FSB.5, FSB.6 and FSB.7 which show the status of the EPC. FSB.2, FSB.6 and FSB.7 determine if programming is on going or has completed, and FSB.5 allows a check to be made for any possible error. Block Erase (BE). This instruction uses a minimum of six command cycles. The erase enable command xx80h is written at address 1554h after the two-cycle CI enable sequence. The erase confirm code xx30h must be written at an address related to the block to be erased preceded by the execution of a second CI enable sequence. Additional erase confirm codes must be given to erase more than one block in parallel. Additional erase confirm commands must be written within a defined time-out period. The input of a new Block Erase command will restart the time-out period. When this time-out period has elapsed, the erase starts. The status of the internal timer can be monitored through the level of FSB.3, if FSB.3 is `0', the Block Erase command has been given and the timeout is running; if FSB.3 is `1', the timeout has expired and the EPC is erasing the block(s). 21/160 ST10F269 If the second command given is not an erase confirm or if the coded cycles are wrong, the instruction aborts, and the device is reset to Read Mode. It is not necessary to program the block with 0000h as the EPC will do this automatically before the erasing to FFFFh. Read operations after the EPC has started, output the Flash Status Register. During the execution of the erase by the EPC, the device accepts only the Erase Suspend and Read/Reset instructions. Data Polling bit FSB.7 returns `0' while the erasure is in progress, and `1' when it has completed. The Toggle bit FSB.2 and FSB.6 toggle during the erase operation. They stop when erase is completed. After completion, the Error bit FSB.5 returns `1' if there has been an erase failure because erasure has not completed even after the maximum number of erase cycles have been executed by the EPC, in this case, it will be necessary to input a Read/Reset to the Command Interface in order to reset the EPC. Chip Erase (CE). This instruction uses six write cycles. The Erase Enable command xx80h, must be written at address 1554h after CI-Enable cycles. The Chip Erase command xx10h must be given on the sixth cycle after a second CI-Enable sequence. An error in command sequence will reset the CI to Read mode. It is NOT necessary to program the block with 0000h as the EPC will do this automatically before the erasing to FFFFh. Read operations after the EPC has started output the Flash Status Register. During the execution of the erase by the EPC, Data Polling bit FSB.7 returns `0' while the erasure is in progress, and `1' when it has completed. The FSB.2 and FSB.6 bit toggle during the erase operation. They stop when erase is finished. The FSB.5 error bit returns "1" in case of failure of the erase operation. The error flag is set after the maximum number of erase cycles have been executed by the EPC. In this case, it will be necessary to input a Read/Reset to the Command Interface in order to reset the EPC. Erase Suspend (ES). This instruction can be used to suspend a Block Erase operation by giving the command xxB0h without any specific address. No CI-Enable cycles is required. Erase Suspend operation allows reading of data from another block and/or the programming in another block while erase is in progress. If this command is given during the time-out period, it will terminate the time-out period in addition to erase Suspend. The Toggle bit FSB.6, when monitored at an address that belongs to the block being erased, stops toggling when Erase Suspend Command is effective, It happens between 0.1s and 15s after the Erase Suspend Command has been 22/160 written. The Flash will then go in normal Read Mode, and read from blocks not being erased is valid, while read from block being erased will output FSB.2 toggling. During a Suspend phase the only instructions valid are Erase Resume and Program Word. A Read / Reset instruction during Erase suspend will definitely abort the Erase and result in invalid data in the block being erased. Erase Resume (ER). This instruction can be given when the memory is in Erase Suspend State. Erase can be resumed by writing the command xx30h at any address without any Cl-enable sequence. Program during Erase Suspend. The Program Word instruction during Erase Suspend is allowed only on blocks that are not Erase-suspended. This instruction is the same than the Program Word instruction. Set Protection (SP). This instruction can be used to enable both Block Protection (to protect each block independently from accidental Erasing-Programming Operation) and Code Protection (to avoid code dump). The Set Protection Command must be given after a special CI-Protection Enable cycles (see instruction table). The following Write cycle, will program the Protection Register. To protect the block x (x = 0 to 6), the data bit x must be at `0'. To protect the code, bit 15 of the data must be `0'. Enabling Block or Code Protection is permanent and can be cleared only by STM. Block Temporary Unprotection and Code Temporary Unprotection instructions are available to allow the customer to update the code. Notes: 1. The new value programmed in protection register will only become active after a reset. 2. Bit that are already at '0' in protection register must be confirmed at '0' also in data latched during the 4th cycle of set protection command, otherwise an error may occur. Read Protection Status (RP). This instruction is used to read the Block Protection status and the Code Protection status. To read the protection register (see Table 3), the CI-Protection Enable cycles must be executed followed by the command xx90h at address x2A54h. The following Read Cycles at any odd word address will output the Block Protection Status. The Read/ Reset command xxF0h must be written to reset the protection interface. Note: After a modification of protection register (using Set Protection command), the Read Protection Status will return the new PR value only after a reset. ST10F269 Block Temporary Unprotection (BTU). This Instruction can be used to temporary unprotect all the blocks from Program / Erase protection. The Unprotection is disabled after a Reset cycle. The Block Temporary Unprotection command xxC1h must be given to enable Block Temporary Unprotection. The Command must be preceded by the CI-Protection Enable cycles and followed by the Read/Reset command xxF0h. Set Code Protection (SCP). This kind of protection allows the customer to protect the proprietary code written in Flash. If installed and active, Flash Code Protection prevents data operand accesses and program branches into the on-chip Flash area from any location outside the Flash memory itself. Data operand accesses and branches to Flash locations are only and exclusively allowed for instructions executed from the Flash memory itself. Every read or jump to Flash performed from another memory (like internal RAM, external memory) while Code Protection is enabled, will give the opcode 009Bh related to TRAP #00 illegal instruction. The CI-Protection Enable cycles must be sent to set the Code Protection. By writing data 7FFFh at any odd word address, the Code Protected status is stored in the Flash Protection Register (PR). Protection is permanent and cannot be cleared by the user. It is possible to temporarily disable the Code Protection using Code Temporary Unprotection instruction. Note: Bits that are already at '0' in protection register must be confirmed at '0' also in data latched during the 4th cycle of set protection command, otherwise an error may occur. Code Temporary Unprotection (CTU). This instruction must be used to temporary disable Code Protection. This instruction is effective only if executed from Flash memory space. To restore the protection status, without using a reset, it is necessary to use a Code Temporary Protection instruction. System reset will reset also the Code Temporary Unprotected status. The Code Temporary Unprotection command consists of the following write cycle: MOV MEM, Rn ; This instruction MUST be executed from Flash memory space Where MEM is an absolute address inside memory space, Rn is a register loaded with data 0FFFFh. Code Temporary Protection (CTP). This instruction allows to restore Code Protection. This operation is effective only if executed from Flash memory and is necessary to restore the protection status after the use of a Code Temporary Unprotection instruction. The Code Temporary Protection command consists of the following write cycle: MOV MEM, Rn ; This instruction MUST be executed from Flash memory space Where MEM is an absolute address inside memory space, Rn is a register loaded with data 0FFFBh. Note that Code Temporary Unprotection instruction must be used when it is necessary to modify the Flash with protected code (SCP), since the write/erase routines must be executed from a memory external to Flash space. Usually, the write/erase routines, executed in RAM, ends with a return to Flash space where a CTP instruction restore the protection. 23/160 ST10F269 Table 3 : Instructions Instruction Mne Cycle Addr.1 Data Read/Reset RD 3+ Addr.1 Data Program Word PW 4 Addr.1 Data Addr.1 Data Chip Erase CE 6 Addr. 1 1st Cycle X2 xxF0h x1554h xxA8h x1554h xxA8h x1554h xxA8h x1554h xxA8h X2 xxB0h X2 xx30h x2A54h 2nd Cycle 3rd Cycle 4th Cycle 5th Cycle 6th Cycle 7th Cycle Read/Reset RD 1+ Read Memory Array until a new write cycle is initiated x2AA8h xx54h x2AA8h xx54h x2AA8h xx54h x2AA8h xx54h xxxxxh xxF0h x1554h xxA0h x1554h xx80h x1554h xx80h Read Memory Array until a new write cycle is initiated WA 3 WD 4 x1554h xxA8h x1554h xxA8h Read Data Polling or Toggle bit until Program completes. x2AA8h xx54h x2AA8h xx54h BA xx30h x1554h xx10h Note 6 BA' 5 xx30h Block Erase BE 6 Data Erase Suspend ES 1 Addr.1 Data Erase Resume Set Block/Code Protection SP 4 Data Read Protection Status Addr.1 RP 4 Data Block Temporary Unprotection Code Temporary Unprotection Code Temporary Protection BTU 4 Addr.1 Data Addr.1 Data Addr.1 Data ER 1 Addr. 1 Read until Toggle stops, then read or program all data needed from block(s) not being erased then Resume Erase. Read Data Polling or Toggle bit until Erase completes or Erase is supended another time. x15A8h x2A54h Any odd word address 9 WPR 7 Any odd word address 9 Read PR X2 xxF0h Read Protection Register until a new write cycle is initiated. Data Addr.1 xxA8h x2A54h xx54h x15A8h xxC0h x2A54h xxA8h x2A54h xxA8h MEM 8 FFFFh MEM 8 FFFBh xx54h x15A8h xx54h xx90h x2A54h xxC1h CTU 1 Write cycles must be executed from Flash. CTP 1 Write cycles must be executed from Flash. Notes 1. Address bit A14, A15 and above are don't care for coded address inputs. 2. X = Don't Care. 3. WA = Write Address: address of memory location to be programmed. 4. WD = Write Data: 16-bit data to be programmed 5. Optional, additional blocks addresses must be entered within a time-out delay (96 s) after last write entry, timeout status can be verified through FSB.3 value. When full command is entered, read Data Polling or Toggle bit until Erase is completed or suspended. 6. Read Data Polling or Toggle bit until Erase completes. 7. WPR = Write protection register. To protect code, bit 15 of WPR must be `0'. To protect block N (N=0,1,...), bit N of WPR must be `0'. Bit that are already at `0' in protection register must also be `0' in WPR, else a writing error will occurs (it is not possible to write a `1' in a bit already programmed at `0'). 8. MEM = any address inside the Flash memory space. Absolute addressing mode must be used (MOV MEM, Rn), and instruction must be executed from Flash memory space. 9. Odd word address = 4n-2 where n = 0, 1, 2, 3..., ex. 0002h, 0006h... 24/160 ST10F269 - Generally, command sequences cannot be written to Flash by instructions fetched from the Flash itself. Thus, the Flash commands must be written by instructions, executed from internal RAM or external memory. - Command cycles on the CPU interface need not to be consecutively received (pauses allowed). The CPU interface delivers dummy read data for not used cycles within command sequences. - All addresses of command cycles shall be defined only with Register-indirect addressing mode in the according move instructions. Direct addressing is not allowed for command sequences. Address segment or data page pointer are taken into account for the command address value. 5.3.7 - Reset Processing and Initial State The Flash module distinguishes two kinds of CPU reset types The lengthening of CPU reset: - Is not reported to external devices by bidirectional pin - Is not enabled in case of external start of CPU after reset. 5.4 - Flash Memory Configuration The default memory configuration of the ST10F269 Memory is determined by the state of the EA pin at reset. This value is stored in the Internal ROM Enable bit (named ROMEN) of the SYSCON register. When ROMEN = 0, the internal Flash is disabled and external ROM is used for startup control. Flash memory can later be enabled by setting the ROMEN bit of SYSCON to 1. The code performing this setting must not run from a segment of the external ROM to be replaced by a segment of the Flash memory, otherwise unexpected behaviour may occur. For example, if external ROM code is located in the first 32K Bytes of segment 0, the first 32K Bytes of the Flash must then be enabled in segment 1. This is done by setting the ROMS1 bit of SYSCON to 0 before or simultaneously with setting of ROMEN bit. This must be done in the externally supplied program before the execution of the EINIT instruction. If program execution starts from external memory, but access to the Flash memory mapped in segment 0 is later required, then the code that performs the setting of ROMEN bit must be executed either in the segment 0 but above address 00'8000h, or from the internal RAM. Bit ROMS1 only affects the mapping of the first 32K Bytes of the Flash memory. All other parts of the Flash memory (addresses 01'8000h 04'FFFFh) remain unaffected. The SGTDIS Segmentation Disable / Enable must also be set to 0 to allow the use of the full 256K Bytes of on-chip memory in addition to the external boot memory. The correct procedure on changing the segmentation registers must also be observed to prevent an unwanted trap condition: - Instructions that configure the internal memory must only be executed from external memory or from the internal RAM. - An Absolute Inter-Segment Jump (JMPS) instruction must be executed after Flash enabling, to the next instruction, even if this next instruction is located in the consecutive address. - Whenever the internal Memory is disabled, enabled or remapped, the DPPs must be explicitly (re)loaded to enable correct data accesses to the internal memory and/or external memory. 5.5 - Application Examples 5.5.1 - Handling of Flash Addresses All command, Block, Data and register addresses to the Flash have to be located within the active Flash memory space. The active space is that address range to which the physical Flash addresses are mapped as defined by the user. When using data page pointer (DPP) for block addresses make sure that address bit A15 and A14 of the block address are reflected in both LSBs of the selected DPPS. Note: - For Command Instructions, address bit A14, A15, A16 and A17 are don't care. This simplify a lot the application software, because it minimize the use of DPP registers when using Command in the Command Interface. - Direct addressing is not allowed for Command sequence operations to the Flash. Only Register-indirect addressing can be used for command, block or write-data accesses. 25/160 ST10F269 5.5.2 - Basic Flash Access Control When accessing the Flash all command write addresses have to be located within the active Flash memory space. The active Flash memory space is that logical address range which is covered by the Flash after mapping. When using data page pointer (DPP) for addressing the Flash, make sure that address bit A15 and A14 of the command addresses are reflected in both LSBs of the selected data page pointer (A15 - DPPx.1 and A14 - DPPx.0). In case of the command write addresses, address bit A14, A15 and above are don't care. Thus, command writes can be performed by only using one DPP register. This allow to have a more simple and compact application software. Another - advantageous - possibility is to use the extended segment instruction for addressing. Note: The direct addressing mode is not allowed for write access to the Flash address/command register. Be aware that the C compiler may use this kind of addressing. For write accesses to Flash module always the indirect addressing mode has to be selected. The following basic instruction sequences show examples for different addressing possibilities. Principle example of address generation for Flash commands and registers: When using data page pointer (DPP0 is this example) MOV DPP0,#08h ;adjust data page pointers according to the ;addresses: DPP0 is used in this example, thus ;ADDRESS must have A14 and A15 bit set to `0'. ;ADDRESS could be a dedicated command sequence ;address 2AA8h, 1554h ... ) or the Flash write ;address ;DATA could be a dedicated command sequence data ;(xxA0h,xx80h ... ) or data to be programmed ;indirect addressing MOV Rwm,#ADDRESS MOV MOV Rwn,#DATA [Rwm],Rwn When using the extended segment instruction: MOV Rwm,#ADDRESS ;ADDRESS could be a dedicated command sequence ;address (2AA8h, 1554h ... ) or the Flash write ;address ;DATA could be a dedicated command sequence data ;(xxA0h,xx80h ... ) or data to be programmed ;the value of SEGMENT represents the segment ;number and could be 0, 1, 2, 3 or 4 (depending ;on sector mapping) for 256KByte Flash. ;the value of Rwn determines the 8-bit segment ;valid for the corresponding data access for any ;long or indirect address in the following(s) ;instruction(s). LENGTH defines the number of ;the effected instruction(s) and has to be a value ;between 1...4 ;indirect addressing with segment number from ;EXTS MOV MOV Rwo,#DATA Rwn,#SEGMENT EXTS Rwn,#LENGTH MOV [Rwm],Rwo 26/160 ST10F269 5.5.3 - Programming Examples Most of the microcontroller programs are written in the C language where the data page pointers are automatically set by the compiler. But because the C compiler may use the not allowed direct addressing mode for Flash write addresses, it is necessary to program the organisational Flash accesses (command sequences) with assembler in-line routines which use indirect addressing. Example 1 Performing the command Read/Reset We assume that in the initialization phase the lowest 32K Bytes of Flash memory (sector 0) have been mapped to segment 1. According to the usual way of ST10 data addressing with data page pointers, address bit A15 and A14 of a 16-bit command write address select the data page pointer (DPP) which contains the upper 10-bit for building the 24-bit physical data address. Address bit A13...A0 represent the address offset. As the bit A14...A17 are "don't care" when written a Flash command in the Command Interface (CI), we can choose the most conveniant DPPx register for address handling. The following examples are making usage of DPP0. We just have to make sure, that DPP0 points to active Flash memory space. To be independent of mapping of sector 0 we choose for all DPPs which are used for Flash address handling, to point to segment 2. For this reason we load DPP0 with value 08h (00 0000 l000b). MOV R5, #01554h ;load auxilary register R5 with command address ;(used in command cycle 1) MOV R6, #02AA8h ;load auxilary register R6 with command address ;(used in command cycle 2) SCXT DPPO, #08h ;push data page pointer 0 and load it to point to ;segment 2 MOV R7, #0A8h ;load register R7 with 1st CI enable command MOV [R5], R7 ;command cycle 1 MOV R7, #054h ;load register R7 with 2cd CI enable command MOV [R6], R7 ;command cycle 2 MOV R7, #0F0h ;load register R7 with Read/Reset command MOV [R5], R7 ;command cycle 3. Address is don't care POP DPP0 ;restore DPP0 value In the example above the 16-bit registers R5 and R6 are used as auxilary registers for indirect addressing. Example 2 Performing a Program Word command We assume that in the initialization phase the lowest 32K Bytes of Flash memory (sector 0) have been mapped to segment 1.The data to be written is loaded in register R13, the address to be programmed is loaded in register R11/R12 (segment number in R11, segment offset in R12). MOV R5, #01554h ;load auxilary register R5 with command address ;(used in command cycle 1) MOV R6, #02AA8h ;load auxilary register R6 with command address ;(used in command cycle 2) SXCT DPPO, #08h ;push data page pointer 0 and load it to point to ;segment 2 MOV R7, #0A8h ;load register R7 with 1st CI enable command MOV [R5], R7 ;command cycle 1 MOV R7, #054h ;load register R7 with 2cd CI enable command MOV [R6], R7 ;command cycle 2 MOV R7, #0A0h ;load register R7 with Program Word command MOV [R5], R7 ;command cycle 3 27/160 ST10F269 POP DPP0 ;restore DPP0: following addressing to the Flash ;will use EXTended instructions ;R11 contains the segment to be programmed ;R12 contains the segment offset address to be ;programmed ;R13 contains the data to be programmed EXTS MOV R11, #1 [R12], R13 ;use EXTended addressing for next MOV instruction ;command cycle 4: the EPC starts execution of ;Programming Command ;use EXTended addressing for next MOV instruction ;read Flash Status register (FSB) in R7 ;save it in R6 register ;Check if FSB.7 = Data.7 (i.e. R7.7 = R13.7) XOR JNB R7, R13 R7.7, Prog_OK ;Check if FSB.5 = 1 (Programming Error) JNB R6.5, Data_Polling ;Programming Error: verify is Flash programmed ;data is OK EXTS MOV XOR JNB R11, #1 R7, [R12] R7, R13 R7.7, Prog_OK ;Programming failed: Flash remains in Write ;Operation. ;To go back to normal Read operations, a Read/Reset ;command ;must be performed Prog_Error: MOV EXTS MOV ... ... ... ;When programming operation finished succesfully, ;Flash is set back automatically to normal Read Mode Prog_OK: .... .... R7, #0F0h R11, #1 [R12], R7 ;load register R7 with Read/Reset command ;use EXTended addressing for next MOV instruction ;address is don't care for Read/Reset command ;here place specific Error handling code ;use EXTended addressing for next MOV instruction ;read Flash Status register (FSB) in R7 ;Check if FSB.7 = Data.7 Data_Polling: EXTS MOV MOV R11, #1 R7, [R12] R6, R7 28/160 ST10F269 Example 3 Performing the Block Erase command We assume that in the initialization phase the lowest 32K Bytes of Flash memory (sector 0) have been mapped to segment 1.The registers R11/R12 contain an address related to the block to be erased (segment number in R11, segment offset in R12, for example R11 = 01h, R12= 4000h will erase the block 1 - first 8K byte block). MOV R5, #01554h ;load auxilary register R5 with command address ;(used in command cycle 1) MOV R6, #02AA8h ;load auxilary register R6 with command address ;(used in command cycle 2) SXCT DPPO, #08h ;push data page pointer 0 and load it to point ;to ;segment 2 MOV R7, #0A8h ;load register R7 with 1st CI enable command MOV [R5], R7 ;command cycle 1 MOV R7, #054h ;load register R7 with 2cd CI enable command MOV [R6], R7 ;command cycle 2 MOV R7, #080h ;load register R7 with Block Erase command MOV [R5], R7 ;command cycle 3 MOV R7, #0A8h ;load register R7 with 1st CI enable command MOV [R5], R7 ;command cycle 4 MOV R7, #054h ;load register R7 with 2cd CI enable command MOV [R6], R7 ;command cycle 5 POP DPP0 ;restore DPP0: following addressing to the Flash ;will use EXTended instructions ;R11 contains the segment of the block to be erased ;R12 contains the segment offset address of the ;block to be erased MOV R7, #030h ;load register R7 with erase confirm code EXTS R11, #1 ;use EXTended addressing for next MOV instruction MOV [R12], R7 ;command cycle 6: the EPC starts execution of ;Erasing Command Erase_Polling: EXTS R11, #1 ;use EXTended addressing for next MOV instruction MOV R7, [R12] ;read Flash Status register (FSB) in R7 ;Check if FSB.7 = `1' (i.e. R7.7 = `1') JB R7.7, Erase_OK ;Check if FSB.5 = 1 (Erasing Error) JNB R7.5, Erase_Polling ;Programming failed: Flash remains in Write ;Operation. ;To go back to normal Read operations, a Read/Reset ;command ;must be performed Erase_Error: MOV R7, #0F0h EXTS R11, #1 MOV [R12], R7 ... ... ... ;load register R7 with Read/Reset command ;use EXTended addressing for next MOV instruction ;address is don't care for Read/Reset command ;here place specific Error handling code ;When erasing operation finished succesfully, ;Flash is set back automatically to normal Read Mode Erase_OK: .... .... 29/160 ST10F269 5.6 - Bootstrap Loader The built-in bootstrap loader (BSL) of the ST10F269 provides a mechanism to load the startup program through the serial interface after reset. In this case, no external memory or internal Flash memory is required for the initialization code starting at location 00'0000h (see Figure 5). The bootstrap loader moves code/data into the internal RAM, but can also transfer data via the serial interface into an external RAM using a second level loader routine. Flash Memory (internal or external) is not necessary, but it may be used to provide lookup tables or "core-code" like a set of general purpose subroutines for I/O operations, number crunching, system initialization, etc. The bootstrap loader can be used to load the complete application software into ROMless systems, to load temporary software into complete systems for testing or calibration, or to load a programming routine for Flash devices. The BSL mechanism can be used for standard system startup as well as for special occasions like system maintenance (firmer update) or end-of-line programming or testing. Figure 5 : Bootstrap Loader Sequence RSTIN 5.6.1 - Entering the Bootstrap Loader The ST10F269 enters BSL mode when pin P0L.4 is sampled low at the end of a hardware reset. In this case the built-in bootstrap loader is activated independent of the selected bus mode. The bootstrap loader code is stored in a special Boot-ROM. No part of the standard mask Memory or Flash Memory area is required for this. After entering BSL mode and the respective initialization the ST10F269 scans the RXD0 line to receive a zero Byte, one start bit, eight `0' data bits and one stop bit. From the duration of this zero Byte it calculates the corresponding Baud rate factor with respect to the current CPU clock, initializes the serial interface ASC0 accordingly and switches pin TxD0 to output. Using this Baud rate, an identification Byte is returned to the host that provides the loaded data. This identification Byte identifies the device to be booted. The identification byte is D5h for ST10F269. P0L.4 1) 2) 4) RxD0 3) TxD0 5) CSP:IP 6) 1) BSL initialization time 2) Zero Byte (1 start bit, eight `0' data bits, 1 stop bit), sent by host. 3) Identification Byte (D5h), sent by ST10F269. 4) 32 Bytes of code / data, sent by host. 5) Caution: TxD0 is only driven a certain time after reception of the zero Byte. 6) Internal Boot ROM. Internal Boot Memory (BSL) routine 32 Byte user software 30/160 ST10F269 When the ST10F269 has entered BSL mode, the following configuration is automatically set (values that deviate from the normal reset values, are marked): Watchdog Timer: Context Pointer CP: Stack Pointer SP: Register S0CON: Register S0BG: Disabled FA00h FA40h Register SYSCON: Register STKUN: Register STKOV: Register BUSCON0: P3.10 / TXD0: 0E00h FA40h FA0Ch 0<->C acc. to startup configuration `1' `1' 8011h Acc. to `00' Byte DP3.10: In this case, the watchdog timer is disabled, so the bootstrap loading sequence is not time limited. Pin TXD0 is configured as output, so the ST10F269 can return the identification Byte. Even if the internal Flash is enabled, no code can be executed out of it. The hardware that activates the BSL during reset may be a simple pull-down resistor on P0L.4 for systems that use this feature upon every hardware reset. A switchable solution (via jumper or an external signal) can be used for systems that only temporarily use the bootstrap loader (see Figure 6). After sending the identification Byte the ASC0 receiver is enabled and is ready to receive the initial 32 Bytes from the host. A half duplex connection is therefore sufficient to feed the BSL. Figure 6 : Hardware Provisions to Activate the BSL 5.6.2 - Memory Configuration After Reset The configuration (and the accessibility) of the ST10F269's memory areas after reset in Bootstrap-Loader mode differs from the standard case. Pin EA is not evaluated when BSL mode is selected, and accesses to the internal Flash area are partly redirected, while the ST10F269 is in BSL mode (see Figure 7). All code fetches are made from the special Boot-ROM, while data accesses read from the internal user Flash. Data accesses will return undefined values on ROMless devices. The code in the Boot-ROM is not an invariant feature of the ST10F269. User software should not try to execute code from the internal Flash area while the BSL mode is still active, as these fetches will be redirected to the Boot-ROM. The Boot-ROM will also "move" to segment 1, when the internal Flash area is mapped to segment 1 (see Figure 7). External Signal POL.4 POL.4 Normal Boot BSL RPOL.4 8k RPOL.4 8k Circuit 2 Circuit 1 31/160 ST10F269 Figure 7 : Memory Configuration after Reset 16M Bytes Segment 255 external bus disabled Access to: Segment 255 external bus enabled 16M Bytes Access to: 16M Bytes Access: Segment 255 depends on reset config EA, Port0 2 1 IRAM 0 Test Flash BSL mode active EA pin Code fetch from internal Flash area Data fetch from internal Flash area 2 1 IRAM 0 2 1 IRAM internal Flash Flash enabled User Yes (P0L.4='0') High Test Flash internal Flash Flash enabled User Yes (P0L.4='0') Low 0 User Flash depends on reset config EA, Port0 No (P0L.4='1') Access to application User Flash access User Flash access Test-Flash access User Flash access Test-Flash access User Flash access 5.6.3 - Loading the Startup Code After sending the identification Byte the BSL enters a loop to receive 32 Bytes via ASC0. These Byte are stored sequentially into locations 00'FA40h through 00'FA5Fh of the internal RAM. So up to 16 instructions may be placed into the RAM area. To execute the loaded code the BSL then jumps to location 00'FA40h, which is the first loaded instruction. The bootstrap loading sequence is now terminated, the ST10F269 remains in BSL mode, however. Most probably the initially loaded routine will load additional code or data, as an average application is likely to require substantially more than 16 instructions. This second receive loop may directly use the pre-initialized interface ASC0 to receive data and store it to arbitrary user-defined locations. This second level of loaded code may be the final application code. It may also be another, more sophisticated, loader routine that adds a transmission protocol to enhance the integrity of the loaded code or data. It may also contain a code sequence to change the system configuration and enable the bus interface to store the received data into external memory. This process may go through several iterations or may directly execute the final application. In all cases the ST10F269 will still run in BSL mode, that means with the watchdog timer disabled and limited access to the internal Flash area. All code fetches from the internal Flash area (00'0000h...00'7FFFh or 01'0000h...01'7FFFh, if mapped to segment 1) are redirected to the special Boot-ROM. Data fetches access will access the internal Boot-ROM of the ST10F269, if any is available, but will return undefined data on ROMless devices. 5.6.4 - Exiting Bootstrap Loader Mode In order to execute a program in normal mode, the BSL mode must be terminated first. The ST10F269 exits BSL mode upon a software reset (ignores the level on P0L.4) or a hardware reset (P0L.4 must be high). After a reset the ST10F269 will start executing from location 00'0000h of the internal Flash or the external memory, as programmed via pin EA. 32/160 ST10F269 5.6.5 - Choosing the Baud Rate for the BSL The calculation of the serial Baud rate for ASC0 from the length of the first zero Byte that is received, allows the operation of the bootstrap loader of the ST10F269 with a wide range of Baud rates. However, the upper and lower limits have to be kept, in order to insure proper data transfer. BST10F269 = f CPU ----------------------------------------------32 x ( S0BRL + 1 ) Note: Function (FB) does not consider the tolerances of oscillators and other devices supporting the serial communication. This Baud rate deviation is a nonlinear function depending on the CPU clock and the Baud rate of the host. The maxima of the function (FB) increase with the host Baud rate due to the smaller Baud rate pre-scaler factors and the implied higher quantization error (see Figure 8). The minimum Baud rate (BLow in the Figure 8) is determined by the maximum count capacity of timer T6, when measuring the zero Byte, and it depends on the CPU clock. Using the maximum T6 count 216 in the formula the minimum Baud rate can be calculated. The lowest standard Baud rate in this case would be 1200 Baud. Baud rates below BLow would cause T6 to overflow. In this case ASC0 cannot be initialized properly. The maximum Baud rate (BHigh in the Figure 8) is the highest Baud rate where the deviation still does not exceed the limit, so all Baud rates between BLow and BHigh are below the deviation limit. The maximum standard Baud rate that fulfills this requirement is 19200 Baud. Higher Baud rates, however, may be used as long as the actual deviation does not exceed the limit. A certain Baud rate (marked 'I' in Figure 8) may violate the deviation limit, while an even higher Baud rate (marked 'II' in Figure 8) stays very well below it. This depends on the host interface. The ST10F269 uses timer T6 to measure the length of the initial zero Byte. The quantization uncertainty of this measurement implies the first deviation from the real Baud rate, the next deviation is implied by the computation of the S0BRL reload value from the timer contents. The formula below shows the association: f CPU 9 , T6 = -- x ----------------4 B Host T6 - 36 S0BRL = ------------------72 For a correct data transfer from the host to the ST10F269 the maximum deviation between the internal initialized Baud rate for ASC0 and the real Baud rate of the host should be below 2.5%. The deviation (FB, in percent) between host Baud rate and ST10F269 Baud rate can be calculated via the formula below: F -B B C ontr Ho st = ------------------------------------------- x 100 % , B B C ontr F 2.5 % B Figure 8 : Baud Rate Deviation Between Host and ST10F269 FB 2.5% I BLow BHigh II BHOST 33/160 ST10F269 6 - CENTRAL PROCESSING UNIT (CPU) The CPU includes a 4-stage instruction pipeline, a 16-bit arithmetic and logic unit (ALU) and dedicated SFRs. Additional hardware has been added for a separate multiply and divide unit, a bit-mask generator and a barrel shifter. Most of the ST10F269's instructions can be executed in one instruction cycle which requires 50ns at 40MHz CPU clock. For example, shift and rotate instructions are processed in one instruction cycle independent of the number of bits to be shifted. Multiple-cycle instructions have been optimized: branches are carried out in 2 cycles, 16 x 16-bit multiplication in 5 cycles and a 32/16-bit division in 10 cycles. The jump cache reduces the execution time of repeatedly performed jumps in a loop, from 2 cycles to 1 cycle. The CPU uses a bank of 16 word registers to run the current context. This bank of General Purpose Registers (GPR) is physically stored within the on-chip Internal RAM (IRAM) area. A Context Pointer (CP) register determines the base address of the active register bank to be accessed by the CPU. The number of register banks is only restricted by the available Internal RAM space. For easy parameter passing, a register bank may overlap others. A system stack of up to 1024 bytes is provided as a storage for temporary data. The system stack is allocated in the on-chip RAM area, and it is accessed by the CPU via the stack pointer (SP) register. Two separate SFRs, STKOV and STKUN, are implicitly compared against the stack pointer value upon each stack access for the detection of a stack overflow or underflow. Figure 9 : CPU Block Diagram (MAC Unit not included) 16 CPU SP STKOV STKUN 256K Byte Flash memory 32 PSW SYSCON BUSCON 0 BUSCON 1 BUSCON 2 BUSCON 3 BUSCON 4 Data Pg. Ptrs Exec. Unit Instr. Ptr 4-Stage Pipeline MDH MDL Mul./Div.-HW Bit-Mask Gen. General Purpose Registers R15 2K Byte Internal RAM Bank n ALU 16-Bit Barrel-Shift CP ADDRSEL 1 ADDRSEL 2 ADDRSEL 3 ADDRSEL 4 Code Seg. Ptr. R0 Bank i 16 Bank 0 34/160 ST10F269 The System Configuration Register SYSCON This bit-addressable register provides general system configuration and control functions. The reset value for register SYSCON depends on the state of the PORT0 pins during reset. SYSCON (FF12h / 89h) 15 14 STKSZ SFR 11 SGT DIS Reset Value: 0xx0h 7 6 CS CFG 13 12 ROM S1 10 ROM EN 9 BYT DIS 8 CLK EN 5 PWD CFG 4 OWD DIS 3 BDR STEN 2 XPEN 1 VISI BLE 0 XPERSHARE WR CFG RW RW RW RW1 RW1 RW RW1 RW RW RW RW RW RW RW Notes: 1. These bits are set directly or indirectly according to PORT0 and EA pin configuration during reset sequence. 2. Register SYSCON cannot be changed after execution of the EINIT instruction. Bit XPEN 0 1 BDRSTEN 0 1 OWDDIS 0 XBUS Peripheral Enable Bit Function Accesses to the on-chip X-Peripherals and their functions are disabled The on-chip X-Peripherals are enabled and can be accessed. Bidirectional Reset Enable RSTIN pin is an input pin only. SW Reset or WDT Reset have no effect on this pin RSTIN pin is a bidirectional pin. This pin is pulled low during 1024 TCL during reset sequence. Oscillator Watchdog Disable Control Oscillator Watchdog (OWD) is enabled. If PLL is bypassed, the OWD monitors XTAL1 activity. If there is no activity on XTAL1 for at least 1 s, the CPU clock is switched automatically to PLL's base frequency (2 to 10MHz). OWD is disabled. If the PLL is bypassed, the CPU clock is always driven by XTAL1 signal. The PLL is turned off to reduce power supply current.. Power Down Mode Configuration Control 1 PWDCFG 0 Power Down Mode can only be entered during PWRDN instruction execution if NMI pin is low, otherwise the instruction has no effect. To exit Power Down Mode, an external reset must occurs by asserting the RSTIN pin. Power Down Mode can only be entered during PWRDN instruction execution if all enabled fast external interrupt EXxIN pins are in their inactive level. Exiting this mode can be done by asserting one enabled EXxIN pin. Chip Select Configuration Control 1 CSCFG 0 1 Latched Chip Select lines: CSx change 1 TCL after rising edge of ALE Unlatched Chip Slect lines : CSx change with rising edge of ALE 6.1 - Multiplier-accumulator Unit (MAC) The MAC co-processor is a specialized co-processor added to the ST10 CPU Core in order to improve the performances of the ST10 Family in signal processing algorithms. Signal processing needs at least three specialized units operating in parallel to achieve maximum performance : - A Multiply-Accumulate Unit, - An Address Generation Unit, able to feed the MAC Unit with 2 operands per cycle, - A Repeat Unit, to execute series of multiply-accumulate instructions. The existing ST10 CPU has been modified to include new addressing capabilities which enable the CPU to supply the new co-processor with up to 2 operands per instruction cycle. This new co-processor (so-called MAC) contains a fast multiply-accumulate unit and a repeat unit. The co-processor instructions extend the ST10 CPU instruction set with multiply, multiply-accumulate, 32-bit signed arithmetic operations. A new transfer instruction CoMOV has also been added to take benefit of the new addressing capabilities. 35/160 ST10F269 6.1.1 - Features 6.1.1.1 - Enhanced Addressing Capabilities - New addressing modes including a double indirect addressing mode with pointer post-modification. - Parallel Data Move : this mechanism allows one operand move during Multiply-Accumulate instructions without penalty. - New tranfer instructions CoSTORE (for fast access to the MAC SFRs) and CoMOV (for fast memory to memory table transfer). 6.1.1.2 - Multiply-Accumulate Unit - One-cycle execution for all MAC operations. Figure 10 : MAC Unit Architecture Operand 1 GPR Pointers * IDX0 Pointer IDX1 Pointer QR0 GPR Offset Register QR1 GPR Offset Register QX0 IDX Offset Register QX1 IDX Offset Register Concatenation 32 Mux Sign Extend MRW 0h 40 Repeat Unit Interrupt Controller ST10 CPU MSW Flags MAE Control Unit 40 8-bit Left/Right Shifter Mux 40 Scaler 08000h 40 40 0h 40 40 Mux 40 16 x 16 signed/unsigned Multiplier 16 16 Operand 2 - 16 x 16-bit signed/unsigned parallel multiplier. - 40-bit signed arithmetic unit with automatic saturation mode. - 40-bit accumulator. - 8-bit left/right shifter. - Full instruction set with multiply and multiply-accumulate, 32-bit signed arithmetic and compare instructions. 6.1.1.3 - Program Control - Repeat Unit : allows some MAC co-processor instructions to be repeated up to 8192 times. Repeated instructions may be interrupted. - MAC interrupt (Class B Trap) on MAC condition flags. 32 MCW A B 40-bit Signed Arithmetic Unit 40 MAH MAL Note: * Shared with standard ALU. 36/160 ST10F269 6.2 - Instruction Set Summary The Table 4 lists the instructions of the ST10F269. The various addressing modes, instruction operation, parameters for conditional execution of instructions, opcodes and a detailed description of each instruction can be found in the "ST10 Family Programming Manual". Table 4 : Instruction Set Summary Mnemonic ADD(B) ADDC(B) SUB(B) SUBC(B) MUL(U) DIV(U) DIVL(U) CPL(B) NEG(B) AND(B) OR(B) XOR(B) BCLR BSET BMOV(N) BAND, BOR, BXOR BCMP BFLDH/L CMP(B) CMPD1/2 CMPI1/2 PRIOR SHL / SHR ROL / ROR ASHR MOV(B) MOVBS MOVBZ JMPA, JMPI, JMPR JMPS J(N)B JBC Add word (byte) operands Add word (byte) operands with Carry Subtract word (byte) operands Subtract word (byte) operands with Carry (Un)Signed multiply direct GPR by direct GPR (16-16-bit) (Un)Signed divide register MDL by direct GPR (16-/16-bit) (Un)Signed long divide reg. MD by direct GPR (32-/16-bit) Complement direct word (byte) GPR Negate direct word (byte) GPR Bit-wise AND, (word/byte operands) Bit-wise OR, (word/byte operands) Bit-wise XOR, (word/byte operands) Clear direct bit Set direct bit Move (negated) direct bit to direct bit AND/OR/XOR direct bit with direct bit Compare direct bit to direct bit Bit-wise modify masked high/low byte of bit-addressable direct word memory with immediate data Compare word (byte) operands Compare word data to GPR and decrement GPR by 1/2 Compare word data to GPR and increment GPR by 1/2 Determine number of shift cycles to normalize direct word GPR and store result in direct word GPR Shift left/right direct word GPR Rotate left/right direct word GPR Arithmetic (sign bit) shift right direct word GPR Move word (byte) data Move byte operand to word operand with sign extension Move byte operand to word operand with zero extension Jump absolute/indirect/relative if condition is met Jump absolute to a code segment Jump relative if direct bit is (not) set Jump relative and clear bit if direct bit is set Description Bytes 2/4 2/4 2/4 2/4 2 2 2 2 2 2/4 2/4 2/4 2 2 4 4 4 4 2/4 2/4 2/4 2 2 2 2 2/4 2/4 2/4 4 4 4 4 37/160 ST10F269 Table 4 : Instruction Set Summary Mnemonic JNBS CALLA, CALLI, CALLR CALLS PCALL TRAP PUSH, POP SCXT RET RETS RETP RETI SRST IDLE PWRDN SRVWDT DISWDT EINIT ATOMIC EXTR EXTP(R) EXTS(R) NOP Description Jump relative and set bit if direct bit is not set Call absolute/indirect/relative subroutine if condition is met Call absolute subroutine in any code segment Push direct word register onto system stack and call absolute subroutine Call interrupt service routine via immediate trap number Push/pop direct word register onto/from system stack Push direct word register onto system stack and update register with word operand Return from intra-segment subroutine Return from inter-segment subroutine Return from intra-segment subroutine and pop direct word register from system stack Return from interrupt service subroutine Software Reset Enter Idle Mode Enter Power Down Mode (supposes NMI-pin being low) Service Watchdog Timer Disable Watchdog Timer Signify End-of-Initialization on RSTOUT-pin Begin ATOMIC sequence Begin EXTended Register sequence Begin EXTended Page (and Register) sequence Begin EXTended Segment (and Register) sequence Null operation Bytes 4 4 4 4 2 2 4 2 2 2 2 4 4 4 4 4 4 2 2 2/4 2/4 2 6.3 - MAC Coprocessor Specific Instructions The following table gives an overview of the MAC instruction set. All the mnemonics are listed with the addressing modes that can be used with each instruction. For each combination of mnemonic and addressing mode this table indicates if it is repeatable or not. New addressing capabilities enable the CPU to supply the MAC with up to 2 operands per instruction cycle. MAC instructions: multiply, multiply-accumulate, 32-bit signed arithmetic operations and the CoMOV transfer instruction have been added to the standard instruction set. Full details are provided in the `ST10 Family Programming Manual'. Double indirect addressing requires two pointers. Any GPR can be used for one pointer, the other pointer is provided by one of two specific SFRs IDX0 and IDX1. Two pairs of offset registers QR0/QR1 and QX0/QX1 are associated with each pointer (GPR or IDXi). The GPR pointer allows access to the entire memory space, but IDXi are limited to the internal Dual-Port RAM, except for the CoMOV instruction. 38/160 ST10F269 Mnemonic CoMUL CoMULu CoMULus CoMULsu CoMULCoMULuCoMULusCoMULsuCoMUL, rnd CoMULu, rnd CoMULus, rnd CoMULsu, rnd CoMAC CoMACu CoMACus CoMACsu CoMACCoMACuCoMACusCoMACsuCoMAC, rnd CoMACu, rnd CoMACus, rnd CoMACsu, rnd CoMACR CoMACRu CoMACRus CoMACRsu CoMACR, rnd CoMACRu, rnd CoMACRus, rnd CoMACRsu, rnd [Rwm] CoNOP [IDXi] Addressing Modes Repeatability Rwn, Rwm [IDXi], [Rwm] Rwn, [Rwm] No No No Rwn, Rwm [IDXi], [Rwm] Rwn, [Rwm] No Yes Yes Rwn, Rwm [IDXi], [Rwn] Rwn, [RWm] No No No Yes Yes Yes No No Yes Yes [IDXi], [Rwm] CoNEG CoNEG, rnd CoRND CoSTORE CoMOV Rwn, CoReg [Rwn], Coreg [IDXi], [Rwm] - 39/160 ST10F269 Mnemonic CoMACM CoMACMu CoMACMus CoMACMsu CoMACMCoMACMuCoMACMusCoMACMsuCoMACM, rnd CoMACMu, rnd CoMACMus, rnd CoMACMsu, rnd CoMACMR CoMACMRu CoMACMRus CoMACMRsu CoMACMR, rnd CoMACMRu, rnd CoMACMRus, rnd CoMACMRsu, rnd CoADD CoADD2 CoSUB CoSUB2 CoSUBR CoSUB2R CoMAX CoMIN CoLOAD CoLOADCoLOAD2 CoLOAD2CoCMP CoSHL CoSHR CoASHR CoASHR, rnd Rwm #data4 [Rwm] Addressing Modes Repeatability [IDXi], [Rwm] Yes Rwn, Rwm [IDXi], [Rwm] Rwn, [Rwm] No Yes Yes Rwn, Rwm [IDXi], [Rwm] Rwn, [Rwm] No No No Yes No Yes CoABS Rwn, Rwm [IDXi], [Rwm] Rwn, [Rwm] No No No 40/160 ST10F269 The Table 5 shows the various combinations of pointer post-modification for each of these 2 new addressing modes. In this document the symbols "[Rwn]" and "[IDXi]" refer to these addressing modes. Table 5 : Pointer Post-modification Combinations for IDXi and Rwn Symbol "[IDXi]" stands for Mnemonic [IDXi] [IDXi+] [IDXi-] [IDXi + QXj] [IDXi - QXj] "[Rwn]" stands for [Rwn] [Rwn+] [Rwn-] [Rwn + QRj] [Rwn - QRj] (IDXi) (IDXi) (IDXi) (IDXi) + 2 (IDXi) (IDXi) - 2 (IDXi) (IDXi) + (QXj) (IDXi) (IDXi) - (QXj) (Rwn) (Rwn) (Rwn) (Rwn) + 2 (Rwn) (Rwn) - 2 (Rwn) (Rwn) + (QRj) (Rwn) (Rwn) - (QRj) Address Pointer Operation (no-op) (i=0,1) (i=0,1) (i, j =0,1) (i, j =0,1) (no-op) (n=0-15) (n=0-15) (n=0-15; j =0,1) (n=0-15; j =0,1) Table 6 : MAC Registers Referenced as `CoReg` Registers MSW MAH MAS MAL MCW MRW MAC-Unit Status Word MAC-Unit Accumulator High "limited" MAH /signed MAC-Unit Accumulator Low MAC-Unit Control Word MAC-Unit Repeat Word Description Address in Opcode 00000b 00001b 00010b 00100b 00101b 00110b 41/160 ST10F269 7 - EXTERNAL BUS CONTROLLER All of the external memory accesses are performed by the on-chip external bus controller. The EBC can be programmed to single chip mode when no external memory is required, or to one of four different external memory access modes: - 16- / 18- / 20- / 24-bit addresses and 16-bit data, demultiplexed - 16- / 18- / 20- / 24-bit addresses and 16-bit data, multiplexed - 16- / 18- / 20- / 24-bit addresses and 8-bit data, multiplexed - 16- / 18- / 20- / 24-bit addresses and 8-bit data, demultiplexed In demultiplexed bus modes addresses are output on PORT1 and data is input / output on PORT0 or P0L, respectively. In the multiplexed bus modes both addresses and data use PORT0 for input / output. Timing characteristics of the external bus interface (memory cycle time, memory tri-state time, length of ALE and read / write delay) are programmable giving the choice of a wide range of memories and external peripherals. Up to 4 independent address windows may be defined (using register pairs ADDRSELx / BUSCONx) to access different resources and bus characteristics. These address windows are arranged hierarchically where BUSCON4 overrides BUSCON3 and BUSCON2 overrides BUSCON1. All accesses to locations not covered by these 4 address windows are controlled by BUSCON0. Up to 5 external CS signals (4 windows plus default) can be generated in order to save external glue logic. Access to very slow memories is supported by a `Ready' function. A HOLD / HLDA protocol is available for bus arbitration which shares external resources with other bus masters. The bus arbitration is enabled by setting bit HLDEN in register PSW. After setting HLDEN once, pins P6.7...P6.5 (BREQ, HLDA, HOLD) are automatically controlled by the EBC. In master mode (default after reset) the HLDA pin is an output. By setting bit DP6.7 to'1' the slave mode is selected where pin HLDA is switched to input. This directly connects the slave controller to another master controller without glue logic. For applications which require less external memory space, the address space can be restricted to 1M Byte, 256K Bytes or to 64K Bytes. Port 4 outputs all 8 address lines if an address space of 16M Bytes is used, otherwise four, two or no address lines. Chip select timing can be made programmable. By default (after reset), the CSx lines change half a CPU clock cycle after the rising edge of ALE. With the CSCFG bit set in the SYSCON register the CSx lines change with the rising edge of ALE. The active level of the READY pin can be set by bit RDYPOL in the BUSCONx registers. When the READY function is enabled for a specific address window, each bus cycle within the window must be terminated with the active level defined by bit RDYPOL in the associated BUSCON register. 7.1 - Programmable Chip Select Timing Control The ST10F269 allows the user to adjust the position of the CSx line changes. By default (after reset), the CSx lines change half a CPU clock cycle (12.5ns at 40MHz of CPU clock) after the rising edge of ALE. With the CSCFG bit set in the SYSCON register the CSx lines change with the rising edge of ALE, thus the CSx lines and the address lines change at the same time (see Figure 11). 7.2 - READY Programmable Polarity The active level of the READY pin can be selected by software via the RDYPOL bit in the BUSCONx registers. When the READY function is enabled for a specific address window, each bus cycle within this window must be terminated with the active level defined by this RDYPOL bit in the associated BUSCON register. BUSCONx registers are described in Section 20.2 - System Configuration Registers. Note ST10F269 as no internal pull-up resistor on READY pin. 42/160 ST10F269 Figure 11 : Chip Select Delay Normal Demultiplexed Segment (P4) Address (P1) Bus Cycle ALE Lengthen Demultiplexed Bus Cycle ALE Normal CSx Unlatched CSx BUS (P0) Data Data RD BUS (P0) Data Data WR Read/Write Delay Read/Write Delay 43/160 ST10F269 8 - INTERRUPT SYSTEM The interrupt response time for internal program execution is from 125ns to 300ns at 40MHz CPU clock. The ST10F269 architecture supports several mechanisms for fast and flexible response to service requests that can be generated from various sources (internal or external) to the microcontroller. Any of these interrupt requests can be serviced by the Interrupt Controller or by the Peripheral Event Controller (PEC). In contrast to a standard interrupt service where the current program execution is suspended and a branch to the interrupt vector table is performed, just one cycle is `stolen' from the current CPU activity to perform a PEC service. A PEC service implies a single Byte or Word data transfer between any two memory locations with an additional increment of either the PEC source or destination pointer. An individual PEC transfer counter is implicitly decremented for each PEC service except when performing in the continuous transfer mode. When this counter reaches zero, a standard interrupt is performed to the corresponding source related vector location. PEC services are very well suited to perform the transmission or the reception of blocks of data. The ST10F269 has 8 PEC channels, each of them offers such fast interrupt-driven data transfer capabilities. EXISEL (F1DAh / EDh) 15 14 13 12 11 10 9 An interrupt control register which contains an interrupt request flag, an interrupt enable flag and an interrupt priority bit-field is dedicated to each existing interrupt source. Thanks to its related register, each source can be programmed to one of sixteen interrupt priority levels. Once starting to be processed by the CPU, an interrupt service can only be interrupted by a higher prioritized service request. For the standard interrupt processing, each of the possible interrupt sources has a dedicated vector location. Software interrupts are supported by means of the `TRAP' instruction in combination with an individual trap (interrupt) number. 8.1 - External Interrupts Fast external interrupt inputs are provided to service external interrupts with high precision requirements. These fast interrupt inputs feature programmable edge detection (rising edge, falling edge or both edges). Fast external interrupts may also have interrupt sources selected from other peripherals; for example the CANx controller receive signal (CANx_RxD) can be used to interrupt the system. This new function is controlled using the `External Interrupt Source Selection' register EXISEL. Reset Value: 0000h 6 5 4 3 2 1 0 ESFR 8 7 EXI7SS RW EXI6SS RW EXI5SS RW EXI4SS RW EXI3SS RW EXI2SS RW EXI1SS RW EXI0SS RW EXIxSS External Interrupt x Source Selection (x=7...0) `00': Input from associated Port 2 pin. `01': Input from "alternate source". `10': Input from Port 2 pin ORed with "alternate source". `11': Input from Port 2 pin ANDed with "alternate source". EXIxSS 0 1 2 3 4...7 Port 2 pin P2.8 P2.9 P2.10 P2.11 P2.12...15 Alternate Source CAN1_RxD CAN2_RxD RTCSI (Timed) RTCAI (Alarm) Not used (zero) 44/160 ST10F269 8.2 - Interrupt Registers and Vectors Location List Table 7 shows all the available ST10F269 interrupt sources and the corresponding hardware-related interrupt flags, vectors, vector locations and trap (interrupt) numbers: Table 7 : Interrupt Sources Source of Interrupt or PEC Service Request CAPCOM Register 0 CAPCOM Register 1 CAPCOM Register 2 CAPCOM Register 3 CAPCOM Register 4 CAPCOM Register 5 CAPCOM Register 6 CAPCOM Register 7 CAPCOM Register 8 CAPCOM Register 9 CAPCOM Register 10 CAPCOM Register 11 CAPCOM Register 12 CAPCOM Register 13 CAPCOM Register 14 CAPCOM Register 15 CAPCOM Register 16 CAPCOM Register 17 CAPCOM Register 18 CAPCOM Register 19 CAPCOM Register 20 CAPCOM Register 21 CAPCOM Register 22 CAPCOM Register 23 CAPCOM Register 24 CAPCOM Register 25 CAPCOM Register 26 CAPCOM Register 27 CAPCOM Register 28 CAPCOM Register 29 CAPCOM Register 30 CAPCOM Register 31 CAPCOM Timer 0 Request Flag CC0IR CC1IR CC2IR CC3IR CC4IR CC5IR CC6IR CC7IR CC8IR CC9IR CC10IR CC11IR CC12IR CC13IR CC14IR CC15IR CC16IR CC17IR CC18IR CC19IR CC20IR CC21IR CC22IR CC23IR CC24IR CC25IR CC26IR CC27IR CC28IR CC29IR CC30IR CC31IR T0IR Enable Flag CC0IE CC1IE CC2IE CC3IE CC4IE CC5IE CC6IE CC7IE CC8IE CC9IE CC10IE CC11IE CC12IE CC13IE CC14IE CC15IE CC16IE CC17IE CC18IE CC19IE CC20IE CC21IE CC22IE CC23IE CC24IE CC25IE CC26IE CC27IE CC28IE CC29IE CC30IE CC31IE T0IE Interrupt Vector CC0INT CC1INT CC2INT CC3INT CC4INT CC5INT CC6INT CC7INT CC8INT CC9INT CC10INT CC11INT CC12INT CC13INT CC14INT CC15INT CC16INT CC17INT CC18INT CC19INT CC20INT CC21INT CC22INT CC23INT CC24INT CC25INT CC26INT CC27INT CC28INT CC29INT CC30INT CC31INT T0INT Vector Location 00'0040h 00'0044h 00'0048h 00'004Ch 00'0050h 00'0054h 00'0058h 00'005Ch 00'0060h 00'0064h 00'0068h 00'006Ch 00'0070h 00'0074h 00'0078h 00'007Ch 00'00C0h 00'00C4h 00'00C8h 00'00CCh 00'00D0h 00'00D4h 00'00D8h 00'00DCh 00'00E0h 00'00E4h 00'00E8h 00'00ECh 00'00F0h 00'0110h 00'0114h 00'0118h 00'0080h Trap Number 10h 11h 12h 13h 14h 15h 16h 17h 18h 19h 1Ah 1Bh 1Ch 1Dh 1Eh 1Fh 30h 31h 32h 33h 34h 35h 36h 37h 38h 39h 3Ah 3Bh 3Ch 44h 45h 46h 20h 45/160 ST10F269 Table 7 : Interrupt Sources (continued) Source of Interrupt or PEC Service Request CAPCOM Timer 1 CAPCOM Timer 7 CAPCOM Timer 8 GPT1 Timer 2 GPT1 Timer 3 GPT1 Timer 4 GPT2 Timer 5 GPT2 Timer 6 GPT2 CAPREL Register A/D Conversion Complete A/D Overrun Error ASC0 Transmit ASC0 Transmit Buffer ASC0 Receive ASC0 Error SSC Transmit SSC Receive SSC Error PWM Channel 0...3 CAN1 Interface CAN2 Interface FLASH Ready / Busy PLL Unlock/OWD Request Flag T1IR T7IR T8IR T2IR T3IR T4IR T5IR T6IR CRIR ADCIR ADEIR S0TIR S0TBIR S0RIR S0EIR SCTIR SCRIR SCEIR PWMIR XP0IR XP1IR XP2IR XP3IR Enable Flag T1IE T7IE T8IE T2IE T3IE T4IE T5IE T6IE CRIE ADCIE ADEIE S0TIE S0TBIE S0RIE S0EIE SCTIE SCRIE SCEIE PWMIE XP0IE XP1IE XP2IE XP3IE Interrupt Vector T1INT T7INT T8INT T2INT T3INT T4INT T5INT T6INT CRINT ADCINT ADEINT S0TINT S0TBINT S0RINT S0EINT SCTINT SCRINT SCEINT PWMINT XP0INT XP1INT XP2INT XP3INT Vector Location 00'0084h 00'00F4h 00'00F8h 00'0088h 00'008Ch 00'0090h 00'0094h 00'0098h 00'009Ch 00'00A0h 00'00A4h 00'00A8h 00'011Ch 00'00ACh 00'00B0h 00'00B4h 00'00B8h 00'00BCh 00'00FCh 00'0100h 00'0104h 00'0108h 00'010Ch Trap Number 21h 3Dh 3Eh 22h 23h 24h 25h 26h 27h 28h 29h 2Ah 47h 2Bh 2Ch 2Dh 2Eh 2Fh 3Fh 40h 41h 42h 43h Hardware traps are exceptions or error conditions that arise during run-time. They cause immediate non-maskable system reaction similar to a standard interrupt service (branching to a dedicated vector table location). The occurrence of a hardware trap is additionally signified by an individual bit in the trap flag register (TFR). Except when another higher prioritized trap service is in progress, a hardware trap will interrupt any other program execution. Hardware trap services cannot not be interrupted by standard interrupt or by PEC interrupts. 8.3 - Interrupt Control Registers All interrupt control registers are identically organized. The lower 8 bits of an interrupt control register contain the complete interrupt status information of the associated source, which is 46/160 required during one round of prioritization, the upper 8 bits of the respective register are reserved. All interrupt control registers are bit-addressable and all bits can be read or written via software. This allows each interrupt source to be programmed or modified with just one instruction. When accessing interrupt control registers through instructions which operate on Word data types, their upper 8 bits (15...8) will return zeros, when read, and will discard written data. The layout of the Interrupt Control registers shown below applies to each xxIC register, where xx stands for the mnemonic for the respective source. ST10F269 xxIC (yyyyh / zzh) 15 14 13 12 11 10 9 - SFR Area 8 7 xxIR RW 6 xxIE RW 5 4 ILVL RW 3 Reset Value: - - 00h 2 1 GLVL RW 0 Bit GLVL Group Level Function Defines the internal order for simultaneous requests of the same priority. 3: Highest group priority 0: Lowest group priority ILVL Interrupt Priority Level Defines the priority level for the arbitration of requests. Fh: Highest priority level 0h: Lowest priority level xxIE Interrupt Enable Control Bit (individually enables/disables a specific source) `0': Interrupt Request is disabled `1': Interrupt Request is enabled xxIR Interrupt Request Flag `0': No request pending `1': This source has raised an interrupt request 8.4 - Exception and Error Traps List Table 8 shows all of the possible exceptions or error conditions that can arise during run-time : Table 8 : Trap Priorities Exception Condition Reset Functions: Hardware Reset Software Reset Watchdog Timer Overflow Class A Hardware Traps: Non-Maskable Interrupt Stack Overflow Stack Underflow Class B Hardware Traps: Undefined Opcode Protected Instruction Fault Illegal word Operand Access Illegal Instruction Access Illegal External Bus Access Reserved Software Traps TRAP Instruction NMI STKOF STKUF UNDOPC PRTFLT ILLOPA ILLINA ILLBUS Trap Flag Trap Vector RESET RESET RESET NMITRAP STOTRAP STUTRAP BTRAP BTRAP BTRAP BTRAP BTRAP Vector Location 00'0000h 00'0000h 00'0000h 00'0008h 00'0010h 00'0018h 00'0028h 00'0028h 00'0028h 00'0028h 00'0028h [002Ch - 003Ch] Any 0000h - 01FCh in steps of 4h Trap Number 00h 00h 00h 02h 04h 06h 0Ah 0Ah 0Ah 0Ah 0Ah [0Bh - 0Fh] Any [00h - 7Fh] Current CPU Priority Trap* Priority III III III II II II I I I I I * - All the class B traps have the same trap number (and vector) and the same lower priority compare to the class A traps and to the resets. - Each class A traps has a dedicated trap number (and vector). They are prioritized in the second priority level. - The resets have the highest priority level and the same trap number. - The PSW.ILVL CPU priority is forced to the highest level (15) when these exeptions are serviced. 47/160 ST10F269 9 - CAPTURE/COMPARE (CAPCOM) UNITS The ST10F269 has two 16 channels CAPCOM units as described in Figure 12. These support generation and control of timing sequences on up to 32 channels with a maximum resolution of 200ns at 40MHz CPU clock. The CAPCOM units are typically used to handle high speed I/O tasks such as pulse and waveform generation, pulse width modulation (PMW), Digital to Analog (D/A) conversion, software timing, or time recording relative to external events. Four 16-bit timers (T0/T1, T7/T8) with reload registers provide two independent time bases for the capture/compare register array (See Figures 13 and 14). The input clock for the timers is programmable to several prescaled values of the internal system clock, or may be derived from an overflow/ underflow of timer T6 in module GPT2. This Figure 12 : CAPCOM Unit Block Diagram Reload Register TxREL x = 0, 7 provides a wide range of variation for the timer period and resolution and allows precise adjustments to application specific requirements. In addition, external count inputs for CAPCOM timers T0 and T7 allow event scheduling for the capture/compare registers relative to external events. Each of the two capture/compare register arrays contain 16 dual purpose capture/compare registers, each of which may be individually allocated to either CAPCOM timer T0 or T1 (T7 or T8, respectively), and programmed for capture or compare functions. Each of the 32 registers has one associated port pin which serves as an input pin for triggering the capture function, or as an output pin to indicate the occurrence of a compare event. Figure 12 shows the basic structure of the two CAPCOM units. CPU Clock 2n n = 3...10 Tx Input Control Interrupt Request CAPCOM Timer Tx TxIN Pin GPT2 Timer T6 Over / Underflow Pin Mode Control (Capture or Compare) 16 Capture inputs Compare outputs Sixteen 16-bit (Capture/Compare) Registers 16 Capture / Compare* Interrupt Requests Pin CPU Clock 2n n = 3...10 Ty Input Control GPT2 Timer T6 Over / Underflow Interrupt Request CAPCOM Timer Ty Reload Register TyREL y = 1, 8 * The CAPCOM2 unit provides 16 capture inputs, but only 12 compare outputs. CC24I to CC27I are inputs only. 48/160 ST10F269 Figure 13 : Block Diagram of CAPCOM Timers T0 and T7 Txl Input Control CPU Clock X MUX Interrupt Request Reload Register TxREL GPT2 Timer T6 Over / Underflow Edge Select CAPCOM Timer Tx TxIR TxR TxIN Pin Txl TxM Txl x = 0, 7 Figure 14 : Block Diagram of CAPCOM Timers T1 and T8 Txl Reload Register TxREL CPU Clock X MUX CAPCOM Timer Tx TxIR Interrupt Request GPT2 Timer T6 Over / Underflow TxM TxR x = 1, 8 Note: When an external input signal is connected to the input lines of both T0 and T7, these timers count the input signal synchronously. Thus the two timers can be regarded as one timer whose contents can be compared with 32 capture registers. When a capture/compare register has been selected for capture mode, the current contents of the allocated timer will be latched (captured) into the capture/compare register in response to an external event at the port pin which is associated with this register. In addition, a specific interrupt request for this capture/compare register is generated. Either a positive, a negative, or both a positive and a negative external signal transition at the pin can be selected as the triggering event. The contents of all registers which have been selected for one of the five compare modes are continuously compared with the contents of the allocated timers. When a match occurs between the timer value and the value in a capture /compare register, specific actions will be taken based on the selected compare mode (see Table 9). The input frequencies fTx, for the timer input selector Tx, are determined as a function of the CPU clocks. The timer input frequencies, resolution and periods which result from the selected pre-scaler option in TxI when using a 40MHz CPU clock are listed in the Table 10. The numbers for the timer periods are based on a reload value of 0000h. Note that some numbers may be rounded to 3 significant figures. 49/160 ST10F269 Table 9 : Compare Modes Compare Modes Mode 0 Mode 1 Mode 2 Mode 3 Double Register Mode Function Interrupt-only compare mode; several compare interrupts per timer period are possible Pin toggles on each compare match; several compare events per timer period are possible Interrupt-only compare mode; only one compare interrupt per timer period is generated Pin set `1' on match; pin reset `0' on compare time overflow; only one compare event per timer period is generated Two registers operate on one pin; pin toggles on each compare match; several compare events per timer period are possible. Table 10 : CAPCOM Timer Input Frequencies, Resolution and Periods Timer Input Selection TxI fCPU = 40MHz 000b Pre-scaler for fCPU Input Frequency Resolution Period 8 5MHz 200ns 13.1ms 001b 16 2.5MHz 400ns 26.2ms 010b 32 1.25MHz 0.8s 52.4ms 011b 64 625kHz 1.6s 104.8ms 100b 128 312.5kHz 3.2s 209.7ms 101b 256 156.25kHz 6.4s 419.4ms 110b 512 78.125kHz 12.8s 838.9ms 111b 1024 39.1kHz 25.6s 1.678s 50/160 ST10F269 10 - GENERAL PURPOSE TIMER UNIT The GPT unit is a flexible multifunctional timer/ counter structure which is used for time related tasks such as event timing and counting, pulse width and duty cycle measurements, pulse generation, or pulse multiplication. The GPT unit contains five 16-bit timers organized into two separate modules GPT1 and GPT2. Each timer in each module may operate independently in several different modes, or may be concatenated with another timer of the same module. 10.1 - GPT1 Each of the three timers T2, T3, T4 of the GPT1 module can be configured individually for one of four basic modes of operation: timer, gated timer, counter mode and incremental interface mode. In timer mode, the input clock for a timer is derived from the CPU clock, divided by a programmable prescaler. In counter mode, the timer is clocked in reference to external events. Pulse width or duty cycle measurement is supported in gated timer mode where the operation of a timer is controlled by the `gate' level on an external input pin. For these purposes, each timer has one associated port pin (TxIN) which serves as gate or clock input. Table 11 lists the timer input frequencies, resolution and periods for each pre-scaler option at 40MHz CPU clock. This also applies to the Gated Timer Mode of T3 and to the auxiliary timers T2 and T4 in Timer and Gated Timer Mode. The count direction (up/down) for each timer is programmable by software or may be altered dynamically by an external signal on a port pin (TxEUD). In Incremental Interface Mode, the GPT1 timers (T2, T3, T4) can be directly connected to the incremental position sensor signals A and B by their respective inputs TxIN and TxEUD. Direction and count signals are internally derived from these two input signals so that the contents of the respective timer Tx corresponds to the sensor position. The third position sensor signal TOP0 can be connected to an interrupt input. Timer T3 has output toggle latches (TxOTL) which changes state on each timer over flow / underflow. The state of this latch may be output on port pins (TxOUT) for time out monitoring of external hardware components, or may be used internally to clock timers T2 and T4 for high resolution of long duration measurements. In addition to their basic operating modes, timers T2 and T4 may be configured as reload or capture registers for timer T3. When used as capture or reload registers, timers T2 and T4 are stopped. The contents of timer T3 is captured into T2 or T4 in response to a signal at their associated input pins (TxIN). Timer T3 is reloaded with the contents of T2 or T4 triggered either by an external signal or by a selectable state transition of its toggle latch T3OTL. When both T2 and T4 are configured to alternately reload T3 on opposite state transitions of T3OTL with the low and high times of a PWM signal, this signal can be constantly generated without software intervention. Table 11 : GPT1 Timer Input Frequencies, Resolution and Periods Timer Input Selection T2I / T3I / T4I fCPU = 40MHz 000b Pre-scaler factor Input Freq Resolution Period maximum 8 5MHz 200ns 13.1ms 001b 16 2.5MHz 400ns 26.2ms 010b 32 1.25MHz 0.8s 52.4ms 011b 64 625kHz 1.6s 104.8ms 100b 128 312.5kHz 3.2s 209.7ms 101b 256 156.25kHz 6.4s 419.4ms 110b 512 78.125kHz 12.8s 838.9ms 111b 1024 39.1kHz 25.6s 1.678s 51/160 ST10F269 Figure 15 : Block Diagram of GPT1 T2EUD U/D GPT1 Timer T2 2 n=3...10 n CPU Clock T2IN T2 Mode Control Interrupt Request Reload Capture CPU Clock 2n n=3...10 T3IN T3EUD T3 Mode Control T3OUT GPT1 Timer T3 U/D Capture Reload T3OTL T4IN CPU Clock 2n n=3...10 T4 Mode Control Interrupt Request Interrupt Request GPT1 Timer T4 U/D T4EUD 10.2 - GPT2 The GPT2 module provides precise event control and time measurement. It includes two timers (T5, T6) and a capture/reload register (CAPREL). Both timers can be clocked with an input clock which is derived from the CPU clock via a programmable prescaler or with external signals. The count direction (up/down) for each timer is programmable by software or may additionally be altered dynamically by an external signal on a port pin (TxEUD). Concatenation of the timers is supported via the output toggle latch (T6OTL) of timer T6 which changes its state on each timer overflow/underflow. The state of this latch may be used to clock timer T5, or it may be output on a port pin (T6OUT). The overflow / underflow of timer T6 can additionally be used to clock the CAPCOM timers T0 or T1, and to cause a reload from the CAPREL register. The CAPREL register may capture the contents of timer T5 based on an external signal transition on the corresponding port pin (CAPIN), and timer T5 may optionally be cleared after the capture procedure. This allows absolute time differences to be measured or pulse multiplication to be performed without software overhead. The capture trigger (timer T5 to CAPREL) may also be generated upon transitions of GPT1 timer T3 inputs T3IN and/or T3EUD. This is advantageous when T3 operates in Incremental Interface Mode. Table 12 lists the timer input frequencies, resolution and periods for each pre-scaler option at 40MHz CPU clock. This also applies to the Gated Timer Mode of T6 and to the auxiliary timer T5 in Timer and Gated Timer Mode. Table 12 : GPT2 Timer Input Frequencies, Resolution and Period Timer Input Selection T5I / T6I fCPU = 40MHz 000b Pre-scaler factor Input Freq Resolution Period maximum 4 10MHz 100ns 6.55ms 001b 8 5MHz 200ns 13.1ms 010b 16 2.5MHz 400ns 26.2ms 011b 32 1.25MHz 0.8s 52.4ms 100b 64 625kHz 1.6s 104.8ms 101b 128 312.5kHz 3.2s 209.7ms 110b 256 156.25kHz 6.4s 419.4ms 111b 512 78.125kHz 12.8s 838.9ms 52/160 ST10F269 Figure 16 : Block Diagram of GPT2 T5EUD U/D CPU Clock T5IN 2 n=2...9 n T5 Mode Control GPT2 Timer T5 Clear Capture Interrupt Request CAPIN GPT2 CAPREL Interrupt Request Reload Interrupt Request T6IN CPU Clock 2n n=2...9 T6 Mode Control Toggle FF GPT2 Timer T6 U/D T60TL T6OUT to CAPCOM Timers T6EUD 53/160 ST10F269 11 - PWM MODULE The pulse width modulation module can generate up to four PWM output signals using edge-aligned or centre-aligned PWM. In addition, the PWM module can generate PWM burst signals and Figure 17 : Block Diagram of PWM Module PPx Period Register * single shot outputs. The Table 13 shows the PWM frequencies for different resolutions. The level of the output signals is selectable and the PWM module can generate interrupt requests. Comparator Match Clock 1 Clock 2 Input Control * PTx 16-bit Up/Down Counter Run Match Up/Down/ Clear Control Comparator Output Control Enable POUTx Shadow Register Write Control * User readable / writeable register PWx Pulse Width Register * Table 13 : PWM Unit Frequencies and Resolution at 40MHz CPU Clock Mode 0 CPU Clock/1 CPU Clock/64 Mode 1 CPU Clock/1 CPU Clock/64 Resolution 25ns 1.6s Resolution 25ns 1.6s 8-bit 156.25kHz 2.44Hz 8-bit 78.12kHz 1.22kHz 10-bit 39.1kHz 610Hz 10-bit 19.53kHz 305.17Hz 12-bit 9.77kHz 152.6Hz 12-bit 4.88kHz 76.29Hz 14-bit 2.44Hz 38.15Hz 14-bit 1.22kHz 19.07Hz 16-bit 610Hz 9.54Hz 16-bit 305.17Hz 4.77Hz 54/160 ST10F269 12 - PARALLEL PORTS 12.1 - Introduction The ST10F269 MCU provides up to 111 I/O lines with programmable features. These capabilities bring very flexible adaptation of this MCU to wide range of applications. ST10F269 has 9 groups of I/O lines gathered as following: - Port 0 is a 2 time 8-bit port named P0L (Low as less significant Byte) and P0H (high as most significant Byte) - Port 1 is a 2 time 8-bit port named P1L and P1H - Port 2 is a 16-bit port - Port 3 is a 15-bit port (P3.14 line is not implemented) - Port 4 is a 8-bit port - Port 5 is a 16-bit port input only - Port 6, Port 7 and Port 8 are 8-bit port These ports may be used as general purpose bidirectionnal input or output, software controlled with dedicated registers. For example the output drivers of six of the ports (2, 3, 4, 6, 7, 8) can be configured (bit-wise) for push-pull or open drain operation using ODPx registers. In addition, the sink and the source capability and the rise / fall time of the transition of the signal of some of the push-pull buffers can be programmed to fit the driving requirements of the application and to minimize EMI. This feature is implemented on Port 0, 1, 2, 3, 4, 6, 7 and 8 with the control registers POCONx. The output drivers capabilities of ALE, RD, WR control lines are programmable with the dedicated bits of POCON20 control register. The input threshold levels are programmable (TTL/CMOS) for 5 ports (2, 3, 4, 7, 8). The logic level of a pin is clocked into the input latch once per state time, regardless whether the port is configured for input or output. The threshold is selected with the PICON register control bits. A write operation to a port pin configured as an input causes the value to be written into the port output latch, while a read operation returns the latched state of the pin itself. A read-modify-write operation reads the value of the pin, modifies it, and writes it back to the output latch. Writing to a pin configured as an output (DPx.y=`1') causes the output latch and the pin to have the written value, since the output buffer is enabled. Reading this pin returns the value of the output latch. A read-modify-write operation reads the value of the output latch, modifies it, and writes it back to the output latch, thus also modifying the level at the pin. I/O lines support an alternate function which is detailed in the following description of each port. 55/160 56/160 Direction Control Registers 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 DP0L E E E - - - YYYYYYYY PICON - - - YY - YYYYY POCON0L 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 ST10F269 Data Input / Output Register Threshold / Open Drain Control Output Driver Control Register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 - - - YYYYYYYY 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 P0L - - - - - - - - YYYYYYYY P0H E - - - - - - - - YYYYYYYY DP0H E - - - - YYYYYYYY POCON0H - - - - YYYYYYYY P1L E E - - - - - - - - - YYYYYYYY DP1L - - - - YYYYYYYY POCON1L - - - - YYYYYYYY P1H E - - - - - - - YYYYYYYY DP1H E - - - - - - - - YYYYYYYY POCON1H - - - - - - - - YYYYYYYY P2 E Y Y Y Y Y Y YYYYYYYYYY DP2 Y Y Y Y Y Y YYYYYYYYYY ODP2 Y Y Y Y Y Y YYYYYYYYYY POCON2 E Y Y Y Y Y Y YYYYYYYYYY P3 E Y - Y Y Y Y YYYYYYYYYY DP3 ODP3 Y - Y Y Y Y YYYYYYYYYY - - Y - Y Y YYYYYYYYYY POCON3 E Y - Y Y Y Y YYYYYYYYYY P4 E Y Y Y Y Y Y YYYYYYYYYY P5DIDIS - - - - - - - - - YYYYYYYY DP4 - - - - YYYYYYYY ODP4 - - - - YY - - - - - - POCON4 E - - - - - - - - YYYYYYYY P5 Y Y Y Y Y Y YYYYYYYYYY P6 E - - - - - - - - - YYYYYYYY DP6 - - - - YYYYYYYY ODP6 - - - - YYYYYYYY POCON6 E - - - - - - - - YYYYYYYY Figure 18 : SFRs and Pins Associated with the Parallel Ports P7 E - - - - - - - - - YYYYYYYY DP7 - - - - YYYYYYYY ODP7 - - - - YYYYYYYY POCON7 E - - - - - - - - YYYYYYYY P8 E - - - - - - - - YYYYYYYY DP8 - - - - - - - - YYYYYYYY ODP8 - - - - - - - - YYYYYYYY POCON8 E - - - - - - - - YYYYYYYY PICON: POCON20 * E - - - - - - - - YYYYYYYY P2LIN P2HIN P3LIN P3HIN P4LIN P6LIN (to be implemented) P7LIN P8LIN * RD, WR, ALE lines only Y E : Bit has an I/O function : Bit has no I/O dedicated function or is not implemented : Register belongs to ESFR area ST10F269 12.2 - I/O's Special Features 12.2.1 - Open Drain Mode Some of the I/O ports of ST10F269 support the open drain capability. This programmable feature may be used with an external pull-up resistor, in order to get an AND wired logical function. This feature is implemented for ports P2, P3, P4, P6, P7 and P8 (see respective sections), and is controlled through the respective Open Drain Control Registers ODPx. These registers allow the individual bit-wise selection of the open drain mode for each port line. If the respective control bit ODPx.y is `0' (default after reset), the output driver is in the push-pull mode. If ODPx.y is `1', the open drain configuration is selected. Note that all ODPx registers are located in the ESFR space (See Figure 19). PICON (F1C4h / E2h) 15 14 13 12 11 10 9 - 12.2.2 - Input Threshold Control The standard inputs of the ST10F269 determine the status of input signals according to TTL levels. In order to accept and recognize noisy signals, CMOS-like input thresholds can be selected instead of the standard TTL thresholds for all pins of Port 2, Port 3, Port 4, Port 7 and Port 8. These special thresholds are defined above the TTL thresholds and feature a defined hysteresis to prevent the inputs from toggling while the respective input signal level is near the thresholds. The Port Input Control register PICON is used to select these thresholds for each Byte of the indicated ports, this means the 8-bit ports P4, P7 and P8 are controlled by one bit each while ports P2 and P3 are controlled by two bits each. All options for individual direction and output mode control are available for each pin, independent of the selected input threshold. The input hysteresis provides stable inputs from noisy or slowly changing external signals (See Figure 20). Reset Value: --00h 6 5 4 3 2 1 0 ESFR 8 7 P8LIN P7LIN RW RW P4LIN P3HIN P3LIN P2HIN P2LIN RW RW RW RW RW Bit PxLIN Port x Low Byte Input Level Selection 0: 1: PxHIN 0: 1: Function Pins Px.7...Px.0 switch on standard TTL input levels Pins Px.7...Px.0 switch on special threshold input levels Pins Px.15...Px.8 switch on standard TTL input levels Pins Px.15...Px.8 switch on special threshold input levels Port x High Byte Input Level Selection Figure 19 : Output Drivers in Push-pull Mode and in Open Drain Mode External Pullup Pin Pin Q Q Push-Pull Output Driver Open Drain Output Driver 57/160 ST10F269 Figure 20 : Hysteresis for Special Input Thresholds Hysteresis Input level Bit state 12.2.3 - Output Driver Control The port output control registers POCONx allow to select the port output driver characteristics of a port. The aim of these selections is to adapt the output drivers to the application's requirements, and to improve the EMI behaviour of the device. Two characteristics may be selected: Edge characteristic defines the rise/fall time for the respective output. Slow edges reduce the peak currents that are sinked/sourced when changing the voltage level of an external capacitive load. For a bus interface or pins that are changing at frequency higher than 1MHz, however, fast edges may still be required. Driver characteristic defines either the general driving capability of the respective driver, or if the POCONx (F0yyh / zzh) for 8-bit Ports 15 14 13 12 11 10 9 - driver strength is reduced after the target output level has been reached or not. Reducing the driver strength increases the output's internal resistance, which attenuates noise that is imported via the output line. For driving LEDs or power transistors, however, a stable high output current may still be required as described below. This rise / fall time of 4 I/O pads (a nibble) is selected using 2-bit named PNxEC. That means Port Nibble (x = nibble number, it could be 3 as for Port 2.15 to 2.12) Edge Characteristic. The sink / source capability of the same 4 I/O pads is selected using 2-bit named PNxDC. That means Port Nibble (x = nibble number) Drive Characteristic (See Table 14). Reset Value: --00h 6 RW 5 RW 4 3 RW 2 1 RW 0 PN1DC PN1EC PN0DC PN0EC ESFR 8 7 POCONx (F0yyh / zzh) for 16-bit Ports 15 RW Bit 14 13 RW 12 11 RW 10 9 RW PN3DC PN3EC PN2DC PN2EC ESFR 8 7 RW Function 6 5 RW 4 3 PN1DC PN1EC Reset Value: 0000h 2 RW 1 RW 0 PN0DC PN0EC PNxEC Port Nibble x Edge Characteristic (rise/fall time) 00: Fast edge mode, rise/fall times depend on the size of the driver. 01: Slow edge mode, rise/fall times ~60 ns 10: Reserved 11: Reserved Port Nibble x Driver Characteristic (output current) 00: High Current mode: Driver always operates with maximum strength. 01: Dynamic Current mode: Driver strength is reduced after the target level has been reached. 10: Low Current mode: Driver always operates with reduced strength. 11: Reserved PNxDC Note: In case of reading an 8 bit P0CONX register, high Byte ( bit 15..8) is read as 00h 58/160 ST10F269 The table lists the defined POCON registers and the allocation of control bit-fields and port pins. Table 14 : Port Control Register Allocation Control Register POCON0L POCON0H POCON1L POCON1H POCON2 POCON3 POCON4 POCON6 POCON7 POCON8 Physical Address F080h F082h F084h F086h F088h F08Ah F08Ch F08Eh F090h F092h 8-bit Address 40h 41h 42h 43h 44h 45h 46h 47h 48h 49h P2.15...12 P3.15, 3.13, 3.12 P2.11...8 P3.11...8 Controlled Port Nibble 3 2 1 P0L.7...4 P0H.7...4 P1L.7...4 P1H.7...4 P2.7...4 P3.7...4 P4.7...4 P6.7...4 P7.7...4 P8.7...4 0 P0L.3...0 P0H.3...0 P1L.3...0 P1H.3...0 P2.3...0 P3.3...0 P4.3...0 P6.3...0 P7.3...0 P8.3...0 Dedicated Pins Output Control Programmable pad drivers also are supported for the dedicated pins ALE, RD and WR. For these pads, a special POCON20 register is provided. POCON20 (F0AAh / 55h) 15 14 13 12 11 10 9 - ESFR 8 7 RW 6 5 RW 4 3 PN1DC PN1EC Reset Value: --00h 2 RW 1 RW 0 PN0DC PN0EC PN0EC RD, WR Edge Characteristic (rise/fall time) 00: Fast edge mode, rise/fall times depend on the size of the driver. 01: Slow edge mode, rise/fall times ~60 ns 10: Reserved 11: Reserved RD, WR Driver Characteristic (output current) 00: High Current mode: Driver always operates with maximum strength. 01: Dynamic Current mode: Driver strength is reduced after the target level has been reached. 10: Low Current mode: Driver always operates with reduced strength. 11: Reserved ALE Edge Characteristic (rise/fall time) 00: Fast edge mode, rise/fall times depend on the size of the driver. 01: Slow edge mode, rise/fall times ~60 ns 10: Reserved 11: Reserved ALE Driver Characteristic (output current) 00: High Current mode: Driver always operates with maximum strength. 01: Dynamic Current mode: Driver strength is reduced after the target level has been reached. 10: Low Current mode: Driver always operates with reduced strength. 11: Reserved 59/160 PN0DC PN1EC PN1DC ST10F269 12.2.4 - Alternate Port Functions Each port line has one associated programmable alternate input or output function. - PORT0 and PORT1 may be used as address and data lines when accessing external memory. - Port 2, Port 7 and Port 8 are associated with the capture inputs or compare outputs of the CAPCOM units and/or with the outputs of the PWM module. Port 2 is also used for fast external interrupt inputs and for timer 7 input. - Port 3 includes the alternate functions of timers, serial interfaces, the optional bus control signal BHE and the system clock output (CLKOUT). - Port 4 outputs the additional segment address bit A16 to A23 in systems where segmentation is enabled to access more than 64K Bytes of memory. - Port 5 is used as analog input channels of the A/D converter or as timer control signals. - Port 6 provides optional bus arbitration signals (BREQ, HLDA, HOLD) and chip select signals. If an alternate output function of a pin is to be used, the direction of this pin must be programmed for output (DPx.y=`1'), except for some signals that are used directly after reset and are configured automatically. Otherwise the pin remains in the high-impedance state and is not effected by the alternate output function. The respective port latch should hold a `1', because its output is ANDed with the alternate output data (except for PWM output signals). If an alternate input function of a pin is used, the direction of the pin must be programmed for input (DPx.y=`0') if an external device is driving the pin. The input direction is the default after reset. If no external device is connected to the pin, however, one can also set the direction for this pin to output. SINGLE_BIT: BSET BSET BIT_GROUP: BFLDH BFLDH P4.7 DP4.7 P4, #24H, #24H DP4, #24H, #24H In this case, the pin reflects the state of the port output latch. Thus, the alternate input function reads the value stored in the port output latch. This can be used for testing purposes to allow a software trigger of an alternate input function by writing to the port output latch. On most of the port lines, the application software must set the proper direction when using an alternate input or output function of a pin. This is done by setting or clearing the direction control bit DPx.y of the pin before enabling the alternate function. There are port lines, however, where the direction of the port line is switched automatically. For instance, in the multiplexed external bus modes of PORT0, the direction must be switched several times for an instruction fetch in order to output the addresses and to input the data. Obviously, this cannot be done through instructions. In these cases, the direction of the port line is switched automatically by hardware if the alternate function of such a pin is enabled. To determine the appropriate level of the port output latches check how the alternate data output is combined with the respective port latch output. There is one basic structure for all port lines supporting only one alternate input function. Port lines with only one alternate output function, however, have different structures. It has to be adapted to support the normal and the alternate function features. All port lines that are not used for these alternate functions may be used as general purpose I/O lines. When using port pins for general purpose output, the initial output value should be written to the port latch prior to enabling the output drivers, in order to avoid undesired transitions on the output pins. This applies to single pins as well as to pin groups (see examples below). ; Initial output level is "high" ; Switch on the output driver ; Initial output level is "high" ; Switch on the output drivers Note: When using several BSET pairs to control more pins of one port, these pairs must be separated by instructions, which do not apply to the respective port (See Chapter 6 - Central Processing Unit (CPU)). 60/160 ST10F269 12.3 - PORT0 The two 8-bit ports P0H and P0L represent the higher and lower part of PORT0, respectively. Both halves of PORT0 can be written (via a PEC transfer) without effecting the other half. P0L (FF00h / 80h) 15 14 13 12 11 10 9 8 - If this port is used for general purpose I/O, the direction of each line can be configured via the corresponding direction registers DP0H and DP0L. SFR 7 6 5 4 3 Reset Value: --00h 2 1 0 P0L.7 P0L.6 P0L.5 P0L.4 P0L.3 P0L.2 P0L.1 P0L.0 RW RW RW RW RW RW RW RW P0H (FF02h / 81h) 15 14 13 12 11 10 9 8 - SFR 7 6 5 4 3 Reset Value: --00h 2 1 0 P0H.7 P0H.6 P0H.5 P0H.4 P0H.3 P0H.2 P0H.1 P0H.0 RW RW RW RW RW RW RW RW P0X.y Port Data Register P0H or P0L Bit y ESFR 10 9 8 7 DP0L.7 RW 6 DP0L.6 RW 5 DP0L.5 RW 4 DP0L.4 RW 3 DP0L.3 RW 2 DP0L.2 RW DP0L (F100h / 80h) 15 14 13 12 11 - Reset Value: --00h 1 DP0L.1 RW 0 DP0L.0 RW DP0H (F102h / 81h) 15 14 13 12 11 10 9 8 7 6 ESFR 5 4 3 2 Reset Value: --00h 1 0 DP0H.7 DP0H.6 DP0H.5 DP0H.4 DP0H.3 DP0H.2 DP0H.1 DP0H.0 RW RW RW RW RW RW RW RW DP0X.y Port Direction Register DP0H or DP0L Bit y DP0X.y = 0: Port line P0X.y is an input (high-impedance) DP0X.y = 1: Port line P0X.y is an output 61/160 ST10F269 12.3.1 - Alternate Functions of PORT0 When an external bus is enabled, PORT0 is used as data bus or address/data bus. Note that an external 8-bit demultiplexed bus only uses P0L, while P0H is free for I/O (provided that no other bus mode is enabled). PORT0 is also used to select the system start-up configuration. During reset, PORT0 is configured to input, and each line is held high through an internal pull-up device. Each line can now be individually pulled to a low level (see Section 21.3 - DC Characteristics) through an external pull-down device. A default configuration is selected when the respective PORT0 lines are at a high level. Through pulling individual lines to a low level, this default can be changed according to the needs of the applications. The internal pull-up devices are designed in such way that an external pull-down resistors (see Data Sheet specification) can be used to apply a correct low level. These external pull-down resistors can remain connected to the PORT0 pins also during normal operation, however, care has to be taken in order to not disturb the normal function of PORT0 (this might be the case, for example, if the external resistor value is too low). Figure 21 : PORT0 I/O and Alternate Functions Alternate Function P0H.7 P0H.6 P0H.5 P0H.4 P0H.3 P0H.2 P0H.1 P0H.0 P0L.7 P0L.6 P0L.5 P0L.4 P0L.3 P0L.2 P0L.1 P0L.0 With the end of reset, the selected bus configuration will be written to the BUSCON0 register. The configuration of the high byte of PORT0, will be copied into the special register RP0H. This read-only register holds the selection for the number of chip selects and segment addresses. Software can read this register in order to react according to the selected configuration, if required. When the reset is terminated, the internal pull-up devices are switched off, and PORT0 will be switched to the appropriate operating mode. During external accesses in multiplexed bus modes PORT0 first outputs the 16-bit intra-segment address as an alternate output function. PORT0 is then switched to high-impedance input mode to read the incoming instruction or data. In 8-bit data bus mode, two memory cycles are required for word accesses, the first for the low Byte and the second for the high Byte of the Word. During write cycles PORT0 outputs the data Byte or Word after outputting the address. During external accesses in demultiplexed bus modes PORT0 reads the incoming instruction or data Word or outputs the data Byte or Word. a) b) D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 16-bit Demultiplexed Bus c) A15 A14 A13 A12 A11 A10 A9 A8 AD7 AD6 AD5 AD4 AD3 AD2 AD1 AD0 8-bit Multiplexed Bus d) AD15 AD14 AD13 AD12 AD11 AD10 AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 AD1 AD0 16-bit Multiplexed Bus P0H PORT0 P0L D7 D6 D5 D4 D3 D2 D1 D0 8-bit Demultiplexed Bus General Purpose Input/Output 62/160 ST10F269 When an external bus mode is enabled, the direction of the port pin and the loading of data into the port output latch are controlled by the bus controller hardware. The input of the port output Buffer is disconnected from the internal bus and is switched to the line labeled "Alternate Data Output" via a multiplexer. The alternate data can be the 16-bit intra-segment address or the 8/16-bit data information. The incoming data on PORT0 is read on the line Figure 22 : Block Diagram of a PORT0 Pin Write DP0H.y / DP0L.y "Alternate Data Input". While an external bus mode is enabled, the user software should not write to the port output latch, otherwise unpredictable results may occur. When the external bus modes are disabled, the contents of the direction register last written by the user becomes active. The Figure 22 shows the structure of a PORT0 pin. Alternate Direction 1 MUX Direction Latch Read DP0H.y / DP0L.y Alternate Function Enable Alternate Data Output Internal Bus Write P0H.y / P0L.y 0 1 Port Output Latch Port Data Output MUX 0 Output Buffer P0H.y P0L.y Read P0H.y / P0L.y Clock 1 MUX 0 Input Latch y = 7...0 63/160 ST10F269 12.4 - PORT1 The two 8-bit ports P1H and P1L represent the higher and lower part of PORT1, respectively. Both halves of PORT1 can be written (via a PEC transfer) without effecting the other half. If this port is used for general purpose I/O, the direction of each line can be configured via the corresponding direction registers DP1H and DP1L. P1L (FF04h / 82h) 15 14 13 12 11 10 9 8 - SFR 7 6 5 4 3 Reset Value: --00h 2 1 0 P1L.7 P1L.6 P1L.5 P1L4 P1L.3 P1L.2 P1L.1 P1L.0 RW RW RW RW RW RW RW RW P1H (FF06h / 83h) 15 14 13 12 11 10 9 8 - SFR 7 6 5 4 3 Reset Value: --00h 2 1 0 P1H.7 P1H.6 P1H.5 P1H.4 P1H.3 P1H.2 P1H.1 P1H.0 RW RW RW RW RW RW RW RW P1X.y Port Data Register P1H or P1L Bit y ESFR 11 10 9 8 7 6 5 4 3 2 DP1L (F104h / 82h) 15 14 13 12 - Reset Value: --00h 1 0 DP1L.7 DP1L.6 DP1L.5 DP1L.4 DP1L.3 DP1L.2 DP1L.1 DP1L.0 RW RW RW RW RW RW RW RW DP1H (F106h / 83h) 15 14 13 12 11 10 9 8 7 ESFR 6 5 4 3 2 Reset Value: --00h 1 0 DP1H.7 DP1H.6 DP1H.5 DP1H.4 DP1H.3 DP1H.2 DP1H.1 DP1H.0 RW RW RW RW RW RW RW RW DP1X.y Port Direction Register DP1H or DP1L Bit y DP1X.y = 0: Port line P1X.y is an input (high-impedance) DP1X.y = 1: Port line P1X.y is an output 12.4.1 - Alternate Functions of PORT1 When a demultiplexed external bus is enabled, PORT1 is used as address bus. Note: Demultiplexed bus modes use PORT1 as a 16-bit port. Otherwise all 16 port lines can be used for general purpose I/O. The upper 4 pins of PORT1 (P1H.7...P1H.4) are used as capture input lines (CC27IO...CC24IO). During external accesses in demultiplexed bus modes PORT1 outputs the 16-bit intra-segment address as an alternate output function. During external accesses in multiplexed bus modes, when no BUSCON register selects a demultiplexed bus mode, PORT1 is not used and is available for general purpose I/O. 64/160 ST10F269 Figure 23 : PORT1 I/O and Alternate Functions Alternate Function P1H.7 P1H.6 P1H.5 P1H.4 P1H.3 P1H.2 P1H.1 P1H.0 P1L.7 P1L.6 P1L.5 P1L.4 P1L.3 P1L.2 P1L.1 P1L.0 a) A15 A14 A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 8/16-bit Demultiplexed Bus b) CC27IO CC26IO CC25IO CC24IO P1H PORT1 P1L General Purpose Input/Output CAPCOM2 Capture Inputs only When an external bus mode is enabled, the direction of the port pin and the loading of data into the port output latch are controlled by the bus controller hardware. The input of the port Buffer latch is disconnected from the internal bus and is switched to the line labeled "Alternate Data Output" via a multiplexer. The alternate data is the 16-bit intra-segment Figure 24 : Block Diagram of a PORT1 Pin Write DP1H.y / DP1L.y "1" Direction Latch Read DP1H.y / DP1L.y Alternate Function Enable Alternate Data Output Internal Bus Write P1H.y / P1L.y address. While an external bus mode is enabled, the user software should not write to the port output latch, otherwise unpredictable results may occur. When the external bus modes are disabled, the contents of the direction register last written by the user becomes active. The Figure 24 shows the structure of a PORT1 pin. 1 MUX 0 1 Port Output Latch Port Data Output MUX 0 Output Buffer P1H.y P1L.y Read P1H.y / P1L.y Clock 1 MUX 0 Input Latch y = 7...0 65/160 ST10F269 12.5 - Port 2 If this 16-bit port is used for general purpose I/O, the direction of each line can be configured via the corresponding direction register DP2. Each port line can be switched into push/pull or open drain mode via the open drain control register ODP2. P2 (FFC0h / E0h) 15 14 13 12 11 10 9 P2.9 RW 8 P2.8 RW SFR 7 P2.7 RW 6 P2.6 RW 5 P2.5 RW 4 P2.4 RW 3 P2.3 RW Reset Value: 0000h 2 P2.2 RW 1 P2.1 RW 0 P2.0 RW P2.15 P2.14 P2.13 P2.12 P2.11 P2.10 RW RW RW RW RW RW P2.y Port Data Register P2 Bit y SFR 12 DP2 .12 RW 11 DP2 .11 RW 10 DP2 .10 RW 9 DP2 .9 RW 8 DP2 .8 RW 7 DP2 .7 RW 6 DP2 .6 RW 5 DP2 .5 RW 4 DP2 .4 RW 3 DP2 .3 RW DP2 (FFC2h / E1h) 15 DP2 .15 RW 14 DP2 .14 RW 13 DP2 .13 RW Reset Value: 0000h 2 DP2 .2 RW 1 DP2 .1 RW 0 DP2 .0 RW DP2.y Port Direction Register DP2 Bit y DP2.y = 0: Port line P2.y is an input (high-impedance) DP2.y = 1: Port line P2.y is an output ESFR 12 11 10 9 8 7 6 5 4 3 ODP2 (F1C2h / E1h) 15 14 13 Reset Value: 0000h 2 1 0 ODP2 ODP2 ODP2 ODP2 ODP2 ODP2 ODP2 ODP2 ODP2 ODP2 ODP2 ODP2 ODP2 ODP2 ODP2 ODP2 .15 RW .14 RW .13 RW .12 RW .11 RW .10 RW .9 RW .8 RW .7 RW .6 RW .5 RW .4 RW .3 RW .2 RW .1 RW .0 RW ODP2.y Port 2 Open Drain Control Register Bit y ODP2.y = 0: Port line P2.y output driver in push/pull mode ODP2.y = 1: Port line P2.y output driver in open drain mode When a Port 2 line is used as a compare output (compare modes 1 and 3), the compare event (or the timer overflow in compare mode 3) directly effects the port output latch. In compare mode 1, when a valid compare match occurs, the state of the port output latch is read by the CAPCOM control hardware via the line "Alternate Latch Data Input", inverted, and written back to the latch via the line "Alternate Data Output". The port output latch is clocked by the signal "Compare Trigger" which is generated by the CAPCOM unit. In compare mode 3, when a match occurs, the value '1' is written to the port output latch via the line "Alternate Data Output". When an overflow of the corresponding timer occurs, a '0' is written to the port output latch. In both cases, the output latch is clocked by the signal "Compare Trigger". 12.5.1 - Alternate Functions of Port 2 All Port 2 lines (P2.15...P2.0) serve as capture inputs or compare outputs (CC15IO...CC0IO) for the CAPCOM1 unit. When a Port 2 line is used as a capture input, the state of the input latch, which represents the state of the port pin, is directed to the CAPCOM unit via the line "Alternate Pin Data Input". If an external capture trigger signal is used, the direction of the respective pin must be set to input. If the direction is set to output, the state of the port output latch will be read since the pin represents the state of the output latch. This can be used to trigger a capture event through software by setting or clearing the port latch. Note that in the output configuration, no external device may drive the pin, otherwise conflicts would occur. 66/160 ST10F269 The direction of the pin should be set to output by the user, otherwise the pin will be in the high-impedance state and will not reflect the state of the output latch. As can be seen from the port structure in Figure 26, the user software always has free access to the port pin even when it is used as a compare output. This is useful for setting up the initial level of the pin when using compare mode 1 or the double-register mode. In these modes, unlike in compare mode 3, the pin is not set to a specific value when a compare match occurs, but is toggled instead. When the user wants to write to the port pin at the same time a compare trigger tries to clock the output latch, the write operation of the user software has priority. Each time a CPU write access to the port output latch occurs, the input Table 15 : Alternate Functions of Port 2 Port 2 Pin P2.0 P2.1 P2.2 P2.3 P2.4 P2.5 P2.6 P2.7 P2.8 P2.9 P2.10 P2.11 P2.12 P2.13 P2.14 P2.15 Alternate Function a) CC0IO CC1IO CC2IO CC3IO CC4IO CC5IO CC6IO CC7IO CC8IO CC9IO CC10IO CC11IO CC12IO CC13IO CC14IO CC15IO EX0IN EX1IN EX2IN EX3IN EX4IN EX5IN EX6IN EX7IN Alternate Function b) Alternate Function c) T7IN T7 External Count Input multiplexer of the port output latch is switched to the line connected to the internal bus. The port output latch will receive the value from the internal bus and the hardware triggered change will be lost. As all other capture inputs, the capture input function of pins P2.15...P2.0 can also be used as external interrupt inputs (200ns sample rate at 40MHz CPU clock). The upper eight Port 2 lines (P2.15...P2.8) also can serve as Fast External Interrupt inputs from EX0IN to EX7IN (Fast external interrupt sampling rate is 25ns at 40MHz CPU clock). P2.15 in addition serves as input for CAPCOM2 timer T7 (T7IN). The Table 15 summarizes the alternate functions of Port 2. Fast External Interrupt 0 Input Fast External Interrupt 1 Input Fast External Interrupt 2 Input Fast External Interrupt 3 Input Fast External Interrupt 4 Input Fast External Interrupt 5 Input Fast External Interrupt 6 Input Fast External Interrupt 7 Input Figure 25 : Port 2 I/O and Alternate Functions Alternate Function P2.15 P2.14 P2.13 P2.12 P2.11 P2.10 P2.9 P2.8 P2.7 P2.6 P2.5 P2.4 P2.3 P2.2 P2.1 P2.0 a) CC15IO CC14IO CC13IO CC12IO CC11IO CC10IO CC9IO CC8IO CC7IO CC6IO CC5IO CC4IO CC3IO CC2IO CC1IO CC0IO CAPCOM1 Capture Input / Compare Output b) EX7IN EX6IN EX5IN EX4IN EX3IN EX2IN EX1IN EX0IN c) T7IN Port 2 General Purpose Input / Output Fast External Interrupt Input CAPCOM2 Timer T7 Input 67/160 ST10F269 The pins of Port 2 combine internal bus data with alternate data output before the port latch input. Figure 26 : Block Diagram of a Port 2 Pin Write ODP2.y Open Drain Latch Read ODP2.y Write DP2.y Direction Latch Internal Bus Read DP2.y 1 Alternate Data Output Write Port P2.y Compare Trigger Read P2.y Clock 1 MUX 0 Alternate Data Input Fast External Interrupt Input Input Latch MUX 0 Output Latch Output Buffer P2.y CCyIO EXxIN 1 x = 7...0 y = 15...0 68/160 ST10F269 12.6 - Port 3 If this 15-bit port is used for general purpose I/O, the direction of each line can be configured by the corresponding direction register DP3. Most port lines can be switched into push-pull or open drain P3 (FFC4h / E2h) 15 P3.15 RW 14 RW 13 12 11 10 9 P3.9 RW 8 P3.8 RW mode by the open drain control register ODP2 (pins P3.15, P3.14 and P3.12 do not support open drain mode). Due to pin limitations register bit P3.14 is not connected to an output pin. SFR 7 P3.7 RW 6 P3.6 RW 5 P3.5 RW 4 P3.4 RW 3 P3.3 RW Reset Value: 0000h 2 P3.2 RW 1 P3.1 RW 0 P3.0 RW P3.13 P3.12 P3.11 P3.10 RW RW RW RW P3.y Port Data Register P3 Bit y SFR 12 DP3 .12 RW 11 DP3 .11 RW 10 DP3 .10 RW 9 DP3 .9 RW 8 DP3 .8 RW 7 DP3 .7 RW 6 DP3 .6 RW 5 DP3 .5 RW 4 DP3 .4 RW 3 DP3 .3 RW DP3 (FFC6h / E3h) 15 DP3 .15 RW RW 14 13 DP3 .13 RW Reset Value: 0000h 2 DP3 .2 RW 1 DP3 .1 RW 0 DP3 .0 RW DP3.y Port Direction Register DP3 Bit y DP3.y = 0: Port line P3.y is an input (high-impedance) DP3.y = 1: Port line P3.y is an output ESFR 12 11 10 9 8 7 6 5 4 3 ODP3 (F1C6h / E3h) 15 14 13 ODP3 .13 RW RW RW RW Reset Value: 0000h 2 1 0 ODP3 ODP3 ODP3 ODP3 ODP3 ODP3 ODP3 ODP3 ODP3 ODP3 ODP3 ODP3 .11 RW .10 RW .9 RW .8 RW .7 RW .6 RW .5 RW .4 RW .3 RW .2 RW .1 RW .0 RW ODP3.y Port 3 Open Drain Control Register Bit y ODP3.y = 0: Port line P3.y output driver in push-pull mode ODP3.y = 1: Port line P3.y output driver in open drain mode 69/160 ST10F269 12.6.1 - Alternate Functions of Port 3 The pins of Port 3 serve for various functions which include external timer control lines, the two serial interfaces and the control lines BHE/WRH and CLKOUT. Table 16 : Port 3 Alternative Functions Port 3 Pin P3.0 P3.1 P3.2 P3.3 P3.4 P3.5 P3.6 P3.7 P3.8 P3.9 P3.10 P3.11 P3.12 P3.13 P3.14 P3.15 T0IN T6OUT CAPIN T3OUT T3EUD T4IN T3IN T2IN MRST MTSR TxD0 RxD0 BHE/WRH SCLK --CLKOUT Alternate Function CAPCOM1 Timer 0 Count Input Timer 6 Toggle Output GPT2 Capture Input Timer 3 Toggle Output Timer 3 External Up/Down Input Timer 4 Count Input Timer 3 Count Input Timer 2 Count Input SSC Master Receive / Slave Transmit SSC Master Transmit / Slave Receive ASC0 Transmit Data Output ASC0 Receive Data Input (Output in synchronous mode) Byte High Enable / Write High Output SSC Shift Clock Input/Output No pin assigned System Clock Output Figure 27 : Port 3 I/O and Alternate Functions Alternate Function No Pin P3.15 P3.13 P3.12 P3.11 P3.10 P3.9 P3.8 P3.7 P3.6 P3.5 P3.4 P3.3 P3.2 P3.1 P3.0 a) CLKOUT SCLK BHE RxD0 TxD0 MTSR MRST T2IN T3IN T4IN T3EUD T3OUT CAPIN T6OUT T0IN b) WRH Port 3 General Purpose Input/Output The structure of the Port 3 pins depends on their alternate function (see figures 28 and 29). When the on-chip peripheral associated with a Port 3 pin is configured to use the alternate input function, it reads the input latch, which represents the state of the pin, via the line labeled "Alternate Data Input". Port 3 pins with alternate input functions are: T0IN, T2IN, T3IN, T4IN, T3EUD and CAPIN. When the on-chip peripheral associated with a Port 3 pin is configured to use the alternate output function, its "Alternate Data Output" line is ANDed with the port output latch line. When using these alternate functions, the user must set the direction of the port line to output (DP3.y=1) and must set the port output latch (P3.y=1). Otherwise the pin is in its high-impedance state (when configured as input) or the pin is stuck at '0' (when the port output latch is cleared). When the alternate output functions are not used, the "Alternate Data Output" line is in its inactive state, which is a high level ('1'). 70/160 ST10F269 Port 3 pins with alternate output functions are: T6OUT, T3OUT, TxD0, BHE and CLKOUT. When the on-chip peripheral associated with a Port 3 pin is configured to use both the alternate input and output function, the descriptions above apply to the respective current operating mode. The direction must be set accordingly. Port 3 pins with alternate input/output functions are: MTSR, MRST, RxD0 and SCLK. Note: Enabling the CLKOUT function automatically enables the P3.15 output driver. Setting bit DP3.15='1' is not required. Figure 28 : Block Diagram of Port 3 Pin with Alternate Input or Alternate Output Function Write ODP3.y Open Drain Latch Read ODP3.y Internal Bus Write DP3.y Direction Latch Read DP3.y Write DP3.y Alternate Data Output Port Output Latch Read P3.y Port Data Output & Output Buffer P3.y Clock 1 MUX 0 Alternate Data Input Input Latch y = 13, 11...0 71/160 ST10F269 Pin P3.12 (BHE/WRH) is another pin with an alternate output function, however, its structure is slightly different. After reset the BHE or WRH function must be used depending on the system start-up configuration. In either of these cases, there is no possibility to program any port latches before. Thus, the appropriate alternate function is selected automatically. If BHE/WRH is not used in the system, this pin can be used for general purpose I/O by disabling the alternate function (BYTDIS = `1' / WRCFG='0'). Figure 29 : Block Diagram of Pins P3.15 (CLKOUT) and P3.12 (BHE/WRH) Write DP3.x "1" Direction Latch Read DP3.x Alternate Function Enable 1 MUX 0 Internal Bus Write P3.x Alternate Data Output 1 MUX 0 Output Buffer P3.12/BHE P3.15/CLKOUT Port Output Latch Read P3.x Clock 1 MUX 0 Input Latch x = 15, 12 Note: Enabling the BHE or WRH function automatically enables the P3.12 output driver. Setting bit DP3.12='1' is not required. During bus hold pin P3.12 is switched back to its standard function and is then controlled by DP3.12 and P3.12. Keep DP3.12 = '0' in this case to ensure floating in hold mode. 72/160 ST10F269 12.7 - Port 4 If this 8-bit port is used for general purpose I/O, the direction of each line can be configured via the corresponding direction register DP4. P4 (FFC8h / E4h) 15 14 13 12 11 10 9 8 - SFR 7 P4.7 RW 6 P4.6 RW 5 P4.5 RW 4 P4.4 RW 3 P4.3 RW Reset Value: --00h 2 P4.2 RW 1 P4.1 RW 0 P4.0 RW P4.y Port Data Register P4 Bit y SFR 12 11 10 9 8 7 6 5 4 3 DP4 (FFCAh / E5h) 15 14 13 - Reset Value: --00h 2 1 0 DP4.7 DP4.6 DP4.5 DP4.4 DP4.3 DP4.2 DP4.1 DP4.0 RW RW RW RW RW RW RW RW DP4.y Port Direction Register DP4 Bit y DP4.y = 0: Port line P4.y is an input (high-impedance) DP4.y = 1: Port line P4.y is an output For CAN configuration support (see section 15), Port 4 has an open drain function, controlled with the ODP4 register: ODP4 (F1CAh / E5h) 15 14 13 12 11 10 9 8 - ESFR 7 6 5 4 3 - Reset Value: --00h 2 1 0 - ODP4.7 ODP4.6 RW RW ODP4.y Port 4 Open Drain Control Register Bit y ODP4.y = 0: Port line P4.y output driver in push/pull mode ODP4.y = 1: Port line P4.y output driver in open drain mode if P4.y is not a segment address line output Note: Only bit 6 and 7 are implemented, all other bit will be read as "0". 73/160 ST10F269 12.7.1 - Alternate Functions of Port 4 During external bus cycles that use segmentation (address space above 64K Bytes) a number of Port 4 pins may output the segment address lines. The number of pins that is used for segment address output determines the external address space which is directly accessible. The other pins of Port 4 may be used for general purpose I/O. If segment address lines are selected, the alternate function of Port 4 may be necessary to access external memory directly after reset. For this reason Port 4 will be switched to this alternate function automatically. Table 17 : Port 4 Alternate Functions Port 4 P4.0 P4.1 P4.2 P4.3 P4.4 P4.5 P4.6 P4.7 Standard Function SALSEL = 01 64K Bytes GPIO GPIO GPIO GPIO GPIO/CAN2_RxD GPIO/CAN1_RxD GPIO/CAN1_TxD GPIO/CAN2_TxD Alternate Function SALSEL = 11 256K Bytes Segment Address A16 Segment Address A17 GPIO GPIO GPIO/CAN2_RxD GPIO/CAN1_RxD GPIO/CAN1_TxD GPIO/CAN2_TxD Alternate Function SALSEL = 00 1M Byte Segment. Address A16 Segment Address A17 Segment Address A18 Segment Address A19 GPIO/CAN2_RxD GPIO/CAN1_RxD GPIO/CAN1_TxD GPIO/CAN2_TxD Alternate Function SALSEL = 10 16M Bytes Segment Address A16 Segment Address A17 Segment Address A18 Segment Address A19 Segment Address A20 Segment Address A21 Segment Address A22 Segment Address A23 The number of segment address lines is selected via PORT0 during reset. The selected value can be read from bitfield SALSEL in register RP0H (read only) in order to check the configuration during run time. The CAN interfaces use 2 or 4 pins of Port 4 to interface each CAN Modules to an external CAN transceiver. In this case the number of possible segment address lines is reduced. The Table 17 summarizes the alternate functions of Port 4 depending on the number of selected segment address lines (coded via bitfield SALSEL) Figure 30 : Port 4 I/O and Alternate Functions Alternate Function a) b) Port 4 P4.7 P4.6 P4.5 P4.4 P4.3 P4.2 P4.1 P4.0 A23 A22 A21 A20 A19 A18 A17 A16 Segment Address Lines CAN2_TxD CAN1_TxD CAN1_RxD CAN2_RxD Cans I/O and General Purpose Input / Output General Purpose Input / Output 74/160 ST10F269 Figure 31 : Block Diagram of a Port 4 Pin Write DP4.y "1" Direction Latch Read DP4.y Alternate Function Enable 1 MUX 0 Internal Bus Write P4.y Alternate Data Output 1 MUX 0 P4.y Output Buffer Port Output Latch Read P4.y Clock 1 MUX 0 Input Latch y = 7...0 75/160 ST10F269 Figure 32 : Block Diagram of P4.4 and P4.5 Pins Write DP4.x "1" Direction Latch Read DP4.x "0" Alternate Function Enable Write P4.x 1 MUX 0 1 MUX 0 "0" 1 MUX 0 Internal Bus Alternate Data Output 1 MUX 0 Output Buffer P4.x Port Output Latch Read P4.x Clock 1 MUX 0 Input Latch CANy.RxD & XPERCON.a (CANyEN) x = 5, 4 y = 1, 2 (CAN Channel) z = 2, 1 a = 0, 1 b = 1, 0 XPERCON.b (CANzEN) 1 76/160 ST10F269 Figure 33 : Block Diagram of P4.6 and P4.7 Pins Write ODP4.x Open Drain Latch Read ODP4.x "0" 1 MUX 0 Write DP4.x "1" Direction Latch Read DP4.x "0" Alternate Function Enable Write P4.x Alternate Data Output 1 MUX 0 1 MUX Internal Bus 0 0 "1" 1 MUX 1 MUX 0 1 MUX 0 Output Buffer Clock P4.x Port Output Latch Read P4.x 1 MUX 0 CANy.TxD Data output XPERCON.a (CANyEN) Input Latch XPERCON.b (CANzEN) 1 x = 6, 7 y = 1, 2 (CAN Channel) z = 2, 1 a = 0, 1 b = 1, 0 12.8 - Port 5 This 16-bit input port can only read data. There is no output latch and no direction register. Data written to P5 will be lost. P5 (FFA2h / D1h) 15 14 13 12 11 10 9 P5.9 R 8 P5.8 R SFR 7 P5.7 R 6 P5.6 R 5 P5.5 R 4 P5.4 R 3 Reset Value: XXXXh 2 P5.2 R 1 P5.1 R 0 P5.0 R P5.15 P5.14 P5.13 P5.12 P5.11 P5.10 R R R R R R P5.3 R P5.y Port Data Register P5 Bit y (Read only) 77/160 ST10F269 12.8.1 - Alternate Functions of Port 5 Each line of Port 5 is also connected to one of the multiplexer of the Analog/Digital Converter. All port lines (P5.15...P5.0) can accept analog signals (AN15...AN0) to be converted by the ADC. No special programming is required for pins that Table 18 : Port 5 Alternate Functions Port 5 Pin P5.0 P5.1 P5.2 P5.3 P5.4 P5.5 P5.6 P5.7 P5.8 P5.9 P5.10 P5.11 P5.12 P5.13 P5.14 P5.15 Alternate Function a) Analog Input AN0 Analog Input AN1 Analog Input AN2 Analog Input AN3 Analog Input AN4 Analog Input AN5 Analog Input AN6 Analog Input AN7 Analog Input AN8 Analog Input AN9 Analog Input AN10 Analog Input AN11 Analog Input AN12 Analog Input AN13 Analog Input AN14 Analog Input AN15 T6EUD T5EUD T6IN T5IN T4EUD T2EUD Timer 6 external Up/Down Input Timer 5 external Up/Down Input Timer 6 Count Input Timer 5 Count Input Timer 4 external Up/Down Input Timer 2 external Up/Down Input Alternate Function b) shall be used as analog inputs. Some pins of Port 5 also serve as external timer control lines for GPT1 and GPT2. The Table 18 summarizes the alternate functions of Port 5. Figure 34 : Port 5 I/O and Alternate Functions Alternate Function P5.15 P5.14 P5.13 P5.12 P5.11 P5.10 P5.9 P5.8 P5.7 P5.6 P5.5 P5.4 P5.3 P5.2 P5.1 P5.0 a) AN15 AN14 AN13 AN12 AN11 AN10 AN9 AN8 AN7 AN6 AN5 AN4 AN3 AN2 AN1 AN0 A/D Converter Inputs b) T2EUD T4EUD T5IN T6IN T5EUD T6EUD Port 5 General Purpose Inputs Timer Inputs 78/160 ST10F269 Port 5 pins have a special port structure (see Figure 35), first because it is an input only port, and second because the analog input channels are directly connected to the pins rather than to the input latches. Figure 35 : Block Diagram of a Port 5 Pin Channel Select to Sample + Hold Circuit Read Port P5.y Clock Analog Switch P5.y/ANy Internal Bus Read Buffer Input Latch y = 15...0 12.8.2 - Port 5 Schmitt Trigger Analog Inputs A Schmitt trigger protection can be activated on each pin of Port 5 by setting the dedicated bit of register P5DIDIS. P5DIDIS (FFA4h / D2h) 15 14 13 12 11 10 9 8 SFR 7 6 5 4 3 Reset Value: 0000h 2 1 0 P5DI P5DI P5DI P5DI P5DI P5DI P5DI P5DI P5DI P5DI P5DI P5DI P5DI P5DI P5DI P5DI DIS.15 DIS.14 DIS.13 DIS.12 DIS.11 DIS.10 DIS.9 DIS.8 DIS.7 DIS.6 DIS.5 DIS.4 DIS.3 DIS.2 DIS.1 DIS.0 RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW P5DIDIS.y Port 5 Digital Disable Register Bit y P5DIDIS.y = 0: Port line P5.y digital input is enabled (Schmitt trigger enabled) P5DIDIS.y = 1: Port line P5.y digital input is disabled (Schmitt trigger disabled, necessary for input leakage current reduction) 12.9 - Port 6 If this 8-bit port is used for general purpose I/O, the direction of each line can be configured via the corresponding direction register DP6. Each port line can be switched into push/pull or open drain mode via the open drain control register ODP6. P6 (FFCCh / E6h) 15 14 13 12 11 10 9 8 - SFR 7 P6.7 RW 6 P6.6 RW 5 P6.5 RW 4 P6.4 RW 3 P6.3 RW Reset Value: --00h 2 P6.2 RW 1 P6.1 RW 0 P6.0 RW P6.y Port Data Register P6 Bit y SFR 12 11 10 9 8 7 6 5 4 3 DP6 (FFCEH / E7H) 15 14 13 - Reset Value: --00h 2 1 0 DP6.7 DP6.6 DP6.5 DP6.4 DP6.3 DP6.2 DP6.1 DP6.0 RW RW RW RW RW RW RW RW 79/160 ST10F269 DP6.y Port Direction Register DP6 Bit y DP6.y = 0: Port line P6.y is an input (high impedance) DP6.y = 1: Port line P6.y is an output ESFR 11 10 9 8 7 6 5 4 3 2 ODP6 (F1CEH / E7H) 15 14 13 12 - Reset Value: --00h 1 0 ODP6.7 ODP6.6 ODP6.5 ODP6.4 ODP6.3 ODP6.2 ODP6.1 ODP6.0 RW RW RW RW RW RW RW RW ODP6.y Port 6 Open Drain Control Register Bit y ODP6.y = 0: Port line P6.y output driver in push-pull mode ODP6.y = 1: Port line P6.y output driver in open drain mode 12.9.1 - Alternate Functions of Port 6 A programmable number of chip select signals (CS4...CS0) derived from the bus control registers (BUSCON4...BUSCON0) can be output on 5 pins of Port 6. The number of chip select signals is selected via PORT0 during reset. The selected value can be read from bit-field CSSEL in register RP0H (read only) in order to check the configuration during run time. The Table 19 summarizes the alternate functions of Port 6 depending on the number of selected chip select lines (coded via bit-field CSSEL). Table 19 : Port 6 Alternate Functions Port 6 P6.0 P6.1 P6.2 P6.3 P6.4 P6.5 P6.6 P6.7 Alternate Function CSSEL = 10 General General General General General purpose I/O purpose I/O purpose I/O purpose I/O purpose I/O Alternate Function CSSEL = 01 Chip select CS0 Chip select CS1 General purpose I/O General purpose I/O General purpose I/O Alternate Function CSSEL = 00 Chip select CS0 Chip select CS1 Chip select CS2 General purpose I/O General purpose I/O Alternate Function CSSEL = 11 Chip Chip Chip Chip Chip select select select select select CS0 CS1 CS2 CS3 CS4 HOLD External hold request input HLDA Hold acknowledge output BREQ Bus request output Figure 36 : Port 6 I/O and Alternate Functions Alternate Function a) Port 6 P6.7 P6.6 P6.5 P6.4 P6.3 P6.2 P6.1 P6.0 BREQ HLDA HOLD CS4 CS3 CS2 CS1 CS0 General Purpose Input/Output 80/160 ST10F269 The chip select lines of Port 6 have an internal weak pull-up device. This device is switched on during reset. This feature is implemented to drive the chip select lines high during reset in order to avoid multiple chip selection. After reset the CS function must be used, if selected so. In this case there is no possibility to program any port latches before. Thus the alternate function (CS) is selected automatically in this case. Note: The open drain output option can only be selected via software earliest during the initialization routine; at least signal CS0 will be in push/pull output driver mode directly after reset. Figure 37 : Block Diagram of Port 6 Pins with an Alternate Output Function Write ODP6.y Open Drain Latch Read ODP6.y "0" 1 MUX 0 Write DP6.y "1" Direction Latch Internal Bus 1 MUX 0 Read DP6.y Alternate Function Enable Write DP6.y Alternate Data Output Port Output Latch Read P6.y Clock 1 MUX 0 Input Latch y = (0...4, 6, 7) 1 MUX 0 Output Buffer P6.y 81/160 ST10F269 Figure 38 : Block Diagram of Pin P6.5 (HOLD) Write ODP6.5 Open Drain Latch Read ODP6.5 Write DP6.5 Internal Bus Direction Latch Read DP6.5 Write P6.5 Port Output Latch Read P6.5 Clock 1 MUX 0 Alternate Data Input Input Latch P6.5/HOLD Output Buffer 82/160 ST10F269 12.10 - Port 7 If this 8-bit port is used for general purpose I/O, the direction of each line can be configured via the corresponding direction register DP7. Each port line can be switched into push-pull or open drain mode via the open drain control register ODP7. P7 (FFD0h / E8h) 15 14 13 12 11 10 9 8 - SFR 7 P7.7 RW 6 P7.6 RW 5 P7.5 RW 4 P7.4 RW 3 P7.3 RW Reset Value: --00h 2 P7.2 RW 1 P7.1 RW 0 P7.0 RW P7.y Port Data Register P7 Bit y SFR 12 11 10 9 8 7 6 5 4 3 DP7 (FFD2h / E9h) 15 14 13 - Reset Value: --00h 2 1 0 DP7.7 DP7.6 DP7.5 DP7.4 DP7.3 DP7.2 DP7.1 DP7.0 RW RW RW RW RW RW RW RW DP7.y Port Direction Register DP7 Bit y DP7.y = 0: Port line P7.y is an input (high impedance) DP7.y = 1: Port line P7.y is an output ESFR 11 10 9 8 7 6 5 4 3 ODP7 (F1D2h / E9h) 15 14 13 12 - Reset Value: --00h 2 1 0 ODP7.7 ODP7.6 ODP7.5 ODP7.4 ODP7.3 ODP7.2 ODP7.1 ODP7.0 RW RW RW RW RW RW RW RW ODP7.y Port 7 Open Drain Control Register Bit y ODP7.y = 0: Port line P7.y output driver in push-pull mode ODP7.y = 1: Port line P7.y output driver in open drain mode 83/160 ST10F269 12.10.1 - Alternate Functions of Port 7 The upper 4 lines of Port 7 (P7.7...P7.4) serve as capture inputs or compare outputs (CC31IO...CC28IO) for the CAPCOM2 unit. The usage of the port lines by the CAPCOM unit, its accessibility via software and the precautions are the same as described for the Port 2 lines. As all other capture inputs, the capture input function of pins P7.7...P7.4 can also be used as external interrupt inputs (200ns sample rate at 40MHz CPU clock). Table 20 : Port 7 Alternate Functions Port 7 P7.0 P7.1 P7.2 P7.3 P7.4 P7.5 P7.6 P7.7 POUT0 POUT1 POUT2 POUT3 CC28IO CC29IO CC30IO CC31IO Alternate Function PWM mode channel 0 output PWM mode channel 1 output PWM mode channel 2 output PWM mode channel 3 output Capture input / compare output channel 28 Capture input / compare output channel 29 Capture input / compare output channel 30 Capture input / compare output channel 31 The lower 4 lines of Port 7 (P7.3...P7.0) serve as outputs from the PWM module (POUT3...POUT0). At these pins the value of the respective port output latch is EXORed with the value of the PWM output rather than ANDed, as the other pins do. This allows to use the alternate output value either as it is (port latch holds a `0') or to invert its level at the pin (port latch holds a `1'). Note that the PWM outputs must be enabled via the respective PENx bit in PWMCON1. The Table 20 summarizes the alternate functions of Port 7. Figure 39 : Port 7 I/O and Alternate Functions Port 7 P7.7 P7.6 P7.5 P7.4 P7.3 P7.2 P7.1 P7.0 CC31IO CC30IO CC29IO CC28IO POUT3 POUT2 POUT1 POUT0 Alternate Function General Purpose Input/Output 84/160 ST10F269 The structure of Port 7 differs in the way the output latches are connected to the internal bus and to the pin driver. Pins P7.3...P7.0 (POUT3...POUT0) Figure 40 : Block Diagram of Port 7 Pins P7.3...P7.0 Write ODP7.y EXOR the alternate data output with the port latch output, which allows to use the alternate data directly or inverted at the pin driver. Open Drain Latch Read ODP7.y Write DP7.y Direction Latch Internal Bus Read DP7.y Write DP7.y Alternate Data Output Port Output Latch Read P7.y Port Data Output =1 EXOR Output Buffer P7.y/POUTy Clock 1 MUX 0 Input Latch y = 0...3 85/160 ST10F269 Figure 41 : Block Diagram of Port 7 Pins P7.7...P7.4 Write ODP7.y Open Drain Latch Read ODP7.y Write DP7.y Direction Latch Internal Bus Read DP7.y 1 Alternate Data Output Write Port P7.y Compare Trigger Read P7.y Clock 1 MUX 0 Alternate Latch Data Input Alternate Pin Data Input Input Latch MUX 0 Output Latch Output Buffer P7.y CCzIO 1 y = (4...7) z = (28...31) 86/160 ST10F269 12.11 - Port 8 If this 8-bit port is used for general purpose I/O, the direction of each line can be configured via the P8 (FFD4h / EAh) 15 14 13 12 11 10 9 8 - corresponding direction register DP8. Each port line can be switched into push/pull or open drain mode via the open drain control register ODP8. SFR 7 P8.7 RW 6 P8.6 RW 5 P8.5 RW 4 P8.4 RW 3 P8.3 RW Reset Value: --00h 2 P8.2 RW 1 P8.1 RW 0 P8.0 RW P8.y Port Data Register P8 Bit y SFR 12 11 10 9 8 7 6 5 4 3 DP8 (FFD6h / EBh) 15 14 13 - Reset Value: --00h 2 1 0 DP8.7 DP8.6 DP8.5 DP8.4 DP8.3 DP8.2 DP8.1 DP8.0 RW RW RW RW RW RW RW RW DP8.y Port Direction Register DP8 Bit y DP8.y = 0: Port line P8.y is an input (high impedance) DP8.y = 1: Port line P8.y is an output ESFR 11 10 9 8 7 6 5 4 3 2 ODP8 (F1D6h / EBh) 15 14 13 12 - Reset Value: --00h 1 0 ODP8.7 ODP8.6 ODP8.5 ODP8.4 ODP8.3 ODP8.2 ODP8.1 ODP8.0 RW RW RW RW RW RW RW RW ODP8.y Port 8 Open Drain Control Register Bit y ODP8.y = 0: Port line P8.y output driver in push-pull mode ODP8.y = 1: Port line P8.y output driver in open drain mode 87/160 ST10F269 12.11.1 - Alternate Functions of Port 8 The 8 lines of Port 8 serve as capture inputs or as compare outputs (CC23IO...CC16IO) for the CAPCOM2 unit. The usage of the port lines by the CAPCOM unit, its accessibility via software and the precautions are the same as described for the Port 2 lines. Table 21 : Port 8 Alternate Functions Port 7 P8.0 P8.1 P8.2 P8.3 P8.4 P8.5 P8.6 P8.7 CC16IO CC17IO CC18IO CC19IO CC20IO CC21IO CC22IO CC23IO Alternate Function Capture input / compare output channel 16 Capture input / compare output channel 17 Capture input / compare output channel 18 Capture input / compare output channel 19 Capture input / compare output channel 20 Capture input / compare output channel 21 Capture input / compare output channel 22 Capture input / compare output channel 23 As all other capture inputs, the capture input function of pins P8.7...P8.0 can also be used as external interrupt inputs (200ns sample rate at 40MHz CPU clock). The Table 21 summarizes the alternate functions of Port 8. Figure 42 : Port 8 I/O and Alternate Functions Port 8 P8.7 P8.6 P8.5 P8.4 P8.3 P8.2 P8.1 P8.0 CC23IO CC22IO CC21IO CC20IO CC19IO CC18IO CC17IO CC16IO General Purpose Input / Output Alternate Function 88/160 ST10F269 The structure of Port 8 differs in the way the output latches are connected to the internal bus and to the pin driver (see Figure 43). Pins Figure 43 : Block Diagram of Port 8 Pins P8.7...P8.0 Write ODP8.y P8.7...P8.0 (CC23IO...CC16IO) combine internal bus data and alternate data output before the port latch input, as do the Port 2 pins. Open Drain Latch Read ODP8.y Write DP8.y Direction Latch Internal Bus Read DP8.y 1 Alternate Data Output Write Port P8.y Compare Trigger Read P8.y Clock 1 MUX 0 Alternate Latch Data Input Alternate Pin Data Input Input Latch MUX 0 Output Latch Output Buffer P8.y CCzIO 1 y = (7...0) z = (16...23) 89/160 ST10F269 13 - A/D CONVERTER A 10-bit A/D converter with 16 multiplexed input channels and a sample and hold circuit is integrated on-chip. The sample time (for loading the capacitors) and the conversion time is programmable and can be adjusted to the external circuitry. To remove high frequency components from the analog input signal, a low-pass filter must be connected at the ADC input. Overrun error detection / protection is controlled by the ADDAT register. Either an interrupt request is generated when the result of a previous conversion has not been read from the result register at the time the next conversion is complete, or the next conversion is suspended until the previous result has been read. For applications which require less than 16 analog input channels, the remaining channel inputs can be used as digital input port pins. The A/D converter of the ST10F269 supports different conversion modes : - Single channel single conversion : the analog level of the selected channel is sampled once and converted. The result of the conversion is stored in the ADDAT register. Single channel continuous conversion : the - analog level of the selected channel is repeatedly sampled and converted. The result of the conversion is stored in the ADDAT register. Table 22 : ADC Sample Clock and Conversion Clock Conversion Clock tCC ADCTC TCL1 = 1/2 x fXTAL 00 01 10 11 TCL x 24 Reserved, do not use TCL x 96 TCL x 48 At fCPU = 40MHz 0.3s Reserved 1.2 s 0.6 s 00 01 10 11 ADSTC tSC = tCC tCC x 2 tCC x 4 tCC x 8 At fCPU = 40MHz 0.3s 2 0.6s 2 1.2s 2 2.4s 2 Sample Clock tSC - Auto scan single conversion : the analog level of the selected channels are sampled once and converted. After each conversion the result is stored in the ADDAT register. The data can be transfered to the RAM by interrupt software management or using the powerfull Peripheral Event Controller (PEC) data transfert. - Auto scan continuous conversion : the analog level of the selected channels are repeatedly sampled and converted. The result of the conversion is stored in the ADDAT register. The data can be transfered to the RAM by interrupt software management or using the PEC data transfert. - Wait for ADDAT read mode : when using continuous modes, in order to avoid to overwrite the result of the current conversion by the next one, the ADWR bit of ADCON control register must be activated. Then, until the ADDAT register is read, the new result is stored in a temporary buffer and the conversion is on hold. - Channel injection mode : when using continuous modes, a selected channel can be converted in between without changing the current operating mode. The 10-bit data of the conversion are stored in ADRES field of ADDAT2. The current continuous mode remains active after the single conversion is completed. Notes: 1. Section 21.4.5 - Direct Drive for TCL definition. 2. tCC = TCL x 24 90/160 ST10F269 14 - SERIAL CHANNELS Serial communication with other microcontrollers, microprocessors, terminals or external peripheral components is provided by two serial interfaces: the asynchronous / synchronous serial channel (ASCO) and the high-speed synchronous serial channel (SSC). Two dedicated Baud rate generators set up all standard Baud rates without the requirement of oscillator tuning. For transmission, reception and erroneous reception, 3 separate interrupt vectors are provided for each serial channel. 14.1 - Asynchronous / Synchronous Serial Interface (ASCO) The asynchronous / synchronous serial interface (ASCO) provides serial communication between the ST10F269 and other microcontrollers, microprocessors or external peripherals. A set of registers is used to configure and to control the ASCO serial interface: - P3, DP3, ODP3 for pin configuration - SOBG for Baud rate generator - SOTBUF for transmit buffer - SOTIC for transmit interrupt control - SOTBIC for transmit buffer interrupt control - SOCON for control - SORBUF for receive buffer (read only) - SORIC for receive interrupt control - SOEIC for error interrupt control 14.1.1 - ASCO in Asynchronous Mode In asynchronous mode, 8 or 9-bit data transfer, parity generation and the number of stop bit can be selected. Parity framing and overrun error detection is provided to increase the reliability of data transfers. Transmission and reception of data is double-buffered. Full-duplex communication up to 1.25M Bauds (at 40MHz of fCPU) is supported in this mode. Figure 44 : Asynchronous Mode of Serial Channel ASC0 Reload Register CPU Clock 2 Baud Rate Timer 16 S0R S0M S0STP S0FE S0PE S0OE S0REN S0FEN S0PEN Input RXD0/P3.11 Pin S0OEN S0LB Clock S0RIR Receive Interrupt Request Transmit Interrupt Request Error Interrupt Request Serial Port Control S0TIR Shift Clock S0EIR 0 MUX 1 Sampling Receive Shift Register Transmit Shift Register Pin TXD0 / P3.10 Output Receive Buffer Register S0RBUF Transmit Buffer Register S0TBUF Internal Bus 91/160 ST10F269 Asynchronous Mode Baud rates For asynchronous operation, the Baud rate generator provides a clock with 16 times the rate of the established Baud rate. Every received bit is sampled at the 7th, 8th and 9th cycle of this clock. The Baud rate for asynchronous operation of serial channel ASC0 and the required reload value for a given Baud rate can be determined by the following formulas: (S0BRL) represents the content of the reload register, taken as unsigned 13-bit integer, (S0BRS) represents the value of bit S0BRS (`0' or `1'), taken as integer. fCPU BAsync = 16 x [2 + (S0BRS)] x [(S0BRL) + 1] fCPU S0BRL = ( 16 x [2 + (S0BRS)] x BAsync )-1 Using the above equation, the maximum Baud rate can be calculated for any given clock speed. Baud rate versus reload register value (SOBRS=0 and SOBRS=1) is described in Table 23. Table 23 : Commonly Used Baud Rates by Reload Value and Deviation Errors S0BRS = `0', fCPU = 40MHz Baud Rate (Baud) 1 250 000 112 000 56 000 38 400 19 200 9 600 4 800 2 400 1 200 600 300 153 Deviation Error 0.0% / 0.0% +1.5% / -7.0% +1.5% / -3.0% +1.7% / -1.4% +0.2% / -1.4% +0.2% / -0.6% +0.2% / -0.2% +0.2% / -0.0% 0.1% / 0.0% 0.0% / 0.0% 0.0% / 0.0% 0.0% / 0.0% Reload Value (hexa) 0000 / 0000 000A / 000B 0015 / 0016 001F / 0020 0040 / 0041 0081 / 0082 0103 / 0104 0207 / 0208 0410 / 0411 0822 / 0823 1045 / 1046 1FE8 / 1FE9 S0BRS = `1', fCPU = 40MHz Baud Rate (Baud) 833 333 112 000 56 000 38 400 19 200 9 600 4 800 2 400 1 200 600 300 102 Deviation Error 0.0% / 0.0% +6.3% / -7.0% +6.3% / -0.8% +3.3% / -1.4% +0.9% / -1.4% +0.9% / -0.2% +0.4% / -0.2% +0.1% / -0.2% +0.1% / -0.1% +0.1% / -0.0% 0.0% / 0.0% 0.0% / 0.0% Reload Value (hexa) 0000 / 0000 0006 / 0007 000D / 000E 0014 / 0015 002A / 002B 0055 / 0056 00AC / 00AD 015A / 015B 02B5 / 02B6 056B / 056C 0AD8 / 0AD9 1FE8 / 1FE9 Note: The deviation errors given in the Table 23 are rounded. To avoid deviation errors use a Baud rate crystal (providing a multiple of the ASC0/SSC sampling frequency). 92/160 ST10F269 14.1.2 - ASCO in Synchronous Mode In synchronous mode, data are transmitted or received synchronously to a shift clock which is generated by the ST10F269. Half-duplex communication up to 5M Baud (at 40MHz of fCPU) is possible in this mode. Figure 45 : Synchronous Mode of Serial Channel ASC0 Reload Register CPU Clock 2 Baud Rate Timer 4 S0R S0M = 000B S0OE S0REN Output TDX0/P3.10 Pin Input/Output RXD0/P3.11 Receive Pin 0 MUX 1 Receive Shift Register S0OEN S0LB Clock Serial Port Control Shift Clock S0RIR Receive Interrupt Request Transmit Interrupt Request Error Interrupt Request S0TIR S0EIR Transmit Shift Register Transmit Receive Buffer Register S0RBUF Transmit Buffer Register S0TBUF Internal Bus 93/160 ST10F269 Synchronous Mode Baud Rates For synchronous operation, the Baud rate generator provides a clock with 4 times the rate of the established Baud rate. The Baud rate for synchronous operation of serial channel ASC0 can be determined by the following formula: (S0BRL) represents the content of the reload register, taken as unsigned 13-bit integers, (S0BRS) represents the value of bit S0BRS (`0' or `1'), taken as integer. BSync = fCPU 4 x [2 + (S0BRS)] x [(S0BRL) + 1] fCPU )-1 S0BRL = ( 4 x [2 + (S0BRS)] x BSync Using the above equation, the maximum Baud rate can be calculated for any clock speed as given in Table 24. Table 24 : Commonly Used Baud Rates by Reload Value and Deviation Errors S0BRS = `0', fCPU = 40MHz Baud Rate (Baud) 5 000 000 112 000 56 000 38 400 19 200 9 600 4 800 2 400 1 200 900 612 Deviation Error 0.0% / 0.0% +1.5% / -0.8% +0.3% / -0.8% +0.2% / -0.6% +0.2% / -0.2% +0.2% / -0.0% +0.1% / -0.0% 0.0% / 0.0% 0.0% / 0.0% 0.0% / 0.0% 0.0% / 0.0% Reload Value (hexa) 0000 / 0000 002B / 002C 0058 / 0059 0081 / 0082 0103 / 0104 0207 / 0208 0410 / 0411 0822 / 0823 1045 / 1046 15B2 / 15B3 1FE8 / 1FE9 S0BRS = `1', fCPU = 40MHz Baud Rate (Baud) 3 333 333 112 000 56 000 38 400 19 200 9 600 4 800 2 400 1 200 600 407 Deviation Error 0.0% / 0.0% +2.6% / -0.8% +0.9% / -0.8% +0.9% / -0.2% +0.4% / -0.2% +0.1% / -0.2% +0.1% / -0.1% +0.1% / -0.0% 0.0% / 0.0% 0.0% / 0.0% 0.0% / 0.0% Reload Value (hexa) 0000 / 0000 001C / 001D 003A / 003B 0055 / 0056 00AC / 00AD 015A / 015B 02B5 / 02B6 056B / 056C 0AD8 / 0AD9 15B2 / 15B3 1FFD / 1FFE Note: The deviation errors given in the Table 24 are rounded. To avoid deviation errors use a Baud rate crystal (providing a multiple of the ASC0/SSC sampling frequency) 94/160 ST10F269 14.2 - High Speed Synchronous Serial Channel (SSC) The High-Speed Synchronous Serial Interface SSC provides flexible high-speed serial communication between the ST10F269 and other microcontrollers, microprocessors or external peripherals. The SSC supports full-duplex and half-duplex synchronous communication. The serial clock signal can be generated by the SSC itself (master mode) or be received from an external master (slave mode). Data width, shift direction, clock polarity and phase are programmable. This allows communication with SPI-compatible devices. Transmission and reception of data is double-buffered. A 16-bit Baud rate generator provides the SSC with a separate serial clock signal. The serial channel SSC has its own dedicated 16-bit Baud rate generator with 16-bit reload capability, allowing Baud rate generation independent from the timers. Figure 46 : Synchronous Serial Channel SSC Block Diagram CPU Clock Slave Clock Baud Rate Generator Clock Control Shift Clock Receive Interrupt Request Transmit Interrupt Request Error Interrupt Request SSC Control Block Master Clock Pin SCLK Status Control Pin Pin Control MTSR 16-Bit Shift Register Pin MRST Transmit Buffer Register SSCTB Receive Buffer Register SSCRB Internal Bus 95/160 ST10F269 Baud Rate Generation The Baud rate generator is clocked by fCPU/2. The timer is counting downwards and can be started or stopped through the global enable bit SSCEN in register SSCCON. Register SSCBR is the dual-function Baud Rate Generator/Reload register. Reading SSCBR, while the SSC is enabled, returns the content of the timer. Reading SSCBR, while the SSC is disabled, returns the programmed reload value. In this mode the desired reload value can be written to SSCBR. Note Never write to SSCBR, while the SSC is enabled. (SSCBR) represents the content of the reload register, taken as unsigned 16-bit integer. Table 25 lists some possible Baud rates against the required reload values and the resulting bit times for a 40MHz CPU clock. Table 25 : Synchronous Baud Rate and Reload Values Baud Rate Reserved use a reload value > 0. 10M Baud 5M Baud 2.5M Baud 1M Baud Bit Time --100ns 200ns 400ns 1s 10s 100s 1ms 3.26ms Reload Value --0001h 0003h 0007h 0013h 00C7h 07CFh 4E1Fh FF4Eh The formulas below calculate the resulting Baud rate for a given reload value and the required reload value for a given Baud rate: fCPU Baud rateSSC = 2 x [(SSCBR) + 1] fCPU SSCBR = ( )-1 2 x Baud rateSSC 100K Baud 10K Baud 1K Baud 306 Baud 96/160 ST10F269 15 - CAN MODULES The two integrated CAN modules (CAN1 and CAN2) are identical and handle the completely autonomous transmission and reception of CAN frames according to the CAN specification V2.0 part B (active). Each on-chip CAN module can receive and transmit standard frames with 11-bit identifiers as well as extended frames with 29-bit identifiers. These two CAN modules are both identical to the CAN module of the ST10F167. Because of duplication of the CAN controllers, the following adjustments are to be considered: - Same internal register addresses of both CAN controllers, but with base addresses differing in address bit A8; separate chip select for each CAN module. Refer to Chapter 4 - Memory Organization. - The CAN1 transmit line (CAN1_TxD) is the alternate function of the Port P4.6 pin and the receive line (CAN1_RxD) is the alternate function of the Port P4.5 pin. - The CAN2 transmit line (CAN2_TxD) is the alternate function of the Port P4.7 pin and the receive line (CAN2_RxD) is the alternate function of the Port P4.4 pin. - Interrupt request line of the CAN1 module is connected to the XBUS interrupt line XP0, interrupt of the CAN2 module is connected to the line XP1. - The CAN modules must be selected with corresponding CANxEN bit of XPERCON register before the bit XPEN of SYSCON register is set. - The reset default configuration is : CAN1 is enabled, CAN2 is disabled. 15.1 - CAN Modules Memory Mapping 15.1.1 - CAN1 Address range 00'EF00h - 00'EFFFh is reserved for the CAN1 Module access. CAN1 is enabled by setting XPEN bit 2 of the SYSCON register and by setting bit 0 of the XPERCON register. Accesses to the CAN Module use demultiplexed addresses and a 16-bit data bus (Byte accesses are possible). Two wait states give an access time of 125ns at 40MHz CPU clock. No tri-state wait states are used. 15.1.2 - CAN2 Address range 00'EE00h - 00'EEFFh is reserved for the CAN2 Module access. CAN2 is enabled by setting XPEN bit 2 of the SYSCON register and by setting bit 1 of the XPERCON register. Accesses to the CAN Module use demultiplexed addresses and a 16-bit data bus (Byte accesses are possible). Two wait states give an access time of 125ns at 40MHz CPU clock. No tri-state wait states are used. Note: If one or both CAN modules is used, Port 4 cannot be programmed to output all 8 segment address lines. Thus, only 4 segment address lines can be used, reducing the external memory space to 5M Bytes (1M Byte per CS line). 15.2 - CAN Bus Configurations Depending on application, CAN bus configuration may be one single bus with a single or multiple interfaces or a multiple bus with a single or multiple interfaces. The ST10F269 is able to support these 2 cases. Single CAN Bus The single CAN Bus multiple interfaces configuration may be implemented using 2 CAN transceives as shown in Figure 47. Figure 47 : Single CAN Bus Multiple Interfaces, Multiple Transceivers CAN1 RxD TxD CAN2 RxD TxD CAN Transceiver CAN_H CAN_H CAN Transceiver CAN bus 97/160 ST10F269 The ST10F269 also supports single CAN Bus multiple (dual) interfaces using the open drain option of the CANx_TxD output as shown in Figure 48. Thanks to the OR-Wired Connection, only one transceiver is required. In this case the design of the application must take in account the wire length and the noise environment. Figure 48 : Single CAN Bus, Dual Interfaces, Single Transceiver CAN1 RxD TxD CAN2 RxD TxD Multiple CAN Bus The ST10F269 provides 2 CAN interfaces to support such kind of bus configuration as shown in Figure 49. Figure 49 : Connection to Two Different CAN Buses (e.g. for gateway application) CAN1 RxD TxD +5V 2.7k CAN2 RxD TxD * * CAN Transceiver CAN_H CAN_H CAN bus 1 CAN Transceiver CAN Transceiver CAN_H CAN_H CAN bus CAN bus 2 * Open drain output 98/160 ST10F269 16 - REAL TIME CLOCK The Real Time Clock is an independent timer, which clock is directly derived from the clock oscillator on XTAL1 input so that it can keep on running even in Idle or Power down mode (if enabled to). Registers access is implemented onto the XBUS. This module is designed for the following purposes: - Generate the current time and date for the system - Cyclic time based interrupt, provides Port 2 external interrupts every second and every n seconds (n is programmable) if enabled. - 58-bit timer for long term measurement - Capable to exit the ST10 chip from power down mode (if PWDCFG of SYSCON set) after a programmed delay. The real time clock is base on two main blocks of counters. The first block is a prescaler which generates a basic reference clock (for example a 1 second period). This basic reference clock is coming out of a 20-bit DIVIDER (4-bit MSB RTCDH counter and 16-bit LSB RTCDL counter). This 20-bit counter is driven by an input clock derivated from the on-chip high frequency CPU clock, predivided by a 1/64 fixed counter (see Figure 51). This 20-bit counter is loaded at each basic reference clock period with the value of the 20-bit PRESCALER register (4-bit MSB RTCPH register and 16-bit LSB RTCPL register). The value of the 20-bit RTCP register determines the period of the basic reference clock. A timed interrupt request (RTCSI) may be sent on each basic reference clock period. The second block of the RTC is a 32-bit counter (16-bit RTCH and 16-bit RTCL). This counter may be initialized with the current system time. RTCH/RTCL counter is driven with the basic reference clock signal. In order to provide an alarm function the contents of RTCH/RTCL counter is compared with a 32-bit alarm register (16-bit RTCAH register and 16-bit RTCAL register). The alarm register may be loaded with a reference date. An alarm interrupt request (RTCAI), may be generated when the value of RTCH/RTCL counter matches the reference date of RTCAH/RTCAL register. The timed RTCSI and the alarm RTCAI interrupt requests can trigger a fast external interrupt via EXISEL register of port 2 and wake-up the ST10 chip when running power down mode. Using the RTCOFF bit of RTCCON register, the user may switch off the clock oscillator when entering the power down mode. Figure 50 : ESFRs and Port Pins Associated with the RTC EXISEL - - - YYYY - - - - CCxIC - - - YYYYYYYY EXISEL External Interrupt Source Selection register (Port 2) 1 second timed interrupt request (RTCSI) triggers firq[2] and alarm interrupt request (RTCAI) triggers firq[3] RTC data and control registers are implemented onto the XBUS. Figure 51 : RTC Block Diagram RTCAI RTCSI Clock Oscillator RTCCON AlarmIT Programmable ALARM Register Basic Clock IT Programmable PRESCALER Register RTCAH RTCAL RTCPH = Reload RTCPL RTCH RTCL RTCDH RTCDL /64 32 bit COUNTER 20 bit DIVIDER 99/160 ST10F269 16.1 - RTC registers 16.1.1 - RTCCON: RTC Control Register The functions of the RTC are controlled by the RTCCON control register. If the RTOFF bit is set, the RTC dividers and counters clock is disabled and registers can be written, when the ST10 chip enters power down mode the clock oscillator will be switch off. The RTC has 2 interrupt sources, one is triggered every basic clock period, the other one is the alarm. RTCCON includes an interrupt request flag and an interrupt enable bit for each of them. This register is read and written via the XBUS. RTCCON (EC00h) 15 14 13 12 11 10 9 8 7 RTCOFF RW XBUS 6 5 4 3 2 Reset Value: --00h 1 0 RTCAEN RTCAIR RTCSEN RTCSIR RW RW RW RW RTCOFF 2 RTC Switch Off Bit `0': clock oscillator and RTC keep on running even if ST10 in power down mode `1': clock oscillator is switch off if ST10 enters power down mode, RTC dividers and counters are stopped and registers can be written RTC Alarm Interrupt ENable `0': RTCAI is disabled `1': RTCAI is enabled, it is generated every n seconds RTC Alarm Interrupt Request flag (when the alarm is triggered) `0': the bit was reseted less than a n seconds ago `1': the interrupt was triggered RTC Second interrupt ENable `0': RTCSI is disabled `1': RTCSI is enabled, it is generated every second RTC Second Interrupt Request flag (every second) `0': the bit was reseted less than a second ago `1': the interrupt was triggered RTCAEN 2 RTCAIR 1 RTCSEN 2 RTCSIR 1 Notes: 1. As RTCCON register is not bit-addressable, the value of these bits must be read by checking their associated CCxIC register. The 2 RTC interrupt signals are connected to Port2 in order to trigger an external interrupt that wake up the chip when in power down mode. 2. All the bit of RTCCON are active high. 100/160 ST10F269 16.1.2 - RTCPH & RTCPL: RTC PRESCALER Registers The 20-bit programmable prescaler divider is loaded with 2 registers. The 4 most significant bit are stored into RTCPH and the 16 Less significant bit are stored in RTCPL. In order to keep the system clock, those registers are not reset. They are write protected by bit RTOFF of RTCCON register, write operation is allowed if RTOFF is set. RTCPL (EC06h) 15 14 13 12 11 10 9 XBUS 8 7 6 5 4 3 Reset Value: XXXXh 2 1 0 RTCPL RW RTCPH (EC08h) 15 14 13 12 11 10 9 XBUS 8 7 6 5 4 3 Reset Value: ---Xh 2 1 0 RESERVED RTCPH RW Figure 52 : PRESCALER Register 3 2 1 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 RTCPH RTCPL 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 20 bit word counter The value stored into RTCPH, RTCPL is called RTCP (coded on 20-bit). The dividing ratio of the prescalar divider is: ratio = 64 x (RTCP) 16.1.3 - RTCDH & RTCDL: RTC DIVIDER Counters Every basic reference clock the DIVIDER counters are reloaded with the value stored RTCPH and RTCPL registers. To get an accurate time measurement it is possible to read the value of the DIVIDER, reading the RTCDH, RTCDL. Those counters are read only. After any bit changed in the programmable PRESCALER register, the new value is loaded in the DIVIDER. RTCDL (EC0Ah) 15 14 13 12 11 10 9 XBUS 8 7 6 5 4 3 Reset Value: XXXXh 2 1 0 RTCDL R RTCDH (EC0Ch) 15 14 13 12 11 10 9 XBUS 8 7 6 5 4 3 Reset Value: ---Xh 2 1 0 RESERVED RTCDH R Note: Those registers are not reset, and are read only. 101/160 ST10F269 When RTCD increments to reach 00000h, The 20-bit word stored into RTCPH, RTCPL registers is loaded in RTCD. Figure 53 : DIVIDER Counters 3 2 1 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 RTCDH RTCDL 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 20 bit word internal value of the prescalar divider Bit 15 to bit 4 of RTCPH and RTCDH are not used. When reading, the return value of those bit will be zeros. 16.1.4 - RTCH & RTCL: RTC Programmable COUNTER Registers The RTC has 2 x 16-bit programmable counters which count rate is based on the basic time reference (for example 1 second). As the clock oscillator may be kept working, even in power down mode, the RTC counters may be used as a system clock. In addition RTC counters and registers are not modified at any system reset. The only way to force their value is to write them via the XBUS. Those counters are write protected as well. The bit RTOFF of the RTCCON register must be set (RTC dividers and counters are stopped) to enable a write operation on RTCH or RTCL. A write operation on RTCH or RTCL register loads directly the corresponding counter. When reading, the current value in the counter (system date) is returned. The counters keeps on running while the clock oscillator is working. RTCL (EC0Eh) 15 14 13 12 11 10 9 XBUS 8 RTCL RW 7 6 5 4 3 Reset Value: XXXXh 2 1 0 RTCH (EC10h) 15 14 13 12 11 10 9 XBUS 8 7 RTCH RW 6 5 4 3 Reset Value: XXXXh 2 1 0 Note: Those registers are nor reset 102/160 ST10F269 16.1.5 - RTCAH & RTCAL: RTC ALARM Registers When the programmable counters reach the 32-bit value stored into RTCAH & RTCAL registers, an alarm is triggered and the interrupt request RTAIR is generated. Those registers are not protected. RTCAL (EC12h) 15 14 13 12 11 10 9 XBUS 8 7 6 5 4 3 Reset Value: XXXXh 2 1 0 RTCAL RW RTCAH (EC14h) 15 14 13 12 11 10 9 XBUS 8 7 6 5 4 3 Reset Value: XXXXh 2 1 0 RTCAH RW Note: Those registers are not reset 16.2 - Programming the RTC RTC interrupt request signals are connected to Port2, pad 10 (RTCSI) and pad 11 (RTCAI). An alternate function Port2 is to generate fast interrupts firq[7:0]. To trigger firq[2] and firq[3] the following configuration has to be set. EXICON ESFR controls the external interrupt edge selection, RTC interrupt requests are rising edge active. EXICON (F1C0h) 15 14 13 12 11 10 9 ESFR 8 7 EXI3ES Reset Value: 0000h 6 12 5 EXI2ES 4 13 3 2 1 0 EXI7ES EXI6ES EXI5ES EXI4ES EXI1ES EXI0ES RW RW RW RW RW RW RW RW Notes: 1. EXI2ES and EXI3ES must be configured as "01b" because RCT interrupt request lines are rising edge active. 2. Alarm interrupt request line (RTCAI) is linked with EXI3ES. 3. Timed interrupt request line (RTCSI) is linked with EXI2ES. EXISEL ESFR enables the Port2 alternate sources. RTC interrupts are alternate sources 2 and 3. EXISEL (F1DAh) 15 14 13 12 11 10 9 ESFR 8 7 EXI3SS Reset Value: 0000h 6 2 5 EXI2SS 4 3 3 2 1 0 EXI7SS EXI6SS EXI5SS EXI4SS EXI1SS EXI0SS RW EXIxSS RW RW RW RW RW RW RW External Interrupt x Source Selection (x=7...0) `00': Input from associated Port 2 pin. `01': Input from "alternate source". 1 `10': Input from Port 2 pin ORed with "alternate source". 1 `11': Input from Port 2 pin ANDed with "alternate source". Notes: 1. Advised configuration. 2. Alarm interrupt request (RTCAI) is linked with EXI3SS. 3. Timed interrupt request (RTCSI) is linked with EXI2SS. 103/160 ST10F269 Interrupt control registers are common with CAPCOM1 Unit: CC10IC (RTCSI) and CC11IC (RTCAI). CCxIC 15 14 13 12 11 10 9 8 - SFR 7 6 5 4 ILVL RW 3 Reset Value: --00h 2 1 GLVL RW 0 CCxIR CCxIE RW RW CC10IC: FF8Ch/C6h CC11IC: FF8Eh/C7h Source of interrupt External interrupt 2 External interrupt 3 Request Flag CC10IR CC11IR Enable Flag CC10IE CC11IE Interrupt Vector CC10INT CC11INT Vector Location 00'0068h 00'006Ch Trap Number 1Ah/26 1Bh/27 104/160 ST10F269 17 - WATCHDOG TIMER The Watchdog Timer is a fail-safe mechanism which prevents the microcontroller from malfunctioning for long periods of time. The Watchdog Timer is always enabled after a reset of the chip and can only be disabled in the time interval until the EINIT (end of initialization) instruction has been executed. Therefore, the chip start-up procedure is always monitored. The software must be designed to service the watchdog timer before it overflows. If, due to hardware or software related failures, the software fails to do so, the watchdog timer overflows and generates an internal hardware reset. It pulls the RSTOUT pin low in order to allow external hardware components to be reset. Each of the different reset sources is indicated in the WDTCON register. The indicated bits are cleared with the EINIT instruction. The origine of the reset can be identified during the initialization phase. WDTCON (FFAEh / D7h) 15 14 13 12 11 10 9 8 7 - SFR 6 5 4 3 Reset Value: 00xxh 2 SWR HR 1 0 WDTREL RW WDTIN PONR LHWR SHWR HR HR HR WDTR WDTIN HR RW Watchdog Timer Input Frequency Selection `0': Input Frequency is fCPU/2. `1': Input Frequency is fCPU/128. WDTR1-3 Watchdog Timer Reset Indication Flag Set by the watchdog timer on an overflow. Cleared by a hardware reset or by the SRVWDT instruction. SWR1-3 Software Reset Indication Flag Set by the SRST execution. Cleared by the EINIT instruction. SHWR1-3 Short Hardware Reset Indication Flag Set by the input RSTIN. Cleared by the EINIT instruction. LHWR 1-3 Long Hardware Reset Indication Flag Set by the input RSTIN. Cleared by the EINIT instruction. PONR 1- 2-3 Power-On (Asynchronous) Reset Indication Flag Set by the input RSTIN if a power-on condition has been detected. Cleared by the EINIT instruction. Notes: 1. More than one reset indication flag may be set. After EINIT, all flags are cleared. 2. Power-on is detected when a rising edge from VDD = 0 V to VDD > 2.0 V is recognized on the internal 3.3V supply. 3. These bits cannot be directly modified by software. 105/160 ST10F269 The PONR flag of WDTCON register is set if the output voltage of the internal 3.3V supply falls below the threshold (typically 2V) of the power-on detection circuit. This circuit is efficient to detect major failures of the external 5V supply but if the internal 3.3V supply does not drop under 2 volts, the PONR flag is not set. This could be the case on fast switch-off / switch-on of the 5V supply. The time needed for such a sequence to activate the PONR flag depends on the value of the capacitors connected to the supply and on the exact value of the internal threshold of the detection circuit. Table 26 : WDTCON Bit Value on Different Resets Reset Source Power On Reset Power on after partial supply failure Long Hardware Reset Short Hardware Reset Software Reset Watchdog Reset Notes: 1. PONR bit may not be set for short supply failure. 2. For power-on reset and reset after supply partial failure, asynchronous reset must be used. PONR X 1) 2) LHWR X X X SHWR X X X X SWR X X X X X X WDTR X In case of bi-directional reset is enabled, and if the RSTIN pin is latched low after the end of the internal reset sequence, then a Short hardware reset, a software reset or a watchdog reset will trigger a Long hardware reset. Thus, Reset Indications flags will be set to indicate a Long Hardware Reset. The Watchdog Timer is 16-bit, clocked with the system clock divided by 2 or 128. The high Byte of the watchdog timer register can be set to a pre-specified reload value (stored in WDTREL). Each time it is serviced by the application software, the high byte of the watchdog timer is reloaded. For security, rewrite WDTCON each time before the watchdog timer is serviced The Table 27 shows the watchdog time range for 40MHz CPU clock. Table 27 : WDTREL Reload Value Prescaler for fCPU = 40MHz Reload value in WDTREL 2 (WDTIN = `0') FFh 00h 12.8s 3.276ms 128 (WDTIN = `1') 819.2ms 209.7ms The watchdog timer period is calculated with the following formula: P WD T 1 = -------------- x 512 x ( 1 + [ W DTIN ] x 63 ) x ( 256 - [ W DTREL ] ) f CPU 106/160 ST10F269 18 - SYSTEM RESET System reset initializes the MCU in a predefined state. There are five ways to activate a reset state. The system start-up configuration is different for each case as shown in Table 28. Table 28 : Reset Event Definition Reset Source Power-on reset Long Hardware reset (synchronous & asynchronous) Short Hardware reset (synchronous reset) Watchdog Timer reset Software reset Short-cut PONR LHWR SHWR WDTR SWR Conditions Power-on t RSTIN > 1040 TCL 4 TCL < t RSTIN < 1038 TCL WDT overflow SRST execution 18.1 - Long Hardware Reset The reset is triggered when RSTIN pin is pulled low, then the MCU is immediately forced in reset default state. It pulls low RSTOUT pin, it cancels pending internal hold states if any, it aborts external bus cycle, it switches buses (data, address and control signals) and I/O pin drivers to high-impedance, it pulls high PORT0 pins and the reset sequence starts. To get a long hardware reset, the duration of the external RSTIN signal must be longer than 1040 TCL. The level of RPD pin is sampled during the whole RSTIN pulse duration. A low level on RPD pin determines an asynchronous reset while a high level leads to a synchronous reset. Note A reset can be entered as synchronous and exit as asynchronous if VRPD voltage drops below the RPD pin threshold (typically 2.5V for VDD = 5V) when RSTIN pin is low or when RSTIN pin is internally pulled low. 18.1.1 - Asynchronous Reset Figure 54 and Figure 55 show asynchronous reset condition (RPD pin is at low level). Figure 54 : Asynchronous Reset Sequence External Fetch 1 CPU Clock 2 3 4 5 6 7 8 9 6 or 8 TCL1) RSTIN Asynchronous Reset Condition RPD RSTOUT 5 TCL ALE RD PORT0 Reset Configuration Latching point of PORT0 for system start-up configuration 1st Instruction External Fetch Internal reset EXTERNAL FETCH Note: 1) RSTIN rising edge to internal latch of PORT0 is 3 CPU clock cycles (6 TCL) if the PLL is bypassed and the prescaler is on (fCPU = fXTAL / 2), else it is 4 CPU clock cycles (8 TCL). 107/160 ST10F269 Figure 55 : Asynchronous Reset Sequence Internal Fetch 1 CPU Clock 6 or 8 TCL 1) Asynchronous Reset Condition Flash under reset for internal charge pump ramping up 2.5s max.2) RPD 2 3 RSTIN RSTOUT PORT0 Reset Configuration PLL factor latch command Latching point of PORT0 for PLL configuration Internal reset signal Latching point of PORT0 for remaining bits INTERNAL FETCH Flash read signal 1st fetch from Flash Note: 1) RSTIN rising edge to internal latch of PORT0 is 3 CPU clock cycles (6 TCL) if the PLL is bypassed and the prescaler is on (fCPU = fXTAL / 2), else it is 4 CPU clock cycles (8 TCL). 2) 2.1s typical value. Power-on reset The asynchronous reset must be used during the power-on of the MCU. Depending on the crystal frequency, the on-chip oscillator needs about 10ms to 50ms to stabilize. The logic of the MCU does not need a stabilized clock signal to detect an asynchronous reset, so it is suitable for power-on conditions. To ensure a proper reset sequence, the RSTIN pin and the RPD pin must be held at low level until the MCU clock signal is stabilized and the system configuration value on PORT0 is settled. Hardware reset The asynchronous reset must be used to recover from catastrophic situations of the application. It may be triggerred by the hardware of the application. Internal hardware logic and application circuitry are described in Section 18.6 - Reset Circuitry and Figure 58, Figure 59 and Figure 60. 18.1.2 - Synchronous Reset (RSTIN pulse > 1040TCL and RPD pin at high level) The synchronous reset is a warm reset. It may be generated synchronously to the CPU clock. To be detected by the reset logic, the RSTIN pulse must be low at least for 4 TCL (2 periods of CPU clock). Then the I/O pins are set to high impedance and RSTOUT pin is driven low. After the RSTIN level is detected, a short duration of 12 TCL (6 CPU clocks) maximum elapses, during which pending internal hold states are cancelled and the current internal access cycle, if any, is completed. External bus cycle is aborted. The internal pull-down of RSTIN pin is activated if bit BDRSTEN of SYSCON register was previously set by software. This bit is always cleared on power-on or after any reset sequence. The internal sequence lasts for 1024 TCL (512 periods of CPU clock). After this duration the pull-down of RSTIN pin for the bidirectional reset function is released and the RSTIN pin level is sampled. At this step the sequence lasts 1040 TCL (4 TCL + 12 TCL + 1024 TCL). If the RSTIN pin level is low, the reset sequence is extended until RSTIN level becomes high. Refer to Figure 56 Note If VRPD voltage drops below the RPD pin threshold (typically 2.5V for VDD = 5V) when RSTIN pin is low or when RSTIN pin is internally pulled low, the ST10 reset circuitry disables the bidirectional reset function and RSTIN pin is no more pulled low. The reset is processed as an asynchronous reset. 108/160 ST10F269 Figure 56 : Synchronous Reset Sequence External Fetch (RSTIN pulse > 1040 TCL) 4 TCL min. 12 TCL max. 1 CPU Clock 1024 TCL Internally pulled low 2) 6 or 8 TCL1) 2 3 4 5 6 7 8 9 RSTIN RPD 200A Discharge RSTOUT ALE If VRPD > 2.5V Asynchronous 3) Reset is not entered. 5 TCL RD PORT0 Reset Configuration Latching point of PORT0 Internal reset signal for system start-up configuration Note 1) RSTIN rising edge to internal latch of PORT0 is 3 CPU clock cycles (6 TCL) if the PLL is bypassed and the prescaler is on (fCPU = fXTAL / 2), else it is 4 CPU clock cycles (8 TCL). 2) RSTIN pin is pulled low if bit BDRSTEN (bit 3 of SYSCON register) was previously set by software. Bit BDRSTEN is cleared after reset. 3) If during the reset condition (RSTIN low), VRPD voltage drops below the threshold voltage (typically 2.5V for 5V operation), the the ST10 reset circuitry disables the bidirectional reset function and RSTIN pin is no more pulled low. 18.1.3 - Exit of Long Hardware Reset - If the RPD pin level is low when the RSTIN pin is sampled high, the MCU completes an asynchronous reset sequence. - If the RPD pin level is high when the RSTIN pin is sampled high, the MCU completes a synchronous reset sequence. The system configuration is latched from PORT0 after a duration of 8 TCL / 4 CPU clocks (6 TCL / 3 CPU clocks if PLL is bypassed) and in case of external fetch, ALE, RD and R/W pins are driven to their inactive level. The MCU starts program execution from memory location 00'0000h in code segment 0. This starting location will typically point to the general initialization routine. Refer to Table 29 for PORT0 latched configuration. 18.2 - Short Hardware Reset A short hardware reset is a warm reset. It may be generated synchronously to the CPU clock (synchronous reset). The short hardware is triggered when RSTIN signal duration is shorter or equal to 1038 TCL, the RPD pin must be pulled high. To properly activate the internal reset logic of the MCU, the RSTIN pin must be held low, at least, during 4 TCL (2 periods of CPU clock). The I/O pins are set to high impedance and RSTOUT pin is driven low. After RSTIN level is detected, a short duration of 12 TCL (6 CPU clocks) maximum elapses, during which pending internal hold states are cancelled and the current internal access cycle if any is completed. External bus cycle is aborted. The internal pull-down of RSTIN pin is activated if bit BDRSTEN of SYSCON register was previously set by software. This bit is always cleared on power-on or after any reset sequence. The internal reset sequence starts for 1024 TCL (512 periods of CPU clock). After that duration the pull-down of RSTIN pin for the bidirectional reset function is released and the RSTIN pin level is sampled high while RPD level is high. 109/160 ST10F269 The short hardware reset ends and the MCU restarts.To be processed as a short hardware reset, the external RSTIN signal must last a maximum of 1038 TCL (4 TCL + 10 TCL + 1024 TCL). The system configuration is latched from PORT0 after a duration of 8 TCL / 4 CPU clocks (6 TCL / 3 CPU clocks if PLL is bypassed) and in case of external fetch, ALE, RD and R/W pins are driven to their inactive level. Program execution starts from memory location 00'0000h in code segment 0. This starting location will typically point to the general initialization routine. Timings of synchronous reset sequence are summarized in Figure 57. Refer to Table 29 for PORT0 latched configuration. Note - If the RSTIN pin level is sampled low, the reset sequence is extended until RSTIN level becomes high leading to a long hardware reset (synchronous or asynchronous reset) because RSTIN signal duration has lasted longer than 1040TCL. - If the VRPD voltage has droped below the RPD pin threshold, the reset is processed as an asynchronous reset. Figure 57 : Synchronous Warm Reset Sequence External Fetch (4 TCL < RSTIN pulse < 1038 TCL) 4 TCL 10 TCL 2) min. min. 1024 TCL 1 CPU Clock 1) 6 or 8 TCL4) 2 3 4 5 6 7 8 9 RSTIN RPD 200A Discharge Internally pulled low 3) RSTOUT ALE If VRPD > 2.5V Asynchronous 5) Reset is not entered. 5 TCL RD PORT0 Reset Configuration Latching point of PORT0 Internal reset signal for system start-up configuration 1st Instr. Note 1) RSTIN assertion can be released there. 2) Maximum internal synchronisation is 6 CPU cycles (12 TCL). 3) RSTIN pin is pulled low if bit BDRSTEN (bit 3 of SYSCON register) was previously set by software. Bit BDRSTEN is cleared after reset. 4) RSTIN rising edge to internal latch of PORT0 is 3 CPU clock cycles (6 TCL) if the PLL is bypassed and the prescaler is on (fCPU = fXTAL / 2), else it is 4 CPU clock cycles (8 TCL). 5) If during the reset condition (RSTIN low), VRPD voltage drops below the threshold voltage (typically 2.5V for 5V operation), the ST10 reset circuitry disables the bidirectional reset function and RSTIN pin is no more pulled low. 18.3 - Software Reset The reset sequence can be triggered at any time using the protected instruction SRST (software reset). This instruction can be executed deliberately within a program, for example to leave bootstrap loader mode, or upon a hardware trap that reveals a system failure. Upon execution of the SRST instruction, the internal reset sequence (1024 TCL) is started. The microcontroller behavior is the same as for a short hardware reset, except that only P0.12...P0.6 bits are latched at the end of the reset sequence, while previously latched values of P0.5...P0.2 are cleared. 18.4 - Watchdog Timer Reset When the watchdog timer is not disabled during the initialization or when it is not regularly serviced during program execution it will overflow and it will trigger the reset sequence. 110/160 ST10F269 Unlike hardware and software resets, the watchdog reset completes a running external bus cycle if this bus cycle either does not use READY, or if READY is sampled active (low) after the programmed wait states. When READY is sampled inactive (high) after the programmed wait states the running external bus cycle is aborted. Then the internal reset sequence (1024 TCL) is started. The microcontroller behaviour is the same as for a short hardware reset, except that only P0.12...P0.6 bits are latched, while previously latched values of P0.5...P0.2 are cleared. 18.5 - RSTOUT, RSTIN, Bidirectional Reset 18.5.1 - RSTOUT Pin The RSTOUT pin is driven active (low level) at the beginning of any reset sequence (synchronous/ asynchronous hardware, software and watchdog timer resets). RSTOUT pin stays active low beyond the end of the initialization routine, until the protected EINIT instruction (End of Initialization) is completed. 18.5.2 - Bidirectional Reset The bidirectional reset function is enabled by setting SYSCON.BDRSTEN (bit 3). This function is disabled by any reset sequence which always clears the SYSCON.BDRSTEN bit. It can only be enabled during the initialisation routine, before EINIT instruction is completed. If VRPD voltage drops below the RPD pin threshold (typically 2.5V for VDD = 5V) when RSTIN pin is low or when RSTIN pin is internally pulled low, the ST10 reset circuitry disables the bidirectional reset function and RSTIN pin is no more pulled low. The reset is processed as an asynchronous reset. The bidirectional reset function is useful for external peripherals with on-chip memory because the reset signal output on RSTIN pin is de-activated before the CPU starts its first instruction fetch. 18.5.3 - RSTIN pin When the bidirectional reset function is enabled, the open-drain of the RSTIN pin is activated, pulling down the reset signal, for the duration of the internal reset sequence. See Figure 56 and Figure 57. At the end of the sequence the pull-down is released and the RSTIN pin gets back its input function. The bidirectional reset function can be used: - to convert SW or WD resets to a hardware reset so that the configuration can be (re-)latched from PORT0. - to make visible SW or WDT resets at RSTIN pin whenever RSTIN is the only reset signal used by the application (RSTOUT not used). - to get a de-activated reset signal before CPU starts its first instruction fetch. The configuration latched from PORT0 is determined by the kind of reset generated by the application. (Refer to Table 29). Converting a SW or WDT reset to a hardware reset allows the PLL to re-lock or the PLL configuration to be re-latched, provided a SW or WDT reset is generated by the application program is case of PLL unlock or input clock fail. 18.6 - Reset Circuitry The internal reset circuitry is described in Figure 58. An internal pull-up resistor is implemented on RSTIN pin. (50k minimum, to 250k maximum). The minimum reset time must be calculated using the lowest value. In addition, a programmable pull-down (SYSCON.BDRSTEN bit 3) drives the RSTIN pin according to the internal reset state. The RSTOUT pin provides a signals to the application. (Refer to Section 18.5 - RSTOUT, RSTIN, Bidirectional Reset). A weak internal pull-down is connected to the RPD pin to discharge external capacitor to VSS at a rate of 100A to 200A. This Pull-down is turned on when RSTIN pin is low If bit PWDCFG of SYSCON register is set, an internal pull-up resistor is activated at the end of the reset sequence. This pull-up charges the capacitor connected to RPD pin. If the bidirectional reset function is not used, the simplest way to reset ST10F269 is to connect external components as shown in Figure 59. It works with reset from application (hardware or manual) and with power-on. The value of C1 capacitor, connected on RSTIN pin with internal pull-up resistor (50k to 111/160 ST10F269 250k), must lead to a charging time long enought to let the internal or external oscillator and / or the on-chip PLL to stabilize. The R0-C0 components on RPD pin are mainly implemented to provide a time delay to exit Power down mode (see Chapter 19 - Power Reduction Modes). Nervertheless, they drive RPD pin level during resets and they lead to different reset modes as explained hereafter. On power-on, C0 is totaly discharged, a low level on RPD pin forces an asynchronous hardware reset. C0 capacitor starts to charge throught R0 and at the end of reset sequence ST10F269 restarts. RPD pin threshold is typically 2.5V. Depending on the delay of the next applied reset, the MCU can enter a synchronous reset or an asynchronous reset. If RPD pin is below 2.5V an asynchronous reset starts, if RPD pin is above 2.5V a synchronous reset starts. (See Section 18.1 - Long Hardware Reset and Section 18.2 - Short Hardware Reset). Note that an internal pull-down is connected to RPD pin and can drive a 100A to 200A current. This Pull-down is turned on when RSTIN pin is low. To properly use the bidirectional reset features, the schematic (or equivalent) of Figure 60 must be implemented. R1-C1 only work for power-on or manual reset in the same way as explained previously. D1 diode brings a faster discharge of C1 capacitor at power-off during repetitive switch-on / switch-off sequences. D2 diode performs an OR-wired connection, it can be replaced with an open drain buffer. R2 resistor may be added to increase the pull-up current to the open drain in order to get a faster rise time on RSTIN pin when bidirectional function is activated. The start-up configurations and some system features are selected on reset sequences as described in Table 29 and Table 30. Table 29 describes what is the system configuration latched on PORT0 in the five different reset ways. Table 30 summarizes the state of bits of PORT0 latched in RP0H, SYSCON, BUSCON0 registers. Figure 58 : Internal (simplified) Reset Circuitry. EINIT Instruction Clr Q Set RSTOUT Reset State Machine Clock VDD Internal Reset Signal Trigger Clr SRST instruction watchdog overflow RSTIN BDRSTEN Reset Sequence (512 CPU Clock Cycles) VDD Asynchronous Reset RPD From/to Exit Powerdown Circuit Weak pull-down (~200A) 112/160 ST10F269 Figure 59 : Minimum External Reset Circuitry VDD ST10F269 R0 + C0 RPD External Hardware + C1 b) a) a) Manual hardware reset1 b) For automatic power-up and interruptible power-down mode RSTOUT RSTIN Figure 60 : External Reset Hardware Circuitry VDD R0 RSTOUT ST10F269 + C0 RPD Open - drain Inverter External Reset Source VDD RSTIN D2 R2 External Hardware D1 VDD R1 + C1 Table 29 : PORT0 Latched Configuration for the Different Resets PORT0 P0H.6 Clock Options Segm. Addr. Lines P0L.1 Adapt Mode X X X I1 ADP X1 X 1 1 P0H.0 WR config. - : Pin is not sampled Sample event Software Reset Watchdog Reset Short Hardware Reset Long Hardware Reset Power-On Reset X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X Table 30 : PORT0 Bits Latched into the Different Registers After Reset PORT0 bit nber h7 h6 h5 h4 h3 h2 h1 CSSEL X1 BYTDIS ALE CTL0 4 3 h0 WRC X1 X1 X1 I7 I6 I5 R I4 BSL I3 R I2 R PORT0 bit CLKCFG CLKCFG CLKCFG SALSEL SALSEL CSSEL Name RP0H 2 SYSCON BUSCON0 Internal Logic X1 X X 1 1 BUSTYP BUSTYP X1 X X 1 1 X1 X X 1 1 X1 X X 1 1 X1 X 1 X1 X 1 CLKCFG CLKCFG CLKCFG SALSEL SALSEL CSSEL CSSEL WRC WRCFG 3 BTYP X1 X1 BTYP X1 X1 X 1 X1 X 1 X1 X 1 X1 X BUS ACT0 4 To Clock Generator To Port 4 Logic To Port 6 Logic X1 Internal X1 X1 Internal Internal Notes: 1. Not latched from PORT0. 2. Only RP0H low byte is used and the bit-fields are latched from PORT0 high byte to RP0H low byte. 3. Indirectly depend on PORT0. 4. Bits set if EA pin is 1. 113/160 P0L.0 Emu Mode X X X I0 EMU X1 X1 X : Pin is sampled Chip Selects P0L.5 Reserved P0L.3 Reserved P0L.2 Reserved Bus Type P0L.4 BSL P0H.7 P0H.5 P0H.4 P0H.3 P0H.2 P0H.1 P0L.7 P0L.6 ST10F269 19 - POWER REDUCTION MODES Two different power reduction modes with different levels of power reduction have been implemented in the ST10F269. In Idle mode only CPU is stopped, while peripheral still operate. In Power Down mode both CPU and peripherals are stopped. Both mode are software activated by a protected instruction and are terminated in different ways as described in the following sections. Note: All external bus actions are completed before Idle or Power Down mode is entered. However, Idle or Power Down mode is not entered if READY is enabled, but has not been activated (driven low for negative polarity, or driven high for positive polarity) during the last bus access. 19.1 - Idle Mode Idle mode is entered by running IDLE protected instruction. The CPU operation is stopped and the peripherals still run. Idle mode is terminate by any interrupt request. Whatever the interrupt is serviced or not, the instruction following the IDLE instruction will be executed after return from interrupt (RETI) instruction, then the CPU resumes the normal program. Note that a PEC transfer keep the CPU in Idle mode. If the PEC transfer does not succeed, the Idle mode is terminated. Watchdog timer must be properly programmed to avoid any disturbance during Idle mode. 19.2 - Power Down Mode Power Down mode starts by running PWRDN protected instruction. Internal clock is stopped, all MCU parts are on hold including the watchdog timer. There are two different operating Power Down modes : protected mode and interruptible mode. The internal RAM contents can be preserved through the voltage supplied via the VDD pins. To verify RAM integrity, some dedicated patterns may be written before entering the Power Down mode and have to be checked after Power Down is resumed. It is mandatory to keep VDD = +5V 10% during power-down mode, because the on-chip voltage regulator is turned in power saving mode and it delivers 2.5V to the core logic, but it must be supplied at nominal VDD = +5V. 19.2.1 - Protected Power Down Mode This mode is selected when PWDCFG (bit 5) of SYSCON register is cleared. The Protected Power Down mode is only activated if the NMI pin is pulled low when executing PWRDN instruction (this means that the PWRD instruction belongs to the NMI software routine). This mode is only desactivated with an external hardware reset on RSTIN pin. Note: During power down the on-chip voltage regulator automatically lowers the internal logic supply voltage to 2.5V, to save power and to keep internal RAM and registers contents. 19.2.2 - Interruptable Power Down Mode This mode is selected when PWDCFG (bit 5) of SYSCON register is set (See Chapter 20 - Special Function Register Overview). The Interruptable Power Down mode is only activated if all the enabled Fast External Interrupt pins are in their inactive level (see EXICON register description below). This mode is desactivated with an external reset applied to RSTIN pin or with an interrupt request applied to one of the Fast External Interrupt pins. To allow the internal PLL and clock to stabilize, the RSTIN pin must be held low according the recommandations described in Chapter 18 System Reset. 114/160 ST10F269 EXICON (F1C0h / E0h 15 14 13 12 11 10 9 ESFR 8 7 6 5 4 3 Reset Value: 0000h 2 1 0 EXI7ES EXI6ES EXI5ES EXI4ES EXI3ES EXI2ES EXI1ES EXI0ES RW EXIxES(x=7...0) RW RW RW RW RW RW RW External Interrupt x Edge Selection Field (x=7...0) 0 0: 0 1: 1 0: 1 1: Fast external interrupts disabled: standard mode EXxIN pin not taken in account for entering/exiting Power Down mode. Interrupt on positive edge (rising) Enter Power Down mode if EXiIN = `0', exit if EXxIN = `1' (referred as `high' active level) Interrupt on negative edge (falling) Enter Power Down mode if EXiIN = `1', exit if EXxIN = `0' (referred as `low' active level) Interrupt on any edge (rising or falling) Always enter Power Down mode, exit if EXxIN level changed. EXxIN inputs are normally sampled interrupt inputs. However, the Power Down mode circuitry uses them as level-sensitive inputs. An EXxIN (x = 3...0) Interrupt Enable bit (bit CCxIE in respective CCxIC register) need not be set to bring the device out of Power Down mode. An external RC circuit must be connected to RPD pin, as shown in the Figure 61. Figure 61 : External R0C0 Circuit on RPD Pin For Exiting Powerdown Mode with External Interrupt VDD ST10F269-Q3 This signal enables the internal oscillator and PLL circuitry, and also turns on the weak pull-down (see Figure 62). The discharge of the external capacitor provides a delay that allows the oscillator and PLL circuits to stabilize before the internal CPU and Peripheral clocks are enabled. When the RPD voltage drops below the threshold voltage (about 2.5V), the Schmitt trigger clears Q2 flip-flop, thus enabling the CPU and Peripheral clocks, and the device resumes code execution. If the Interrupt was enabled (bit CCxIE='1' in the respective CCxIC register) before entering Power Down mode, the device executes the interrupt service routine, and then resumes execution after the PWRDN intruction (see note below). If the interrupt was disabled, the device executes the instruction following PWRDN instruction, and the Interrupt Request Flag (bit CCxIR in in the respective CCxIC register) remains set until it is cleared by software. Note: Due to the internal pipeline, the instruction that follows the PWRDN intruction is executed before the CPU performs a call of the interrupt service routine when exiting power-down mode R0 220k minimum RPD + C0 1F Typical To exit Power Down mode with an external interrupt, an EXxIN (x = 7...0) pin has to be asserted for at least 40ns. 115/160 ST10F269 Figure 62 : Simplified Powerdown Exit Circuitry VDD DQ Q1 cdQ stop pll stop oscillator VDD Pull-up enter PowerDown RPD Weak Pull-down (~ 200A) external interrupt reset VDD DQ Q2 cdQ System clock CPU and Peripherals clocks Figure 63 : Powerdown Exit Sequence When Using an External Interrupt (PLL x 2) XTAL1 CPU clk Internal Powerdown signal External Interrupt RPD ExitPwrd (internal) ~ 2.5 V delay for oscillator/pll stabilization 116/160 ST10F269 20 - SPECIAL FUNCTION REGISTER OVERVIEW The following table lists all SFRs which are implemented in the ST10F269 in alphabetical order. Bit-addressable SFRs are marked with the letter "b" in column "Name". SFRs within the Extended SFR-Space (ESFRs) are marked with the letter "E" in column "Physical Address". A SFR can be specified by its individual mnemonic name. Depending on the selected addressing mode, a SFR can be accessed via its Table 31 : Special Function Registers Listed by Name Name ADCIC ADCON ADDAT ADDAT2 ADDRSEL1 ADDRSEL2 ADDRSEL3 ADDRSEL4 ADEIC BUSCON0 BUSCON1 BUSCON2 BUSCON3 BUSCON4 CAPREL CC0 CC0IC CC1 CC1IC CC2 CC2IC CC3 CC3IC CC4 CC4IC CC5 CC5IC CC6 CC6IC CC7 CC7IC CC8 CC8IC b b b b b b b b b b b b b b b b b Physical address FF98h FFA0h FEA0h F0A0h FE18h FE1Ah FE1Ch FE1Eh FF9Ah FF0Ch FF14h FF16h FF18h FF1Ah FE4Ah FE80h FF78h FE82h FF7Ah FE84h FF7Ch FE86h FF7Eh FE88h FF80h FE8Ah FF82h FE8Ch FF84h FE8Eh FF86h FE90h FF88h E 8-bit address CCh D0h 50h 50h 0Ch 0Dh 0Eh 0Fh CDh 86h 8Ah 8Bh 8Ch 8Dh 25h 40h BCh 41h BDh 42h BEh 43h BFh 44h C0h 45h C1h 46h C2h 47h C3h 48h C4h Description A/D Converter end of Conversion Interrupt Control Register A/D Converter Control Register A/D Converter Result Register A/D Converter 2 Result Register Address Select Register 1 Address Select Register 2 Address Select Register 3 Address Select Register 4 A/D Converter Overrun Error Interrupt Control Register Bus Configuration Register 0 Bus Configuration Register 1 Bus Configuration Register 2 Bus Configuration Register 3 Bus Configuration Register 4 GPT2 Capture/Reload Register CAPCOM Register 0 CAPCOM Register 0 Interrupt Control Register CAPCOM Register 1 CAPCOM Register 1 Interrupt Control Register CAPCOM Register 2 CAPCOM Register 2 Interrupt Control Register CAPCOM Register 3 CAPCOM Register 3 Interrupt Control Register CAPCOM Register 4 CAPCOM Register 4 Interrupt Control Register CAPCOM Register 5 CAPCOM Register 5 Interrupt Control Register CAPCOM Register 6 CAPCOM Register 6 Interrupt Control Register CAPCOM Register 7 CAPCOM Register 7 Interrupt Control Register CAPCOM Register 8 CAPCOM Register 8 Interrupt Control Register Reset value - - 00h 0000h 0000h 0000h 0000h 0000h 0000h 0000h - - 00h 0xx0h 0000h 0000h 0000h 0000h 0000h 0000h - - 00h 0000h - - 00h 0000h - - 00h 0000h - - 00h 0000h - - 00h 0000h - - 00h 0000h - - 00h 0000h - - 00h 0000h - - 00h physical address (using the Data Page Pointers), or via its short 8-bit address (without using the Data Page Pointers). The reset value is defined as following: X : Means the full nibble is not defined at reset. x : Means some bits of the nibble are not defined at reset. 117/160 ST10F269 Table 31 : Special Function Registers Listed by Name (continued) Name CC9 CC9IC CC10 CC10IC CC11 CC11IC CC12 CC12IC CC13 CC13IC CC14 CC14IC CC15 CC15IC CC16 CC16IC CC17 CC17IC CC18 CC18IC CC19 CC19IC CC20 CC20IC CC21 CC21IC CC22 CC22IC CC23 CC23IC CC24 CC24IC CC25 CC25IC CC26 CC26IC CC27 CC27IC CC28 CC28IC CC29 CC29IC b b b b b b b b b b b b b b b b b b b b b Physical address FE92h FF8Ah FE94h FF8Ch FE96h FF8Eh FE98h FF90h FE9Ah FF92h FE9Ch FF94h FE9Eh FF96h FE60h F160h FE62h F162h FE64h F164h FE66h F166h FE68h F168h FE6Ah F16Ah FE6Ch F16Ch FE6Eh F16Eh FE70h F170h FE72h F172h FE74h F174h FE76h F176h FE78h F178h FE7Ah F184h E E E E E E E E E E E E E E 8-bit address 49h C5h 4Ah C6h 4Bh C7h 4Ch C8h 4Dh C9h 4Eh CAh 4Fh CBh 30h B0h 31h B1h 32h B2h 33h B3h 34h B4h 35h B5h 36h B6h 37h B7h 38h B8h 39h B9h 3Ah BAh 3Bh BBh 3Ch BCh 3Dh C2h CAPCOM Register 9 CAPCOM Register 9 Interrupt Control Register CAPCOM Register 10 CAPCOM Register 10 Interrupt Control Register CAPCOM Register 11 CAPCOM Register 11 Interrupt Control Register CAPCOM Register 12 CAPCOM Register 12 Interrupt Control Register CAPCOM Register 13 CAPCOM Register 13 Interrupt Control Register CAPCOM Register 14 CAPCOM Register 14 Interrupt Control Register CAPCOM Register 15 CAPCOM Register 15 Interrupt Control Register CAPCOM Register 16 CAPCOM Register 16 Interrupt Control Register CAPCOM Register 17 CAPCOM Register 17 Interrupt Control Register CAPCOM Register 18 CAPCOM Register 18 Interrupt Control Register CAPCOM Register 19 CAPCOM Register 19 Interrupt Control Register CAPCOM Register 20 CAPCOM Register 20 Interrupt Control Register CAPCOM Register 21 CAPCOM Register 21 Interrupt Control Register CAPCOM Register 22 CAPCOM Register 22 Interrupt Control Register CAPCOM Register 23 CAPCOM Register 23 Interrupt Control Register CAPCOM Register 24 CAPCOM Register 24 Interrupt Control Register CAPCOM Register 25 CAPCOM Register 25 Interrupt Control Register CAPCOM Register 26 CAPCOM Register 26 Interrupt Control Register CAPCOM Register 27 CAPCOM Register 27 Interrupt Control Register CAPCOM Register 28 CAPCOM Register 28 Interrupt Control Register CAPCOM Register 29 CAPCOM Register 29 Interrupt Control Register Description Reset value 0000h - - 00h 0000h - - 00h 0000h - - 00h 0000h - - 00h 0000h - - 00h 0000h - - 00h 0000h - - 00h 0000h - - 00h 0000h - - 00h 0000h - - 00h 0000h - - 00h 0000h - - 00h 0000h - - 00h 0000h - - 00h 0000h - - 00h 0000h - - 00h 0000h - - 00h 0000h - - 00h 0000h - - 00h 0000h - - 00h 0000h - - 00h 118/160 ST10F269 Table 31 : Special Function Registers Listed by Name (continued) Name CC30 CC30IC CC31 CC31IC CCM0 CCM1 CCM2 CCM3 CCM4 CCM5 CCM6 CCM7 CP CRIC CSP DP0L DP0H DP1L DP1H DP2 DP3 DP4 DP6 DP7 DP8 DPP0 DPP1 DPP2 DPP3 EXICON EXISEL IDCHIP IDMANUF IDMEM IDPROG IDX0 IDX1 MAH MAL MCW MDC MDH MDL b b b b b b b b b b b b b b b b b b b b b b b b b b b Physical address FE7Ch F18Ch FE7Eh F194h FF52h FF54h FF56h FF58h FF22h FF24h FF26h FF28h FE10h FF6Ah FE08h F100h F102h F104h F106h FFC2h FFC6h FFCAh FFCEh FFD2h FFD6h FE00h FE02h FE04h FE06h F1C0h F1DAh F07Ch F07Eh F07Ah F078h FF08h FF0Ah FE5Eh FE5Ch FFDCh FF0Eh FE0Ch FE0Eh E E E E E E E E E E E E 8-bit address 3Eh C6h 3Fh CAh A9h AAh ABh ACh 91h 92h 93h 94h 08h B5h 04h 80h 81h 82h 83h E1h E3h E5h E7h E9h EBh 00h 01h 02h 03h E0h EDh 3Eh 3Fh 3Dh 3Ch 84h 85h 2Fh 2Eh EEh 87h 06h 07h CAPCOM Register 30 CAPCOM Register 30 Interrupt Control Register CAPCOM Register 31 CAPCOM Register 31 Interrupt Control Register CAPCOM Mode Control Register 0 CAPCOM Mode Control Register 1 CAPCOM Mode Control Register 2 CAPCOM Mode Control Register 3 CAPCOM Mode Control Register 4 CAPCOM Mode Control Register 5 CAPCOM Mode Control Register 6 CAPCOM Mode Control Register 7 CPU Context Pointer Register GPT2 CAPREL Interrupt Control Register CPU Code Segment Pointer Register (read only) P0L Direction Control Register P0h Direction Control Register P1L Direction Control Register P1h Direction Control Register Port 2 Direction Control Register Port 3 Direction Control Register Port 4 Direction Control Register Port 6 Direction Control Register Port 7 Direction Control Register Port 8 Direction Control Register CPU Data Page Pointer 0 Register (10-bit) CPU Data Page Pointer 1 Register (10-bit) CPU Data Page Pointer 2 Register (10-bit) CPU Data Page Pointer 3 Register (10-bit) External Interrupt Control Register External Interrupt Source Selection Register Device Identifier Register (n is the device revision) Manufacturer Identifier Register On-chip Memory Identifier Register Programming Voltage Identifier Register MAC Unit Address Pointer 0 MAC Unit Address Pointer 1 MAC Unit Accumulator - High Word MAC Unit Accumulator - Low Word MAC Unit Control Word CPU Multiply Divide Control Register CPU Multiply Divide Register - High Word CPU Multiply Divide Register - Low Word Description Reset value 0000h - - 00h 0000h - - 00h 0000h 0000h 0000h 0000h 0000h 0000h 0000h 0000h FC00h - - 00h 0000h - - 00h - - 00h - - 00h - - 00h 0000h 0000h 00h 00h 00h 00h 0000h 0001h 0002h 0003h 0000h 0000h 10Dnh 0401h 3040h 0040h 0000h 0000h 0000h 0000h 0000h 0000h 0000h 0000h 119/160 ST10F269 Table 31 : Special Function Registers Listed by Name (continued) Name MRW MSW ODP2 ODP3 ODP4 ODP6 ODP7 ODP8 ONES P0L P0H P1L P1H P2 P3 P4 P5 P6 P7 P8 P5DIDIS POCON0L POCON0H POCON1L POCON1H POCON2 POCON3 POCON4 POCON6 POCON7 POCON8 POCON20 PECC0 PECC1 PECC2 PECC3 PECC4 PECC5 PECC6 PECC7 PICON b b b b b b b b b b b b b b b b b b b b b b Physical address FFDAh FFDEh F1C2h F1C6h F1CAh F1CEh F1D2h F1D6h FF1Eh FF00h FF02h FF04h FF06h FFC0h FFC4h FFC8h FFA2h FFCCh FFD0h FFD4h FFA4h F080h F082h F084h F086h F088h F08Ah F08Ch F08Eh F090h F092h F0AAh FEC0h FEC2h FEC4h FEC6h FEC8h FECAh FECCh FECEh F1C4h E E E E E E E E E E E E E E E E E E 8-bit address EDh EFh E1h E3h E5h E7h E9h EBh 8Fh 80h 81h 82h 83h E0h E2h E4h D1h E6h E8h EAh D2h 40h 41h 42h 43h 44h 45h 46h 47h 48h 49h 55h 60h 61h 62h 63h 64h 65h 66h 67h E2h MAC Unit Repeat Word MAC Unit Status Word Port 2 Open Drain Control Register Port 3 Open Drain Control Register Port 4 Open Drain Control Register Port 6 Open Drain Control Register Port 7 Open Drain Control Register Port 8 Open Drain Control Register Constant Value 1's Register (read only) PORT0 Low Register (Lower half of PORT0) PORT0 High Register (Upper half of PORT0) PORT1 Low Register (Lower half of PORT1) PORT1 High Register (Upper half of PORT1) Port 2 Register Port 3 Register Port 4 Register (8-bit) Port 5 Register (read only) Port 6 Register (8-bit) Port 7 Register (8-bit) Port 8 Register (8-bit) Port 5 Digital Disable Register PORT0 Low Outpout Control Register (8-bit) PORT0 High Output Control Register (8-bit) PORT1 Low Output Control Register (8-bit) PORT1 High Output Control Register (8-bit) Port2 Output Control Register Port3 Output Control Register Port4 Output Control Register (8-bit) Port6 Output Control Register (8-bit) Port7 Output Control Register (8-bit) Port8 Output Control Register (8-bit) ALE, RD, WR Output Control Register (8-bit) PEC Channel 0 Control Register PEC Channel 1 Control Register PEC Channel 2 Control Register PEC Channel 3 Control Register PEC Channel 4 Control Register PEC Channel 5 Control Register PEC Channel 6 Control Register PEC Channel 7 Control Register Port Input Threshold Control Register Description Reset value 0000h 0200h 0000h 0000h - - 00h - - 00h - - 00h - - 00h FFFFh - - 00h - - 00h - - 00h - - 00h 0000h 0000h 00h XXXXh - - 00h - - 00h - - 00h 0000h - - 00h - - 00h - - 00h - - 00h 0000h 0000h - - 00h - - 00h - - 00h - - 00h 0000h 0000h 0000h 0000h 0000h 0000h 0000h 0000h 0000h - - 00h 120/160 ST10F269 Table 31 : Special Function Registers Listed by Name (continued) Name PP0 PP1 PP2 PP3 PSW PT0 PT1 PT2 PT3 PW0 PW1 PW2 PW3 PWMCON0 PWMCON1 PWMIC QR0 QR1 QX0 QX1 RP0H S0BG S0CON S0EIC S0RBUF S0RIC S0TBIC S0TBUF S0TIC SP SSCBR SSCCON SSCEIC SSCRB SSCRIC SSCTB SSCTIC STKOV STKUN SYSCON b b b b b b b b b b b b b b b Physical address F038h F03Ah F03Ch F03Eh FF10h F030h F032h F034h F036h FE30h FE32h FE34h FE36h FF30h FF32h F17Eh F004h F006h F000h F002h F108h FEB4h FFB0h FF70h FEB2h FF6Eh F19Ch FEB0h FF6Ch FE12h F0B4h FFB2h FF76h F0B2h FF74h F0B0h FF72h FE14h FE16h FF12h E E E E E E E E E E E E E E E E E E 8-bit address 1Ch 1Dh 1Eh 1Fh 88h 18h 19h 1Ah 1Bh 18h 19h 1Ah 1Bh 98h 99h BFh 02h 03h 00h 01h 84h 5Ah D8h B8h 59h B7h CEh 58h B6h 09h 5Ah D9h BBh 59h BAh 58h B9h 0Ah 0Bh 89h Description PWM Module Period Register 0 PWM Module Period Register 1 PWM Module Period Register 2 PWM Module Period Register 3 CPU Program Status Word PWM Module Up/Down Counter 0 PWM Module Up/Down Counter 1 PWM Module Up/Down Counter 2 PWM Module Up/Down Counter 3 PWM Module Pulse Width Register 0 PWM Module Pulse Width Register 1 PWM Module Pulse Width Register 2 PWM Module Pulse Width Register 3 PWM Module Control Register 0 PWM Module Control Register 1 PWM Module Interrupt Control Register MAC Unit Offset Register QR0 MAC Unit Offset Register QR1 MAC Unit Offset Register QX0 MAC Unit Offset Register QX1 System Start-up Configuration Register (read only) Serial Channel 0 Baud Rate Generator Reload Register Serial Channel 0 Control Register Serial Channel 0 Error Interrupt Control Register Serial Channel 0 Receive Buffer Register (read only) Serial Channel 0 Receive Interrupt Control Register Serial Channel 0 Transmit Buffer Interrupt Control Register Serial Channel 0 Transmit Buffer Register (write only) Serial Channel 0 Transmit Interrupt Control Register CPU System Stack Pointer Register SSC Baud Rate Register SSC Control Register SSC Error Interrupt Control Register SSC Receive Buffer (read only) SSC Receive Interrupt Control Register SSC Transmit Buffer (write only) SSC Transmit Interrupt Control Register CPU Stack Overflow Pointer Register CPU Stack Underflow Pointer Register CPU System Configuration Register Reset value 0000h 0000h 0000h 0000h 0000h 0000h 0000h 0000h 0000h 0000h 0000h 0000h 0000h 0000h 0000h - - 00h 0000h 0000h 0000h 0000h - - XXh 0000h 0000h - - 00h - - XXh - - 00h - - 00h 0000h - - 00h FC00h 0000h 0000h - - 00h XXXXh - - 00h 0000h - - 00h FA00h FC00h 0xx0h 1 121/160 ST10F269 Table 31 : Special Function Registers Listed by Name (continued) Name T0 T01CON T0IC T0REL T1 T1IC T1REL T2 T2CON T2IC T3 T3CON T3IC T4 T4CON T4IC T5 T5CON T5IC T6 T6CON T6IC T7 T78CON T7IC T7REL T8 T8IC T8REL TFR WDT WDTCON XP0IC XP1IC XP2IC XP3IC XPERCON ZEROS b b b b b b b b b b b b b b b b b b b b b b b Physical address FE50h FF50h FF9Ch FE54h FE52h FF9Eh FE56h FE40h FF40h FF60h FE42h FF42h FF62h FE44h FF44h FF64h FE46h FF46h FF66h FE48h FF48h FF68h F050h FF20h F17Ah F054h F052h F17Ch F056h FFACh FEAEh FFAEh F186h F18Eh F196h F19Eh F024h FF1Ch E E E E E E E E E E E 8-bit address 28h A8h CEh 2Ah 29h CFh 2Bh 20h A0h B0h 21h A1h B1h 22h A2h B2h 23h A3h B3h 24h A4h B4h 28h 90h BEh 2Ah 29h BFh 2Bh D6h 57h D7h C3h C7h CBh CFh 12h 8Eh Description CAPCOM Timer 0 Register CAPCOM Timer 0 and Timer 1 Control Register CAPCOM Timer 0 Interrupt Control Register CAPCOM Timer 0 Reload Register CAPCOM Timer 1 Register CAPCOM Timer 1 Interrupt Control Register CAPCOM Timer 1 Reload Register GPT1 Timer 2 Register GPT1 Timer 2 Control Register GPT1 Timer 2 Interrupt Control Register GPT1 Timer 3 Register GPT1 Timer 3 Control Register GPT1 Timer 3 Interrupt Control Register GPT1 Timer 4 Register GPT1 Timer 4 Control Register GPT1 Timer 4 Interrupt Control Register GPT2 Timer 5 Register GPT2 Timer 5 Control Register GPT2 Timer 5 Interrupt Control Register GPT2 Timer 6 Register GPT2 Timer 6 Control Register GPT2 Timer 6 Interrupt Control Register CAPCOM Timer 7 Register CAPCOM Timer 7 and 8 Control Register CAPCOM Timer 7 Interrupt Control Register CAPCOM Timer 7 Reload Register CAPCOM Timer 8 Register CAPCOM Timer 8 Interrupt Control Register CAPCOM Timer 8 Reload Register Trap Flag Register Watchdog Timer Register (read only) Watchdog Timer Control Register CAN1 Module Interrupt Control Register CAN2 Module Interrupt Control Register Flash ready/busy interrupt control register PLL unlock Interrupt Control Register XPER Configuration Register Constant Value 0's Register (read only) Reset value 0000h 0000h - - 00h 0000h 0000h - - 00h 0000h 0000h 0000h - - 00h 0000h 0000h - - 00h 0000h 0000h - - 00h 0000h 0000h - - 00h 0000h 0000h - - 00h 0000h 0000h - - 00h 0000h 0000h - - 00h 0000h 0000h 0000h 00xxh 2 - - 00h 3 - - 00h 3 - - 00h 3 - - 00h 3 - - 05h 0000h Notes: 1. The system configuration is selected during reset. 2. Bit WDTR indicates a watchdog timer triggered reset. 3. The XPnIC Interrupt Control Registers control interrupt requests from integrated X-Bus peripherals. Some software controlled interrupt requests may be generated by setting the XPnIR bits (of XPnIC register) of the unused X-peripheral nodes. 122/160 ST10F269 20.1 - Identification Registers The ST10F269 has four Identification registers, mapped in ESFR space. These register contain: - A manufacturer identifier, - A chip identifier, with its revision, - A internal memory and size identifier and programming voltage description. IDMANUF (F07Eh / 3Fh) 1 15 14 13 12 11 10 MANUF R MANUF Manufacturer Identifier - 020h: STMicroelectronics Manufacturer (JTAG worldwide normalisation). 9 ESFR 8 7 6 5 4 0 3 0 Reset Value: 0401h 2 0 1 0 0 1 IDCHIP (F07Ch / 3Eh) 1 15 14 13 12 11 10 CHIPID R 9 ESFR 8 7 6 5 4 3 Reset Value: 10DXh 2 REVID R 1 0 REVID CHIPID Device Revision Identifier Device Identifier - 10Dh: ST10F269 identifier. ESFR 11 10 9 8 7 6 MEMSIZE R 5 4 3 IDMEM (F07Ah / 3Dh) 1 15 14 MEMTYP R 13 12 Reset Value: 3040h 2 1 0 MEMSIZE MEMTYP Internal Memory Size is calculated using the following formula: Size = 4 x [MEMSIZE] (in K Byte) - 040h for ST10F269 (256K Byte) Internal Memory Type - 3h for ST10F269 (Flash memory). ESFR 11 10 9 8 7 6 5 4 PROGVDD R 3 IDPROG (F078h / 3Ch) 1 15 14 13 12 PROGVPP R Reset Value: 0040h 2 1 0 PROGVDD Programming VDD Voltage VDD voltage when programming EPROM or FLASH devices is calculated using the following formula: VDD = 20 x [PROGVDD] / 256 (volts) - 40h for ST10F269 (5V). Programming VPP Voltage (no need of external VPP) - 00h PROGVPP Note : 1. All identification words are read only registers. 123/160 ST10F269 20.2 - System Configuration Registers The ST10F269 has registers used for different configuration of the overall system. These registers are described below. SYSCON (FF12h / 89h) 15 14 13 STKSZ SFR 10 9 8 7 6 5 PWD CFG Reset Value: 0xx0h 4 OWD DIS 12 11 3 BDR STEN 2 1 0 ROMS1 SGTDIS ROMEN BYTDIS CLKEN WRCFG CSCFG XPERXPEN VISIBLE SHARE RW RW RW RW1 RW1 RW RW1 RW RW RW RW RW RW RW Notes: 1. These bit are set directly or indirectly according to PORT0 and EA pin configuration during reset sequence. 2. Register SYSCON cannot be changed after execution of the EINIT instruction. XPER-SHARE XBUS Peripheral Share Mode Control `0': External accesses to XBUS peripherals are disabled `1': XBUS peripherals are accessible via the external bus during hold mode VISIBLE Visible Mode Control `0': Accesses to XBUS peripherals are done internally `1': XBUS peripheral accesses are made visible on the external pins XPEN XBUS Peripheral Enable bit `0': Accesses to the on-chip X-Peripherals and XRAM are disabled `1': The on-chip X-Peripherals are enabled. BDRSTEN Bidirectional Reset Enable `0': RSTIN pin is an input pin only. (SW Reset or WDT Reset have no effect on this pin) `1': RSTIN pin is a bidirectional pin. This pin is pulled low during 1024 TCL during reset sequence. OWDDIS Oscillator Watchdog Disable Control `0': Oscillator Watchdog (OWD) is enabled. If PLL is bypassed, the OWD monitors XTAL1 activity. If there is no activity on XTAL1 for at least 1 s, the CPU clock is switched automatically to PLL's base frequency (from 2 to 10MHz). `1': OWD is disabled. If the PLL is bypassed, the CPU clock is always driven by XTAL1 signal. The PLL is turned off to reduce power supply current. PWDCFG Power Down Mode Configuration Control `0': Power Down Mode can only be entered during PWRDN instruction execution if NMI pin is low, otherwise the instruction has no effect. Exit power down only with reset. `1': Power Down Mode can only be entered during PWRDN instruction execution if all enabled fast external interrupt EXxIN pins are in their inactive level. Exiting this mode can be done by asserting one enabled EXxIN pin or with external reset. CSCFG Chip Select Configuration Control `0': Latched Chip Select lines: CSx change 1 TCL after rising edge of ALE `1': Unlatched Chip Select lines: CSx change with rising edge of ALE. 124/160 ST10F269 WRCFG Write Configuration Control (Inverted copy of bit WRC of RP0H) `0': Pins WR and BHE retain their normal function `1': Pin WR acts as WRL, pin BHE acts as WRH. CLKEN System Clock Output Enable (CLKOUT) `0': CLKOUT disabled: pin may be used for general purpose I/O `1': CLKOUT enabled: pin outputs the system clock signal. BYTDIS Disable/Enable Control for Pin BHE (Set according to data bus width) `0': Pin BHE enabled `1': Pin BHE disabled, pin may be used for general purpose I/O. ROMEN Internal Memory Enable (Set according to pin EA during reset) `0': Internal Memory disabled: accesses to the Memory area use the external bus `1': Internal Memory enabled. SGTDIS Segmentation Disable/Enable Control `0': Segmentation enabled (CSP is saved/restored during interrupt entry/exit) `1': Segmentation disabled (Only IP is saved/restored). ROMS1 Internal Memory Mapping `0': Internal Memory area mapped to segment 0 (00'0000H...00'7FFFH) `1': Internal Memory area mapped to segment 1 (01'0000H...01'7FFFH). STKSZ System Stack Size Selects the size of the system stack (in the internal RAM) from 32 to 1024 words. BUSCON0 (FF0Ch / 86h) 15 CSWEN0 RW SFR 12 RW Reset Value: 0xx0h 9 8 - 14 RW 13 RW 11 - 10 RW2 7 6 5 RW 4 RW 3 2 1 0 CSREN0 RDYPOL0 RDYEN0 BUS ACT0 ALE CTL0 RW2 BTYP RW1 MTTC0 RWDC0 MCTC RW BUSCON1 (FF14h / 8Ah) 15 CSWEN1 RW 14 RW 13 RW 12 RW 11 10 BUSACT1 RW CSREN1 RDYPOL1 RDYEN1 SFR 9 ALECTL1 RW 8 7 RW 6 5 RW BTYP Reset Value: 0000h 4 RW 3 2 RW 1 0 MTTC1 RWDC1 MCTC BUSCON2 (FF16h / 8Bh) 15 CSWEN2 RW 14 RW 13 RW 12 RW 11 10 BUSACT2 RW CSREN2 RDYPOL2 RDYEN2 SFR 9 ALECTL2 RW 8 7 RW 6 5 RW BTYP Reset Value: 0000h 4 RW 3 2 RW 1 0 MTTC2 RWDC2 MCTC BUSCON3 (FF18h / 8Ch) 15 CSWEN3 RW 14 RW 13 RW 12 RW 11 10 BUSACT3 RW CSREN3 RDYPOL3 RDYEN3 SFR 9 ALECTL3 RW 8 7 RW 6 5 RW BTYP Reset Value: 0000h 4 RW 3 2 RW 1 0 MTTC3 RWDC3 MCTC 125/160 ST10F269 BUSCON4 (FF1Ah / 8Dh) 15 CSWEN4 RW 14 RW 13 RW 12 RW 11 10 BUSACT4 RW CSREN4 RDYPOL4 RDYEN4 SFR 9 ALECTL4 RW 8 7 RW 6 5 RW BTYP Reset Value: 0000h 4 RW 3 2 RW 1 0 MTTC4 RWDC4 MCTC Notes: 1. BTYP (bit 6 and 7) are set according to the configuration of the bit l6 and l7 of PORT0 latched at the end of the reset sequence. 2. BUSCON0 is initialized with 0000h, if EA pin is high during reset. If EA pin is low during reset, bit BUSACT0 and ALECTRL0 are set ('1') and bit field BTYP is loaded with the bus configuration selected via PORT0. MCTC Memory Cycle Time Control (Number of memory cycle time wait states) 0 0 0 0: 15 wait states (Nber = 15 - [MCTC]) ... 1 1 1 1: No wait state RWDCx Read/Write Delay Control for BUSCONx `0': With read/write delay: activate command 1 TCL after falling edge of ALE `1': No read/write delay: activate command with falling edge of ALE MTTCx Memory Tristate Time Control `0': 1 wait state `1': No wait state BTYP External Bus Configuration 0 0: 8-bit Demultiplexed Bus 0 1: 8-bit Multiplexed Bus 1 0: 16-bit Demultiplexed Bus 1 1: 16-bit Multiplexed Bus Note: For BUSCON0, BTYP bit-field is defined via PORT0 during reset. ALECTLx ALE Lengthening Control `0': Normal ALE signal `1': Lengthened ALE signal BUSACTx Bus Active Control `0': External bus disabled `1': External bus enabled (within the respective address window, see ADDRSEL) RDYENx READY Input Enable `0': External bus cycle is controlled by bit field MCTC only `1': External bus cycle is controlled by the READY input signal RDYPOLx Ready Active Level Control `0': Active level on the READY pin is low, bus cycle terminates with a `0' on READY pin, `1': Active level on the READY pin is high, bus cycle terminates with a `1' on READY pin. CSRENx Read Chip Select Enable `0': The CS signal is independent of the read command (RD) `1': The CS signal is generated for the duration of the read command CSWENx Write Chip Select Enable `0': The CS signal is independent of the write command (WR,WRL,WRH) `1': The CS signal is generated for the duration of the write command 126/160 ST10F269 RP0H (F108h / 84h) 15 - ESFR 12 - Reset Value: --XXH 6 CLKSEL 14 - 13 - 11 - 10 - 9 - 8 - 7 5 4 3 2 1 0 WRC R2 SALSEL CSSEL R1-2 WRC 2 Write Configuration Control `0': Pin WR acts as WRL, pin BHE acts as WRH `1': Pins WR and BHE retain their normal function CSSEL 2 Chip Select Line Selection (Number of active CS outputs) 0 0: 3 CS lines: CS2...CS0 0 1: 2 CS lines: CS1...CS0 1 0: No CS line at all 1 1: 5 CS lines: CS4...CS0 (Default without pull-downs) SALSEL 2 R2 R2 Segment Address Line Selection (Number of active segment address outputs) 0 0: 4-bit segment address: A19...A16 0 1: No segment address lines at all 1 0: 8-bit segment address: A23...A16 1 1: 2-bit segment address: A17...A16 (Default without pull-downs) CLKSEL 1 - 2 System Clock Selection 000: fCPU = 2.5 x fOSC 001: fCPU = 0.5 x fOSC 010: fCPU = 1.5 x fOSC 011: fCPU = fOSC 100: fCPU = 5 x fOSC 101: fCPU = 2 x fOSC 110: fCPU = 3 x fOSC 111: fCPU = 4 x fOSC Notes: 1. RP0H.7 to RP0H.5 bits are loaded only during a long hardware reset. As pull-up resistors are active on each Port P0H pins during reset, RP0H default value is "FFh". 2. These bits are set according to Port 0 configuration during any reset sequence. 3. RP0H is a read only register. 127/160 ST10F269 EXICON (F1C0h / E0h 15 14 13 12 11 10 9 ESFR 8 7 6 5 4 3 Reset Value: 0000h 2 1 0 EXI7ES EXI6ES EXI5ES EXI4ES EXI3ES EXI2ES EXI1ES EXI0ES RW EXIxES(x=7...0) RW RW RW RW RW RW RW External Interrupt x Edge Selection Field (x=7...0) 0 0: Fast external interrupts disabled: standard mode EXxIN pin not taken in account for entering/exiting Power Down mode. 0 1: Interrupt on positive edge (rising) Enter Power Down mode if EXiIN = `0', exit if EXxIN = `1' (referred as `high' active level) 1 0: Interrupt on negative edge (falling) Enter Power Down mode if EXiIN = `1', exit if EXxIN = `0' (referred as `low' active level) 1 1: Interrupt on any edge (rising or falling) Always enter Power Down mode, exit if EXxIN level changed. EXISEL (F1DAh / EDh) 15 14 13 12 11 10 9 ESFR 8 7 6 5 4 3 Reset Value: 0000h 2 1 0 EXI7SS RW EXIxSS EXI6SS RW EXI5SS RW EXI4SS RW EXI3SS RW EXI2SS RW EXI1SS RW EXI0SS RW External Interrupt x Source Selection (x=7...0) `00': `01': `10': `11': EXIxSS 0 1 2 3 4...7 Input from associated Port 2 pin. Input from "alternate source". Input from Port 2 pin ORed with "alternate source". Input from Port 2 pin ANDed with "alternate source". Port 2 pin P2.8 P2.9 P2.10 P2.11 P2.12...15 Alternate Source CAN1_RxD CAN2_RxD RTCSI RTCAI Not used (zero) XP3IC (F19Eh / CFh) 1 15 14 - ESFR 11 10 - Reset Value: --00h 6 5 4 3 2 1 GLVL RW 0 13 - 12 - 9 - 8 - 7 XP3IR XP3IE RW RW XP3ILVL RW Note: 1. XP3IC register has the same bit field as xxIC interrupt registers 128/160 ST10F269 xxIC (yyyyh / zzh) 15 14 13 12 11 10 9 - SFR Area 8 7 xxIR RW 6 xxIE RW 5 4 ILVL RW 3 Reset Value: --00h 2 1 GLVL RW 0 Bit GLVL Group Level Function Defines the internal order for simultaneous requests of the same priority. 3: Highest group priority 0: Lowest group priority ILVL Interrupt Priority Level Defines the priority level for the arbitration of requests. Fh: Highest priority level 0h: Lowest priority level xxIE Interrupt Enable Control Bit (individually enables/disables a specific source) `0': Interrupt Request is disabled `1': Interrupt Request is enabled xxIR Interrupt Request Flag `0': No request pending `1': This source has raised an interrupt request XPERCON (F024h / 12h) 15 - ESFR 10 - Reset Value: --05h 4 RTCEN 14 - 13 - 12 - 11 - 9 - 8 - 7 - 6 - 5 - 3 XRAM2EN 2 XRAM1EN 1 CAN2EN 0 CAN1EN RW CAN1EN CAN1 Enable Bit RW RW RW RW `0': Accesses to the on-chip CAN1 XPeripheral and its functions are disabled. P4.5 and P4.6 pins can be used as general purpose I/Os. Address range 00'EF00h-00'EFFFh is only directed to external memory if CAN2EN is also `0'. `1': The on-chip CAN1 XPeripheral is enabled and can be accessed. CAN2EN CAN2 Enable Bit `0': Accesses to the on-chip CAN2 XPeripheral and its functions are disabled. P4.4 and P4.7 pins can be used as general purpose I/Os. Address range 00'EE00h-00'EEFFh is only directed to external memory if CAN1EN is also `0'. `1': The on-chip CAN2 XPeripheral is enabled and can be accessed. XRAM1EN XRAM1 Enable Bit `0': Accesses to external memory within space 00'E000h to 00'E7FFh. The 2K Bytes of internal XRAM1 are disabled. '1': Accesses to the internal 2K Bytes of XRAM1. XRAM2EN XRAM2 Enable Bit `0': Accesses to the external memory within space 00'C000h to 00'DFFFh. The 8K Bytes of internal XRAM2 are disabled. '1': Accesses to the internal 8K Bytes of XRAM2. RTCEN RTC Enable Bit '0': Accesses to the on-chip Real Time Clock are disabled, external access performed. Address range 00'EC00h-00'ECFFh is only directed to external memory if CAN1EN and CAN2EN are '0' also '1': The on-chip Real Time Clock is enabled and can be accessed. 129/160 ST10F269 When both CAN are disabled via XPERCON setting, then any access in the address range 00'EE00h - 00'EFFFh will be directed to external memory interface, using the BUSCONx register corresponding to address matching ADDRSELx register. P4.4 and P4.7 can be used as General Purpose I/O when CAN2 is not enabled, and P4.5 and P4.6 can be used as General Purpose I/O when CAN1 is not enabled. The default XPER selection after Reset is identical to XBUS configuration of ST10C167: XCAN1 is enabled, XCAN2 is disabled, XRAM1 (2K Byte compatible XRAM) is enabled, XRAM2 (new 8K Byte XRAM) is disabled. Register XPERCON cannot be changed after the global enabling of XPeripherals, i.e. after setting of bit XPEN in SYSCON register. In EMUlation mode, all the XPERipherals are enabled (XPERCON bit are all set). When the Real Time Clock is disabled (RTCEN = 0), the clock oscillator is switch off if ST10 enters in power-down mode. Otherwise, when the Real Time Clock is enabled, the bit RTCOFF of the RTCCON register allows to choose the power-down mode of the clock oscillator. 130/160 ST10F269 21 - ELECTRICAL CHARACTERISTICS 21.1 - Absolute Maximum Ratings Symbol VDD VIO VAREF IOV ITOV Ptot TA Tstg Parameter Voltage on VDD pins with respect to ground1 Voltage on any pin with respect to ground1 Voltage on VAREF pin with respect to ground1 Input Current on any pin during overload condition1 Absolute Sum of all input currents during overload condition1 Power Dissipation1 Ambient Temperature under bias Storage Temperature1 Value -0.5, +6.5 -0.5, (VDD +0.5) -0.3, (VDD +0.3) -10, +10 |100| 1.5 -40, +125 -65, +150 Unit V V V mA mA W C C Note: 1. Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. During overload conditions (VIN > VDD or VIN < VSS) the voltage on pins with respect to ground (VSS) must not exceed the values defined by the Absolute Maximum Ratings. 21.2 - Parameter Interpretation The parameters listed in the following tables represent the characteristics of the ST10F269 and its demands on the system. Where the ST10F269 logic provides signals with their respective timing characteristics, the symbol "CC" for Controller Characteristics, is included in the "Symbol" column. Where the external system must provide signals with their respective timing characteristics to the ST10F269, the symbol "SR" for System Requirement, is included in the "Symbol" column. 21.3 - DC Characteristics VDD = 5V 10%, VSS = 0V, fCPU = 40MHz, Reset active, TA = -40 to + 125C Symbol VIL VILS VIH VIH1 VIH2 VIHS HYS VOL VOL1 SR Input low voltage SR Input low voltage (special threshold) SR Input high voltage (all except RSTIN and XTAL1) Parameter Test Conditions - - - - - - 3 Min. -0.5 -0.5 0.2 VDD + 0.9 0.6 VDD 0.7 VDD 0.8 VDD -0.2 250 - - Max. 0.2 VDD -0.1 2.0 VDD + 0.5 VDD + 0.5 VDD + 0.5 VDD + 0.5 - 0.45 0.45 Unit V V V V V V mV V V SR Input high voltage RSTIN SR Input high voltage XTAL1 SR Input high voltage (special threshold) Input Hysteresis (special threshold) CC Output low voltage (PORT0, PORT1, Port 4, ALE, RD, WR, BHE, CLKOUT, RSTOUT) CC Output low voltage (all other outputs) - IOL = 2.4mA IOL1 = 1.6mA 1 1 131/160 ST10F269 Symbol Parameter Test Conditions IOH = -500A IOH = -2.4mA IOH = - 250A IOH = - 1.6mA 0V < VIN < VDD 0V < VIN < VDD 3/4 3 5/6 5/7 5/6 5/7 5/6 5/7 5/6 Min. 0.9 VDD 2.4 0.9 VDD 2.4 - - - Max. - - - - 200 1 5 250 -40 - - 500 -40 - -10 - 20 10 Unit VOH Output high voltage (PORT0, PORT1, Port4, 1 CC ALE, RD, WR, BHE, CLKOUT, RSTOUT) CC Output high voltage (all other outputs) 1/2 V V V nA A mA k A A A A A A A A A mA/V pF VOH1 IOZ1 CC Input leakage current (Port 5) IOZ2 CC Input leakage current (all other) IOV SR Overload current RRST IRWH IRWL IALEL IALEH IP6H IP6L IP0H PORT0 configuration current IP0L 5/7 CC RSTIN pull-up resistor Read / Write inactive current Read / Write active current ALE inactive current ALE active current Port 6 inactive current Port 6 active current - VOUT = 2.4V VOUT = VOLmax VOUT = VOLmax VOUT = 2.4V VOUT = 2.4V VOUT = VOL1max VIN = VIHmin VIN = VILmax 0V < VIN < VDD 50 - -500 40 - - -500 - -100 - 5 IIL gm CIO ICC CC XTAL1 input current On-chip oscillator transconductance CC Pin capacitance (digital inputs / outputs) 3 3/5 f = 1MHz, TA = 25C RSTIN = VIH1 fCPU in [MHz] RSTIN = VIH1 fCPU in [MHz] VDD = 5.5V TA = 25C TA = 125C - Power supply current 8 - 20 + 2.5 x fCPU mA IID Idle mode supply current 9 - 20 + fCPU 15 11 190 11 mA 10 IPD Power-down mode supply current - _ A A 10 IPD2 Power-down mode supply current (Real time clock enabled, oscillator enabled) 12 VDD = 5.5V TA = 55C fOSC = 25MHz - 2 + fOSC / 4 mA Notes: 1. ST10F269 pins are equipped with low-noise output drivers which significantly improve the device's EMI performance. These low-noise drivers deliver their maximum current only until the respective target output level is reached. After this, the output current is reduced. This results in increased impedance of the driver, which attenuates electrical noise from the connected PCB tracks. The 132/160 ST10F269 current specified in column "Test Conditions" is delivered in any cases. 2. This specification is not valid for outputs which are switched to open drain mode. In this case the respective output will float and the voltage results from the external circuitry. 3. Partially tested, guaranteed by design characterization. 4. Overload conditions occur if the standard operating conditions are exceeded, i.e. the voltage on any pin exceeds the specified range (i.e. VOV > VDD+0.5V or VOV < -0.5V). The absolute sum of input overload currents on all port pins may not exceed 50mA. The supply voltage must remain within the specified limits. 5. This specification is only valid during Reset, or during Hold-mode or Adapt-mode. Port 6 pins are only affected if they are used for CS output and if their open drain function is not enabled. 6. The maximum current may be drawn while the respective signal line remains inactive. 7. The minimum current must be drawn in order to drive the respective signal line active. 8. The power supply current is a function of the operating frequency. This dependency is illustrated in the Figure 64. These parameters are tested at VDDmax and 40MHz CPU clock with all outputs disconnected and all inputs at VIL or VIH. The chip is configured with a demultiplexed 16-bit bus, direct clock drive, 5 chip select lines and 2 segment address lines, EA pin is low during reset. After reset, PORT 0 is driven with the value `00CCh' that produces infinite execution of NOP instruction with 15 wait-states, R/ W delay, memory tristate wait state, normal ALE. Peripherals are not activated. 9. Idle mode supply current is a function of the operating frequency. This dependency is illustrated in the Figure 64. These parameters are tested at VDDmax and 40MHz CPU clock with all outputs disconnected and all inputs at VIL or VIH. 10. This parameter value includes leakage currents. With all inputs (including pins configured as inputs) at 0V to 0.1V or at VDD - 0.1V to VDD, VREF = 0V, all outputs (including pins configured as outputs) disconnected. 11. Typical IPD value is 5A @ TA=25C. and 60A @ TA=125C. 12. Partially tested, guaranted by design characterization using 22pF loading capacitors on crystal pins. Figure 64 : Supply / Idle Current as a Function of Operating Frequency ICCmax 120mA I [mA] ICCtyp 100 60mA IIDmax IIDtyp 10 0 10 20 30 40 fCPU [MHz] 133/160 ST10F269 21.3.1 - A/D Converter Characteristics VDD = 5V 10%, VSS = 0V, TA = -40 to +125C, 4.0V VAREF VDD + 0.1V; VSS0.1V VAGND VSS + 0.2V Table 32 : A/D Converter Characteristics Limit Values Symbol VAREF VAIN IAREF SR SR CC Parameter Analog Reference voltage Analog input voltage Reference supply current running mode power-down mode ADC input capacitance Not sampling Sampling Sample time Conversion time Differential Nonlinearity Integral Nonlinearity Offset Error Total unadjusted error Internal resistance of analog source Coupling Factor between inputs 1-8 7 Test Condition minimum 4.0 VAGND - - 7 Unit maximum VDD + 0.1 VAREF 500 V V A A pF pF 1 10 15 1 536 TCL 2 884 TCL +0.5 +1.5 +1.0 +2.0 (tS / 150) - 0.25 1/500 CAIN CC - - 2-4 3-4 5 5 5 5 tS tC DNL INL OFS TUE RASRC K CC CC CC CC CC CC SR CC 48 TCL 388 TCL -0.5 -1.5 -1.0 -2.0 [ns] 2-7 LSB LSB LSB LSB k tS in 6-7 - - Notes: 1. VAIN may exceed VAGND or VAREF up to the absolute maximum ratings. However, the conversion result in these cases will be X000h or X3FFh, respectively. 2. During the tS sample time the input capacitance Cain can be charged/discharged by the external source. The internal resistance of the analog source must allow the capacitance to reach its final voltage level within the tS sample time. After the end of the tS sample time, changes of the analog input voltage have no effect on the conversion result. Values for the tSC sample clock depend on the programming. Referring to the tC conversion time formula of Section 21.3.2 - on page 135 and to Table 33 on page 135: - tS min = 2 tSC min = 2 tCC min = 2 x 24 x TCL = 48 TCL - tS max = 2 tSC max = 2 x 8 tCC max = 2 x 8 x 96 TCL = 1536 TCL TCL is defined in Section 21.4.2 -, Section 21.4.4 -, and Section 21.4.5 - on page 138 : 3. The conversion time formula is: - tC = 14 tCC + tS + 4 TCL (= 14 tCC + 2 tSC + 4 TCL) The tC parameter includes the tS sample time, the time for determining the digital result and the time to load the result register with the result of the conversion. Values for the tCC conversion clock depend on the programming. Referring to Table 33 on page 135: - tC min = 14 tCC min + tS min + 4 TCL = 14 x 24 x TCL + 48 TCL + 4 TCL = 388 TCL - tC max = 14 tCC max + tS max + 4 TCL = 14 x 96 TCL + 1536 TCL + 4 TCL = 2884 TCL 4. This parameter is fixed by ADC control logic. 5. DNL, INL, TUE are tested at VAREF = 5.0V, VAGND = 0V, VCC = 4.9V. It is guaranteed by design characterization for all other voltages within the defined voltage range. `LSB' has a value of VAREF / 1024. The specified TUE is guaranteed only if an overload condition (see IOV specification) occurs on maximum 2 not selected analog input pins and the absolute sum of input overload currents on all analog input pins does not exceed 10mA. 6. The coupling factor is measured on a channel while an overload condition occurs on the adjacent not selected channel with an absolute overload current less than 10mA. 7. Partially tested, guaranteed by design characterization. 8.To remove noise and undesirable high frequency components from the analog input signal, a low-pass filter must be connected at the ADC input. The cut-off frequency of this filter should avoid 2 opposite transitions during the ts sampling time of the ST10 ADC: - fcut-off 1 / 5 ts to 1/10 ts where ts is the sampling time of the ST10 ADC and is not related to the Nyquist frequency determined by the tc conversion time. 134/160 ST10F269 21.3.2 - Conversion Timing Control When a conversion is started, first the capacitances of the converter are loaded via the respective analog input pin to the current analog input voltage. The time to load the capacitances is referred to as the sample time ts. Next the sampled voltage is converted to a digital value in 10 successive steps, which correspond to the 10-bit resolution of the ADC. The next 4 steps are used for equalizing internal levels (and are kept for exact timing matching with the 10-bit A/D converter module implemented in the ST10F168). The current that has to be drawn from the sources for sampling and changing charges depends on the time that each respective step takes, because the capacitors must reach their final voltage level within the given time, at least with a certain approximation. The maximum current, however, that a source can deliver, depends on its internal resistance. The sample time tS (= 2 tSC) and the conversion time tc (= 14 tCC + 2 tSC + 4 TCL) can be programmed relatively to the ST10F269 CPU Table 33 : ADC Sampling and Conversion Timing Conversion Clock tCC ADCTC TCL = 1/2 x fXTAL 00 01 10 11 TCL x 24 Reserved, do not use TCL x 96 TCL x 48 At fCPU = 40MHz 0.3s Reserved 1.2 s 0.6 s 00 01 10 11 ADSTC tSC = tCC tCC x 2 tCC x 4 tCC x 8 Sample Clock tSC At fCPU = 40MHz and ADCTC = 00 0.3s 0.6s 1.2s 2.4s clock. This allows adjusting the A/D converter of the ST10F269 to the properties of the system: Fast Conversion can be achieved by programming the respective times to their absolute possible minimum. This is preferable for scanning high frequency signals. The internal resistance of analog source and analog supply must be sufficiently low, however. High Internal Resistance can be achieved by programming the respective times to a higher value, or the possible maximum. This is preferable when using analog sources and supply with a high internal resistance in order to keep the current as low as possible. However the conversion rate in this case may be considerably lower. The conversion times are programmed via the upper four bit of register ADCON. Bit field ADCTC (conversion time control) selects the basic conversion clock tCC, used for the 14 steps of converting. The sample time tS is a multiple of this conversion time and is selected by bit field ADSTC (sample time control). The table below lists the possible combinations. The timings refer to the unit TCL, where fCPU = 1/2TCL. A complete conversion will take 14 tCC + 2 tSC + 4 TCL (fastest convertion rate = 4.85s at 40MHz). This time includes the conversion itself, the sample time and the time required to transfer the digital value to the result register. 135/160 ST10F269 21.4 - AC characteristics 21.4.1 - Test Waveforms Figure 65 : Input / Output Waveforms 2.4V 0.2VDD+0.9 Test Points 0.2VDD+0.9 0.45V 0.2VDD-0.1 0.2VDD-0.1 AC inputs during testing are driven at 2.4V for a logic `1' and 0.4V for a logic `0'. Timing measurements are made at V IH min for a logic `1' and VIL max for a logic `0'. Figure 66 : Float Waveforms VOH VOH -0.1V Timing Reference Points VOL +0.1V VOL VLoad +0.1V VLoad VLoad -0.1V For timing purposes a port pin is no longer floating when VLOAD changes of 100mV. It begins to float when a 100mV change from the loaded VOH/VOL level occurs (IOH/IOL = 20mA). 21.4.2 - Definition of Internal Timing The internal operation of the ST10F269 is controlled by the internal CPU clock fCPU. Both edges of the CPU clock can trigger internal (for example pipeline) or external (for example bus cycles) operations. The specification of the external timing (AC Characteristics) therefore depends on the time between two consecutive edges of the CPU clock, called "TCL". The CPU clock signal can be generated by different mechanisms. The duration of TCL and its variation (and also the derived external timing) depends on the mechanism used to generate fCPU. This influence must be regarded when calculating the timings for the ST10F269. The example for PLL operation shown in Figure 67 refers to a PLL factor of 4. 136/160 ST10F269 The mechanism used to generate the CPU clock is selected during reset by the logic levels on pins P0.15-13 (P0H.7-5). Figure 67 : Generation Mechanisms for the CPU Clock Phase locked loop operation fXTAL fCPU TCL TCL Direct Clock Drive fXTAL fCPU TCL TCL Prescaler Operation fXTAL fCPU TCL TCL 21.4.3 - Clock Generation Modes The Table 34 associates the combinations of these three bits with the respective clock generation mode. Table 34 : CPU Frequency Generation P0H.7 P0H.6 P0H.5 CPU Frequency fCPU = fXTAL x F External Clock Input Range1 1 1 1 1 0 0 0 0 1 1 0 0 1 1 0 0 1 0 1 0 1 0 1 0 fXTAL x 4 fXTAL x 3 fXTAL x 2 fXTAL x 5 fXTAL x 1 fXTAL x 1.5 fXTAL x 0.5 fXTAL x 2.5 2.5 to 10MHz 3.33 to 13.33MHz 5 to 20MHz 2 to 8MHz 1 to 40MHz 6.66 to 26.66MHz 2 to 80MHz 4 to 16MHz CPU clock via prescaler3 Direct drive2 Notes Default configuration Notes: 1. The external clock input range refers to a CPU clock range of 1...40MHz. 2. The maximum input frequency depends on the duty cycle of the external clock signal. 3. The maximum input frequency is 25MHz when using an external crystal with the internal oscillator; providing that internal serial resistance of the crystal is less than 40. However, higher frequencies can be applied with an external clock source on pin XTAL1, but in this case, the input clock signal must reach the defined levels VIL and VIH2.. 137/160 ST10F269 21.4.4 - Prescaler Operation When pins P0.15-13 (P0H.7-5) equal '001' during reset, the CPU clock is derived from the internal oscillator (input clock signal) by a 2:1 prescaler. The frequency of fCPU is half the frequency of fXTAL and the high and low time of fCPU (i.e. the duration of an individual TCL) is defined by the period of the input clock fXTAL. The timings listed in the AC Characteristics that refer to TCL therefore can be calculated using the period of fXTAL for any TCL. Note that if the bit OWDDIS in SYSCON register is cleared, the PLL runs on its free-running frequency and delivers the clock signal for the Oscillator Watchdog. If bit OWDDIS is set, then the PLL is switched off. 21.4.5 - Direct Drive When pins P0.15-13 (P0H.7-5) equal '011' during reset the on-chip phase locked loop is disabled and the CPU clock is directly driven from the internal oscillator with the input clock signal. The frequency of fCPU directly follows the frequency of fXTAL so the high and low time of fCPU (i.e. the duration of an individual TCL) is defined by the duty cycle of the input clock fXTAL. Therefore, the timings given in this chapter refer to the minimum TCL. This minimum value can be calculated by the following formula: TCL min = 1 f XTALl xlDCmin DC = duty cycle For two consecutive TCLs, the deviation caused by the duty cycle of fXTAL is compensated, so the duration of 2TCL is always 1/fXTAL. The minimum value TCLmin has to be used only once for timings that require an odd number of TCLs (1,3,...). Timings that require an even number of TCLs (2,4,...) may use the formula: 2TCL = 1 f XTAL Note: The address float timings in Multiplexed bus mode (t11 and t45) use the maximum duration of TCL (TCL max = 1/fXTAL x DCmax) instead of TCLmin. If the bit OWDDIS in SYSCON register is cleared, the PLL runs on its free-running frequency and delivers the clock signal for the Oscillator Watchdog. If bit OWDDIS is set, then the PLL is switched off. 21.4.6 - Oscillator Watchdog (OWD) An on-chip watchdog oscillator is implemented in the ST10F269. This feature is used for safety operation with external crystal oscillator (using direct drive mode with or without prescaler). This watchdog oscillator operates as following : The reset default configuration enables the watchdog oscillator. It can be disabled by setting the OWDDIS (bit 4) of SYSCON register. When the OWD is enabled, the PLL runs at its free-running frequency, and it increments the watchdog counter. The PLL free-running frequency is between 2 and 10MHz. On each transition of external clock, the watchdog counter is cleared. If an external clock failure occurs, then the watchdog counter overflows (after 16 PLL clock cycles). The CPU clock signal will be switched to the PLL free-running clock signal, and the oscillator watchdog Interrupt Request (XP3INT) is flagged. The CPU clock will not switch back to the external clock even if a valid external clock exits on XTAL1 pin. Only a hardware reset can switch the CPU clock source back to direct clock input. When the OWD is disabled, the CPU clock is always external oscillator clock and the PLL is switched off to decrease consumption supply current. 21.4.7 - Phase Locked Loop For all other combinations of pins P0.15-13 (P0H.7-5) during reset the on-chip phase locked loop is enabled and it provides the CPU clock (see Table 34). The PLL multiplies the input frequency by the factor F which is selected via the combination of pins P0.15-13 (fCPU = fXTAL x F). With every F'th transition of fXTAL the PLL circuit synchronizes the CPU clock to the input clock. This synchronization is done smoothly, so the CPU clock frequency does not change abruptly. Due to this adaptation to the input clock the frequency of fCPU is constantly adjusted so it is locked to fXTAL. The slight variation causes a jitter of fCPU which also effects the duration of individual TCLs. The timings listed in the AC Characteristics that refer to TCLs therefore must be calculated using the minimum TCL that is possible under the respective circumstances. 138/160 ST10F269 The real minimum value for TCL depends on the jitter of the PLL. The PLL tunes fCPU to keep it locked on fXTAL. The relative deviation of TCL is the maximum when it is refered to one TCL period. It decreases according to the formula and to the Figure 68 given below. For N periods of TCL the minimum value is computed using the corresponding deviation DN: TCL D N x 1 - ------------- MIN NOM 100 D = ( 4 - N 15 ) [ % ] N = TCL where N = number of consecutive TCL periods and 1 N 40. So for a period of 3 TCL periods (N = 3): D3 = 4 - 3/15 = 3.8% 3TCLmin = 3TCLNOM x (1 - 3.8/100) = 3TCLNOM x 0.962 3TCLmin = 36.075ns (at fCPU = 40MHz) This is especially important for bus cycles using wait states and e.g. for the operation of timers, serial interfaces, etc. For all slower operations and longer periods (e.g. pulse train generation or measurement, lower Baud rates, etc.) the deviation caused by the PLL jitter is negligible. Figure 68 : Approximated Maximum PLL Jitter Max.jitter [%] This approximated formula is valid for 1 N 40 and 10MHz fCPU 40MHz. 4 3 2 1 2 4 8 16 32 N 21.4.8 - External Clock Drive XTAL1 VDD = 5V 10%, VSS = 0V, TA = -40 to +125 C fCPU = fXTAL Parameter Symbol min Oscillator period High time Low time Rise time Fall time tOSC t1 t2 t3 t4 SR SR SR SR SR 25 1 10 2 10 2 - - max - - - 32 32 min 12.5 52 52 - - max - - - 32 32 fCPU = fXTAL / 2 fCPU = fXTAL x F F = 1.5/2,/2.5/3/4/5 min 40 x N 10 2 10 2 - - max 100 x N - - 32 32 ns ns ns ns ns Unit Notes: 1. Theoretical minimum. The real minimum value depends on the duty cycle of the input clock signal. 25MHz is the maximum input frequency when using an external crystal oscillator. However, 40MHz can be applied with an external clock source. 2. The input clock signal must reach the defined levels VIL and VIH2. 139/160 ST10F269 Figure 69 : External Clock Drive XTAL1 t1 t3 t4 VIH2 t2 VIL tOSC 21.4.9 - Memory Cycle Variables The tables below use three variables which are derived from the BUSCONx registers and represent the special characteristics of the programmed memory cycle. The following table describes, how these variables are to be computed. Description ALE Extension Memory Cycle Time wait states Memory Tri-state Time Symbol tA tC tF TCL x [ALECTL] 2TCL x (15 - [MCTC]) 2TCL x (1 - [MTTC]) Values 140/160 ST10F269 21.4.10 - Multiplexed Bus VDD = 5V 10%, VSS = 0V, TA = -40 to +125C, CL = 50pF, ALE cycle time = 6 TCL + 2tA + tC + tF (75ns at 40MHz CPU clock without wait states). Table 35 : Multiplexed Bus Characteristics Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns 141/160 Max. CPU Clock = 40MHz min. t5 t6 t7 t8 t9 t10 t11 t12 t13 t14 t15 t16 t17 t18 t19 t22 t23 t25 t27 t38 t39 t40 CC CC CC CC CC CC CC CC CC SR SR SR SR ALE high time Address setup to ALE Address hold after ALE ALE falling edge to RD, WR (with RW-delay) ALE falling edge to RD, WR (no RW-delay) Address float after RD, WR (with RW-delay) Address float after RD, WR (no RW-delay) RD, WR low time (with RW-delay) RD, WR low time (no RW-delay) RD to valid data in (with RW-delay) RD to valid data in (no RW-delay) ALE low to valid data in Address/Unlatched CS to valid data in Data hold after RD rising edge Data float after RD Data valid to WR Data hold after WR ALE rising edge after RD, WR Address/Unlatched CS hold after RD, WR ALE falling edge to Latched CS Latched CS low to Valid Data In 1 1 1 Symbol Parameter Variable CPU Clock 1/2 TCL = 1 to 40MHz min. TCL - 8.5 + tA TCL - 10.5 + tA TCL - 8.5 + tA TCL - 8.5 + tA -8.5 + tA - - 2 TCL -9.5 + tC 3 TCL -9.5 + tC - - - - max. - - - - - 6 TCL + 6 - - 2 TCL - 19 + tC 3 TCL - 19 + tC 3 TCL - 19 + tA + tC 4 TCL - 28 + 2tA + tC - 2 TCL - 8.5 + tF - - - - 10 - tA 3 TCL - 19 + tC + 2tA - max. - - - - - 6 18.5 - - 6 + tC 18.5 + tC 18.5 + tA + tC 22 + 2tA + tC - 16.5 + tF - - - - 10 - tA 18.5 + tC + 2tA - 4 + tA 2 + tA 4 + tA 4 + tA -8.5 + tA - - 1 15.5 + tC 28 + tC - - - - SR SR CC CC CC CC CC SR 0 - 10 + tC 4 + tF 15 + tF 10 + tF -4 - tA - 0 - 2 TCL -15 + tC 2 TCL - 8.5 + tF 2 TCL -10 + tF 2 TCL -15 + tF -4 - tA - CC Latched CS hold after RD, WR 27 + tF 3 TCL - 10.5 + tF ST10F269 Table 35 : Multiplexed Bus Characteristics Unit ns ns ns ns ns ns ns ns ns ns ns ns ns Max. CPU Clock = 40MHz min. t42 t43 t44 t45 t46 t47 t48 t49 t50 t51 t52 t54 t56 CC CC CC CC SR SR CC CC CC SR SR CC CC ALE fall. edge to RdCS, WrCS (with RW delay) ALE fall. edge to RdCS, WrCS (no RW delay) Address float after RdCS, WrCS (with RW delay) Address float after RdCS, WrCS (no RW delay) RdCS to Valid Data In (with RW delay) RdCS to Valid Data In (no RW delay) RdCS, WrCS Low Time (with RW delay) RdCS, WrCS Low Time (no RW delay) Data valid to WrCS Data hold after RdCS Data float after RdCS Address hold after RdCS, WrCS Data hold after WrCS 1 1 Symbol Parameter Variable CPU Clock 1/2 TCL = 1 to 40MHz min. TCL - 5.5+ tA -5.5 + tA - - - - 2 TCL - 9.5 + tC 3 TCL - 9.5 + tC 2 TCL - 15+ tC 0 - 2 TCL - 19 + tF 2 TCL - 19 + tF max. - - 0 TCL 2 TCL - 21 + tC 3 TCL - 21 + tC - - - - 2 TCL - 8.5+tF - - max. - - 0 12.5 4 + tC 16.5 + tC - - - - 16.5 + tF - - 7 + tA -5.5 + tA - - 1 - - 15.5 + tC 28 + tC 10 + tC 0 - 6 + tF 6 + tF Note: 1. Partially tested, guaranted by design characterization. 142/160 ST10F269 Figure 70 : External Memory Cycle : Multiplexed Bus, With / Without Read / Write Delay, Normal ALE CLKOUT t5 ALE t16 t25 t6 t38 t17 t40 t39 t27 CSx t6 A23-A16 (A15-A8) BHE t17 Address t27 t16 Read Cycle Address/Data Bus (P0) t6m Address t7 t18 Data In Address t8 RD t10 t14 t12 t19 t13 t9 t11 t15 Address Write Cycle Address/Data Bus (P0) t23 Data Out t8 WR WRL WRH t22 t12 t13 t9 143/160 ST10F269 Figure 71 : External Memory Cycle: Multiplexed Mus, With / Without Read / Write Delay, Extended ALE CLKOUT t5 ALE t16 t25 t6 t38 t17 t39 t27 t40 CSx t6 A23-A16 (A15-A8) BHE t17 Address t27 Read Cycle Address/Data Bus (P0) t6 Address t7 Data In t8 t9 RD t10 t11 t14 t15 t12 t13 t18 t19 Write Cycle Address/Data Bus (P0) Address Data Out t23 t8 t9 WR WRL WRH t10 t11 t22 t13 t12 144/160 ST10F269 Figure 72 : External Memory Cycle: Multiplexed Bus, With / Without Read / Write Delay, Normal ALE, Read / Write Chip Select CLKOUT t5 ALE t16 t25 t6 A23-A16 (A15-A8) BHE t17 Address t27 t16 Read Cycle Address/Data Bus (P0) t6 Address t7 t51 Data In Address t42 RdCSx t44 t46 t48 t52 t49 t43 Write Cycle Address/Data Bus (P0) t45 t47 t56 Data Out Address t42 WrCSx t50 t48 t49 t43 145/160 ST10F269 Figure 73 : External Memory Cycle: Multiplexed Bus, With / Without Read / Write Delay, Extended ALE, Read / Write Chip Select CLKOUT t5 ALE t16 t25 t6 A23-A16 (A15-A8) BHE t17 Address t54 Read Cycle Address/Data Bus (P0) t6 Address t7 Data In t42 t43 RdCSx t44 t45 t46 t48 t47 t49 t18 t19 Write Cycle Address/Data Bus (P0) Address Data Out t42 t43 WrCSx t44 t45 t50 t56 t48 t49 146/160 ST10F269 21.4.11 - Demultiplexed Bus VDD = 5V 10%, VSS = 0V, TA = -40 to +125C, CL = 50pF, ALE cycle time = 4 TCL + 2tA + tC + tF (50ns at 40MHz CPU clock without wait states). Table 36 : Demultiplexed Bus Characteristics Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns 147/160 Maximum CPU Clock = 40MHz Minimum t5 t6 t80 CC CC CC ALE high time Address setup to ALE Address/Unlatched CS setup to RD, WR (with RW-delay) Address/Unlatched CS setup to RD, WR (no RW-delay) RD, WR low time (with RW-delay) RD, WR low time (no RW-delay) RD to valid data in (with RW-delay) RD to valid data in (no RW-delay) ALE low to valid data in Address/Unlatched CS to valid data in Data hold after RD rising edge Data float after RD rising edge 13 (with RW-delay) Data float after RD rising edge 13 (no RW-delay) Data valid to WR Data hold after WR ALE rising edge after RD, WR Address/Unlatched CS hold after RD, WR Address/Unlatched CS hold after WRH t38 t39 CC SR ALE falling edge to Latched CS Latched CS low to Valid Data In -4 - tA - 6 - tA 18.5 + tC + 2tA -4 - tA - 6 - tA 3 TCL - 19 + tC + 2tA 2 Symbol Parameter Variable CPU Clock 1/2 TCL = 1 to 40MHz Minimum TCL - 8.5 + tA TCL - 10.5 + tA 2 TCL - 8.5 + 2tA Maximum - - - Maximum - - - 4 + tA 2 + tA 16.5 + 2t A t81 CC 4 + 2tA - TCL - 8.5 + 2tA - t12 t13 t14 t15 t16 t17 t18 t20 t21 t22 t24 t26 t28 CC CC SR SR SR SR SR SR SR CC CC CC CC 15.5 + tC 28 + tC - - - - 0 - - 10 + tC 4 + tF -10 + tF 0 (no tF) -5 + tF (tF > 0) -5 + tF - - 6 + tC 18.5 + tC 18.5 + tA + tC 22 + 2tA + tC - 16.5 + tF 4 + tF - - - - 2 TCL - 9.5 + tC 3 TCL - 9.5 + tC - - - - 0 - - 2 TCL - 15 + tC TCL - 8.5 + tF -10 + tF 0 (no tF) -5 + tF (tF > 0) -5 + tF - - 2 TCL - 19 + tC 3 TCL - 19 + tC 3 TCL - 19 + tA + tC 4 TCL - 28 + 2tA + tC - 2 TCL - 8.5 + tF + 2tA 1 TCL - 8.5 + tF + 2tA 1 - - - - t28h CC - - ST10F269 Table 36 : Demultiplexed Bus Characteristics Unit ns ns ns ns ns ns ns ns ns ns ns ns ns Maximum CPU Clock = 40MHz Minimum t41 t82 t83 t46 t47 t48 t49 t50 t51 t53 t68 t55 t57 CC CC CC SR SR CC CC CC SR SR SR Latched CS hold after RD, WR Address setup to RdCS, WrCS (with RW-delay) Address setup to RdCS, WrCS (no RW-delay) RdCS to Valid Data In (with RW-delay) RdCS to Valid Data In (no RW-delay) RdCS, WrCS Low Time (with RW-delay) RdCS, WrCS Low Time (no RW-delay) Data valid to WrCS Data hold after RdCS Data float after RdCS (with RW-delay) Data float after RdCS (no RW-delay) Address hold after RdCS, WrCS Data hold after WrCS 3 Symbol Parameter Variable CPU Clock 1/2 TCL = 1 to 40MHz Minimum TCL - 10.5 + tF 2 TCL - 10.5 + 2tA TCL - 10.5 + 2tA - - 2 TCL - 9.5 + tC 3 TCL - 9.5 + tC 2 TCL - 15 + tC 0 - - Maximum - - - 2 TCL - 21 + tC 3 TCL - 21 + tC - - - - 2 TCL - 8.5 + tF TCL - 8.5 + tF - - Maximum - - - 4 + tC 16.5 + tC - - - - 16.5 + tF 4 + tF - - 2 + tF 14.5 + 2t A 2 + 2tA - - 15.5 + tC 28 + tC 10 + tC 0 - - 3 CC CC -8.5 + tF 2 + tF -8.5 + tF TCL - 10.5 + tF Notes: 1. RW-delay and tA refer to the next following bus cycle. 2. Read data are latched with the same clock edge that triggers the address change and the rising RD edge. Therefore address changes before the end of RD have no impact on read cycles. 3. Partially tested, guaranteed by design characterization. 148/160 ST10F269 Figure 74 : External Memory Cycle: Demultiplexed Bus, With / Without Read / Write Delay, Normal ALE CLKOUT t5 ALE t16 t26 t6 t38 CSx t17 t39 t41 t41u 1) t6 A23-A16 A15-A0 (P1) BHE t17 Address t28 (or t28h) Read Cycle Data Bus (P0) (D15-D8) D7-D0 t18 Data In t80 t81 RD t14 t15 t21 t20 t12 t13 Write Cycle Data Bus (P0) (D15-D8) D7-D0 Data Out t80 t81 WR WRL WRH t22 t24 t12 t13 Note: 1. Un-latched CSx = t41u = t41 TCL =10.5 + tF. 149/160 ST10F269 Figure 75 : External Memory Cycle: Demultiplexed Bus, With / Without Read / Write Delay, Extended ALE CLKOUT t5 ALE t16 t26 t6 t38 t17 t39 CSx t41 t28 t6 A23-A16 A15-A0 (P1) BHE t17 Address t28 Read Cycle Data Bus (P0) (D15-D8) D7-D0 t18 Data In t80 t81 RD t14 t15 t21 t20 t12 t13 Write Cycle Data Bus (P0) (D15-D8) D7-D0 Data Out t80 t81 WR WRL WRH t22 t24 t12 t13 150/160 ST10F269 Figure 76 : External Memory Cycle: Demultiplexed Bus, With / Without Read / Write Delay, Normal ALE, Read / Write Chip Select CLKOUT t5 ALE t16 t26 t6 A23-A16 A15-A0 (P1) BHE t17 Address t55 Read Cycle Data Bus (P0) (D15-D8) D7-D0 t51 Data In t82 t83 RdCSx t46 t47 t53 t68 t48 t49 Write Cycle Data Bus (P0) (D15-D8) D7-D0 Data Out t82 t83 WrCSx t50 t57 t48 t49 151/160 ST10F269 Figure 77 : External Memory Cycle: Demultiplexed Bus, no Read / Write Delay, Extended ALE, Read / Write Chip Select CLKOUT t5 ALE t16 t26 t6 A23-A16 A15-A0 (P1) BHE t17 Address t55 Read Cycle Data Bus (P0) (D15-D8) D7-D0 t51 Data In t82 t83 t47 t46 t68 t53 RdCSx t48 t49 Write Cycle Data Bus (P0) (D15-D8) D7-D0 Data Out t82 t83 WrCSx t50 t57 t48 t49 152/160 ST10F269 21.4.12 - CLKOUT and READY VDD = 5V 10%, VSS = 0V, TA = -40 to + 125C, CL = 50pF Table 37 : CLKOUT and READY Characteristics Unit ns ns ns ns ns ns ns ns ns ns ns ns 153/160 Maximum CPU Clock = 40 MHz Minimum t29 t30 t31 t32 t33 t34 t35 t36 t37 t58 t59 t60 CC CC CC CC CC CC SR SR SR SR CLKOUT cycle time CLKOUT high time CLKOUT low time CLKOUT rise time CLKOUT fall time CLKOUT rising edge to ALE falling edge Synchronous READY setup time to CLKOUT Synchronous READY hold time after CLKOUT Asynchronous READY low time Asynchronous READY setup time Asynchronous READY hold time 1) Symbol Parameter Variable CPU Clock 1/2TCL = 1 to 40 MHz Minimum 2TCL TCL - 8.5 TCL - 9.5 - - -2 + tA 12.5 2 2TCL + 10 12.5 Maximum 2TCL - - 4 4 8 + tA - - - - Maximum 25 - - 4 4 8 + tA - - - - 25 4 3 - - -2 + tA 12.5 2 35 12.5 SR 2 1) - 2 - SR Async. READY hold time after RD, WR high (Demultiplexed 2) Bus) 0 0 + 2tA + tC + tF 2) 0 TCL - 12.5 + 2tA + tC + tF 2) Notes: 1. These timings are given for test purposes only, in order to assure recognition at a specific clock edge. 2. Demultiplexed bus is the worst case. For multiplexed bus 2TCL are to be added to the maximum values. This adds even more time for deactivating READY. The 2tA and tC refer to the next following bus cycle, tF refers to the current bus cycle. ST10F269 Figure 78 : CLKOUT and READY Running cycle 1) READY wait state MUX / Tri-state 6) CLKOUT t32 t30 t34 t33 t31 t29 ALE 7) RD, WR 2) Synchronous READY Asynchronous READY t35 3) t36 t35 3) t36 t58 3) t59 t58 3) t59 t60 4) t37 5) 6) Notes: 1. Cycle as programmed, including MCTC wait states (Example shows 0 MCTC WS). 2. The leading edge of the respective command depends on RW-delay. 3. READY sampled HIGH at this sampling point generates a READY controlled wait state, READY sampled LOW at this sampling point terminates the currently running bus cycle. 4. READY may be deactivated in response to the trailing (rising) edge of the corresponding command (RD or WR). 5. If the Asynchronous READY signal does not fulfill the indicated setup and hold times with respect to CLKOUT (e.g. because CLKOUT is not enabled), it must fulfill t37 in order to be safely synchronized. This is guaranteed, if READY is removed in response to the command (see Note 4)). 6. Multiplexed bus modes have a MUX wait state added after a bus cycle, and an additional MTTC wait state may be inserted here. For a multiplexed bus with MTTC wait state this delay is 2 CLKOUT cycles, for a demultiplexed bus without MTTC wait state this delay is zero. 7. The next external bus cycle may start here. 154/160 ST10F269 21.4.13 - External Bus Arbitration VDD = 5V 10%, VSS = 0V, TA = -40 to +125C, CL = 50pF Unit ns ns ns ns ns ns ns 155/160 Maximum CPU Clock = 40 MHz Minimum t61 t62 t63 t64 t65 t66 t67 SR CC CC CC CC CC CC Symbol Parameter Variable CPU Clock 1/2TCL = 1 to 40 MHz Minimum 15 - - - -4 - -4 Maximum - 12.5 12.5 15 15 15 15 Maximum - 12.5 12.5 15 15 15 15 HOLD input setup time to CLKOUT CLKOUT to HLDA high or BREQ low delay CLKOUT to HLDA low or BREQ high delay CSx release CSx drive Other signals release Other signals drive 1 1 15 - - - -4 - -4 Note: 1. Partially tested, guaranteed by design characterization. Figure 79 : External Bus Arbitration (Releasing the Bus) CLKOUT t61 HOLD t63 HLDA 1) t62 BREQ 2) t64 CSx (P6.x) 1) 3) t66 Others Notes: 1. The ST10F269 will complete the currently running bus cycle before granting bus access. 2. This is the first possibility for BREQ to become active. 3. The CS outputs will be resistive high (pull-up) after t64. ST10F269 Figure 80 : External Bus Arbitration (Regaining the Bus) 2) CLKOUT t61 HOLD t62 HLDA t62 BREQ t62 1) t63 t65 CSx (On P6.x) t67 Other Signals Notes: 1. This is the last chance for BREQ to trigger the indicated regain-sequence. Even if BREQ is activated earlier, the regain-sequence is initiated by HOLD going high. Please note that HOLD may also be disactivated without the ST10F269 requesting the bus. 2. The next ST10F269 driven bus cycle may start here. 156/160 ST10F269 21.4.14 - High-Speed Synchronous Serial Interface (SSC) Timing 21.4.14.1 Master Mode VCC = 5V 10%, VSS = 0V, CPU clock = 40MHz, TA = -40 to +125C, CL = 50pF Symbol Parameter Maximum Baud rate = 10M Baud Variable Baud rate ( t300 t301 t302 t303 t304 t305 t306 t307p t308p t307 t308 CC SSC clock cycle time CC SSC clock high time CC SSC clock low time CC SSC clock rise time CC SSC clock fall time CC Write data valid after shift edge CC Write data hold after shift edge 1 SR Read data setup time before latch edge, phase error detection on (SSCPEN = 1) SR Read data hold time after latch edge, phase error detection on (SSCPEN = 1) SR Read data setup time before latch edge, phase error detection off (SSCPEN = 0) SR Read data hold time after latch edge, phase error detection off (SSCPEN = 0) t300/2 - 10 t300/2 - 10 - - - -2 2TCL+12.5 50 - 4TCL - ns 25 - 2TCL - ns 0 - 0 - ns Note: 1. Timing guaranteed by design. The formula for SSC Clock Cycle time is : t300 = 4 TCL * ( 1) t300 t301 t302 2) SCLK t305 MTSR 1st Out Bit t304 t305 2nd Out Bit t303 t306 t305 Last Out Bit t307 t308 MRST 1st.In Bit 2nd.In Bit t307 t308 Last.In Bit Notes: 1. The phase and polarity of shift and latch edge of SCLK is programmable. This figure uses the leading clock edge as shift edge (drawn in bold), with latch on trailing edge (SSCPH = 0b), Idle clock line is low, leading clock edge is low-to-high transition (SSCPO = 0b). 2. The bit timing is repeated for all bits to be transmitted or received. 157/160 ST10F269 21.4.14.2 Slave mode VCC = 5V 10%, VSS = 0V, CPU clock = 40MHz, TA = -40 to +125C, CL = 50pF Maximum Baud rate=10MBd ( Symbol Parameter Unit t310 t311 t312 t313 t314 t315 t316 t317p t318p1 t317 t318 SR SSC clock cycle time SR SSC clock high time SR SSC clock low time SR SSC clock rise time SR SSC clock fall time CC Write data valid after shift edge CC Write data hold after shift edge SR Read data setup time before latch edge, phase error detection on (SSCPEN = 1) SR Read data hold time after latch edge, phase error detection on (SSCPEN = 1) SR Read data setup time before latch edge, phase error detection off (SSCPEN = 0) SR Read data hold time after latch edge, phase error detection off (SSCPEN = 0) 100 40 40 - - - 0 62 87 6 31 t310/2 - 10 t310/2 - 10 - - - 0 4TCL + 12 6TCL + 12 6 2TCL + 6 The formula for SSC Clock Cycle time is: t310 = 4 TCL * ( 1) t310 t311 t312 2) SCLK t314 t315 MRST 1st Out Bit t313 t316 2nd Out Bit t315 t315 Last Out Bit t317 t318 MTSR 1st.In Bit 2nd.In Bit t317 t318 Last.In Bit Notes: 1. The phase and polarity of shift and latch edge of SCLK is programmable. This figure uses the leading clock edge as shift edge (drawn in bold), with latch on trailing edge (SSCPH = 0b), Idle clock line is low, leading clock edge is low-to-high transition (SSCPO = 0b). 2. The bit timing is repeated for all bits to be transmitted or received. 158/160 ST10F269 22 - PACKAGE MECHANICAL DATA Figure 83 : Package Outline PQFP144 (28 x 28mm) A A2 144 e A1 109 0,10 mm .004 inch SEATING PLANE 108 B 36 73 E3 E1 E 37 D3 D1 D 72 c 1 L1 Millimeters 1 Dimensions Minimum A A1 A2 B c D D1 D3 e E E1 L L1 K 30.95 27.90 0.65 0.25 3.17 0.22 0.13 30.95 27.90 31.20 28.00 22.75 0.65 31.20 28.00 0.80 1.60 0 (Minimum), 7 (Maximum) 31.45 28.10 0.95 1.219 1.098 0.026 3.42 3.67 0.38 0.23 31.45 28.10 Typical Maximum 4.07 0.010 0.125 0.009 0.005 1.219 1.098 Minimum L K Inches (approx) Typical Maximum 0.160 0.133 0.144 0.015 0.009 1.228 1.102 0.896 0.026 1.228 1.102 0.031 0.063 1.238 1.106 0.037 1.238 1.106 Note: 1. Package dimensions are in mm. The dimensions quoted in inches are rounded. 23 - ORDERING INFORMATION Salestype ST10F269-Q3 Temperature range -40C to +125C Package PQFP144 (28 x 28 mm) 159/160 ST10F269 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics (c) 2002 STMicroelectronics All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco Singapore - Spain - Sweden - Switzerland - United Kingdom - United States http://www.st.com F269-Q3.REF 160/160 |
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